公开(公告)号：US08197606B2

公开(公告)日：2012-06-12

申请号：US12707098

申请日：2010-02-17

申请人： Tsukasa Watanabe ,  Naoki Shindo ,  Hiroki Ohno ,  Kenji Sekiguchi

发明人： Tsukasa Watanabe ,  Naoki Shindo ,  Hiroki Ohno ,  Kenji Sekiguchi

IPC分类号： B08B7/02

CPC分类号： H01L21/67051 ,  B24C7/0046 ,  H01L21/02057 ,  Y10S134/902

摘要： Disclosed is a substrate cleaning method for prevent damage to a pattern formed on a substrate. The substrate cleaning method includes cleaning the substrate by striking cleaning particulates carried in a flow of dry air or inert gas against a surface of the substrate, and removing the cleaning particulates.

摘要翻译： 公开了一种用于防止对在基板上形成的图案的损坏的基板清洗方法。 基板清洗方法包括通过将干燥空气或惰性气体中携带的清洁微粒冲击到基板的表面上并清除清洁颗粒来清洁基板。

公开(公告)号：US08449684B2

公开(公告)日：2013-05-28

申请号：US11783748

申请日：2007-04-11

申请人： Tsukasa Watanabe ,  Naoki Shindo

发明人： Tsukasa Watanabe ,  Naoki Shindo

IPC分类号： B08B7/00 ,  B08B7/04 ,  B08B3/00

CPC分类号： H01L21/67057 ,  B08B3/048 ,  B08B3/12

摘要： The present invention provides a substrate cleaning method capable of removing particles from the entire surface of a substrate to be processed at a high removing efficiency. In the substrate cleaning method according to the present invention, a substrate to be processed W is immersed in a cleaning liquid in a cleaning tank 12. Then, ultrasonic waves are generated in the cleaning liquid contained in the cleaning tank 12, so that the substrate W is subjected to an ultrasonic cleaning process. The step of generating ultrasonic waves includes a step of generating ultrasonic waves in the cleaning tank while the cleaning liquid is being supplied into the cleaning tank. A supply rate at which the cleaning liquid is supplied into the cleaning tank at a certain timing in the step of generating ultrasonic waves differs from a supply rate at which the cleaning liquid is supplied into the cleaning tank at another timing in the step of generating ultrasonic waves.

摘要翻译： 本发明提供一种能够以高去除效率从待处理基板的整个表面去除颗粒的基板清洗方法。 在本发明的基板清洗方法中，将待处理基板W浸入清洗槽12内的清洗液中。然后，在包含在清洗槽12内的清洗液中产生超声波，使基板 W进行超声波清洗处理。 产生超声波的步骤包括在将清洁液供给到清洗槽中时在清洗槽中产生超声波的步骤。 在产生超声波的步骤中的某个时刻将清洗液供给到清洗槽中的供给速度与在生成超声波的步骤中的另一定时将清洗液供给到清洗槽中的供给速度不同 波浪。

公开(公告)号：US20070240736A1

公开(公告)日：2007-10-18

申请号：US11783748

申请日：2007-04-11

申请人： Tsukasa Watanabe ,  Naoki Shindo

发明人： Tsukasa Watanabe ,  Naoki Shindo

IPC分类号： B08B7/04 ,  B08B3/00 ,  B08B3/12

CPC分类号： H01L21/67057 ,  B08B3/048 ,  B08B3/12

摘要： The present invention provides a substrate cleaning method capable of removing particles from the entire surface of a substrate to be processed at a high removing efficiency. In the substrate cleaning method according to the present invention, a substrate to be processed W is immersed in a cleaning liquid in a cleaning tank 12. Then, ultrasonic waves are generated in the cleaning liquid contained in the cleaning tank 12, so that the substrate W is subjected to an ultrasonic cleaning process. The step of generating ultrasonic waves includes a step of generating ultrasonic waves in the cleaning tank while the cleaning liquid is being supplied into the cleaning tank. A supply rate at which the cleaning liquid is supplied into the cleaning tank at a certain timing in the step of generating ultrasonic waves differs from a supply rate at which the cleaning liquid is supplied into the cleaning tank at another timing in the step of generating ultrasonic waves.

摘要翻译： 本发明提供一种能够以高去除效率从待处理基板的整个表面去除颗粒的基板清洗方法。 在本发明的基板清洗方法中，将被处理基板W浸渍在清洗槽12内的清洗液中。 然后，在包含在清洗槽12中的清洗液中产生超声波，从而对基板W进行超声波清洗处理。 产生超声波的步骤包括在将清洁液供给到清洗槽中时在清洗槽中产生超声波的步骤。 在产生超声波的步骤中的某个时刻将清洗液供给到清洗槽中的供给速度与在生成超声波的步骤中的另一定时将清洗液供给到清洗槽中的供给速度不同 波浪。

公开(公告)号：US08347901B2

公开(公告)日：2013-01-08

申请号：US11717170

申请日：2007-03-13

申请人： Tsukasa Watanabe ,  Naoki Shindo ,  Takahiro Furukawa ,  Yuji Kamikawa

发明人： Tsukasa Watanabe ,  Naoki Shindo ,  Takahiro Furukawa ,  Yuji Kamikawa

IPC分类号： B08B3/12

CPC分类号： B08B3/12 ,  B01F15/00207 ,  B01F15/0022 ,  B01F15/0429 ,  B08B3/00 ,  C11D11/0047 ,  H01L21/67057

摘要： The present invention provides a substrate cleaning method capable of removing particles from the entire surface of a substrate to be processed at a high removing efficiency. In the substrate cleaning method according to the present invention, a substrate to be processed W is immersed in a cleaning liquid in a cleaning tank 12. Then, ultrasonic waves are generated in the cleaning liquid contained in the cleaning tank 12, so that the substrate to be processed W is subjected to an ultrasonic cleaning process. While the substrate to be processed is being cleaned, a dissolved gas concentration of a gas dissolved in the cleaning liquid contained in the cleaning tank is changed.

