NONVOLATILE MEMORY AND FABRICATION METHOD THEREOF
    1.
    发明申请
    NONVOLATILE MEMORY AND FABRICATION METHOD THEREOF 有权
    非易失性存储器及其制造方法

    公开(公告)号:US20110059592A1

    公开(公告)日:2011-03-10

    申请号:US12943487

    申请日:2010-11-10

    IPC分类号: H01L21/02

    摘要: Non-volatile memories formed on a substrate and fabrication methods are disclosed. A bottom electrode comprising a metal layer is disposed on the substrate. A buffer layer comprising a LaNiO3 film is disposed over the metal layer. A resistor layer comprising a SrZrO3 film is disposed on the buffer layer. A top electrode is disposed on the resistor layer.

    摘要翻译: 公开了在基板上形成的非易失性存储器和制造方法。 包含金属层的底部电极设置在基板上。 包含LaNiO3膜的缓冲层设置在金属层上。 包含SrZrO 3膜的电阻层设置在缓冲层上。 顶电极设置在电阻层上。

    METHOD FOR FABRICATING A RESISTOR FOR A RESISTANCE RANDOM ACCESS MEMORY
    2.
    发明申请
    METHOD FOR FABRICATING A RESISTOR FOR A RESISTANCE RANDOM ACCESS MEMORY 有权
    用于制造电阻随机存取存储器的电阻器的方法

    公开(公告)号:US20110171811A1

    公开(公告)日:2011-07-14

    申请号:US12793833

    申请日:2010-06-04

    IPC分类号: H01L45/00

    摘要: A method for fabricating a resistor for a resistance random access memory (RRAM) includes: (a) forming a first electrode over a substrate; (b) forming a variable resistance layer of zirconium oxide on the first electrode under a working temperature, which ranges from 175° C. to 225° C.; and (c) forming a second electrode of Ti on the variable resistance layer.

    摘要翻译: 一种制造用于电阻随机存取存储器(RRAM)的电阻器的方法包括:(a)在衬底上形成第一电极; (b)在175℃至225℃的工作温度下在第一电极上形成氧化锆可变电阻层; 和(c)在可变电阻层上形成Ti的第二电极。

    NON-VOLATILE MEMORY
    3.
    发明申请
    NON-VOLATILE MEMORY 有权
    非易失性存储器

    公开(公告)号:US20120267596A1

    公开(公告)日:2012-10-25

    申请号:US13089880

    申请日:2011-04-19

    IPC分类号: H01L47/00

    摘要: An exemplary embodiment of a non-volatile memory includes a bottom conductive layer, a resistive switching layer, an oxygen vacancy barrier layer and an upper conductive layer. The resistive switching layer is disposed on the bottom conductive layer. The oxygen vacancy barrier layer is disposed on the resistive switching layer. The upper conductive layer is disposed on the oxygen vacancy barrier layer.

    摘要翻译: 非易失性存储器的示例性实施例包括底部导电层,电阻开关层,氧空位阻挡层和上导电层。 电阻开关层设置在底部导电层上。 氧空位阻挡层设置在电阻式开关层上。 上导电层设置在氧空位阻挡层上。