摘要翻译： 本发明提供一种能够以高去除效率从待处理基板的整个表面去除颗粒的基板清洗方法。 在本发明的基板清洗方法中，将待处理基板W浸入清洗槽12内的清洗液中。然后，在包含在清洗槽12内的清洗液中产生超声波，使基板 待处理的W进行超声波清洗处理。 当被处理基板被清洗时，溶解在清洗槽中所含的清洗液中的溶解气体浓度变化。

公开(公告)号：US20070215172A1

公开(公告)日：2007-09-20

申请号：US11717170

申请日：2007-03-13

申请人： Tsukasa Watanabe ,  Naoki Shindo ,  Takahiro Furukawa ,  Yuji Kamikawa

发明人： Tsukasa Watanabe ,  Naoki Shindo ,  Takahiro Furukawa ,  Yuji Kamikawa

IPC分类号： B08B3/12 ,  B08B3/00

CPC分类号： B08B3/12 ,  B01F15/00207 ,  B01F15/0022 ,  B01F15/0429 ,  B08B3/00 ,  C11D11/0047 ,  H01L21/67057

摘要： The present invention provides a substrate cleaning method capable of removing particles from the entire surface of a substrate to be processed at a high removing efficiency. In the substrate cleaning method according to the present invention, a substrate to be processed W is immersed in a cleaning liquid in a cleaning tank 12. Then, ultrasonic waves are generated in the cleaning liquid contained in the cleaning tank 12, so that the substrate to be processed W is subjected to an ultrasonic cleaning process. While the substrate to be processed is being cleaned, a dissolved gas concentration of a gas dissolved in the cleaning liquid contained in the cleaning tank is changed.

摘要翻译： 本发明提供一种能够以高去除效率从待处理基板的整个表面去除颗粒的基板清洗方法。 在本发明的基板清洗方法中，将被处理基板W浸渍在清洗槽12内的清洗液中。 然后，在包含在清洗槽12中的清洗液中产生超声波，使待处理基板W进行超声波清洗处理。 当被处理基板被清洗时，溶解在清洗槽中所含的清洗液中的溶解气体浓度变化。

公开(公告)号：US20080308120A1

公开(公告)日：2008-12-18

申请号：US12213011

申请日：2008-06-12

申请人： Tsukasa Watanabe ,  Naoki Shindo ,  Kazuyoshi Eshima

发明人： Tsukasa Watanabe ,  Naoki Shindo ,  Kazuyoshi Eshima

IPC分类号： B08B3/12 ,  B08B13/00

CPC分类号： H01L21/67057

摘要： The present invention provides a substrate cleaning method capable of reducing non-uniformity of a removal efficiency of particles between lots with a simple procedure. The substrate cleaning method comprises: a step of supplying a gas into a cleaning tank, while an irradiation of ultrasonic waves to the cleaning liquid in the cleaning tank is being stopped, so as to increase a dissolved gas concentration of the gas dissolved in the cleaning liquid in the cleaning tank to a saturated concentration; and a step of irradiating ultrasonic waves to the cleaning liquid in the cleaning tank so as to clean a substrate immersed in the cleaning liquid in the cleaning tank. In the step of increasing the dissolved gas concentration to the saturated concentration, the gas is supplied to the cleaning tank so as to increase the dissolved gas concentration of the cleaning liquid in the cleaning tank to the saturated concentration. In addition, in the step of increasing the dissolved gas concentration to the saturated concentration, the irradiation of the ultrasonic waves to the cleaning liquid in the cleaning tank is stopped.

摘要翻译： 本发明提供一种能够以简单的方法降低批次之间的颗粒去除效率的不均匀性的基板清洗方法。 基板清洗方法包括：在停止向清洗槽中的清洗液体照射超声波的同时向清洗槽供给气体的步骤，以增加溶解在清洗液中的气体的溶解气体浓度 清洗液中的液体达到饱和浓度; 以及向清洗槽内的清洗液照射超声波以清洗浸在清洗槽内的清洗液中的基板的工序。 在将溶解气体浓度提高到饱和浓度的步骤中，将气体供给至清洗槽，以将清洗槽内的清洗液的溶解气体浓度提高至饱和浓度。 此外，在将溶解气体浓度提高到饱和浓度的步骤中，超声波向清洗槽内的清洗液的照射停止。

公开(公告)号：US20070267040A1

公开(公告)日：2007-11-22

申请号：US11798599

申请日：2007-05-15

申请人： Tsukasa Watanabe ,  Naoki Shindo ,  Koukichi Hiroshiro ,  Yuji Kamikawa

发明人： Tsukasa Watanabe ,  Naoki Shindo ,  Koukichi Hiroshiro ,  Yuji Kamikawa

IPC分类号： B08B3/12

CPC分类号： H01L21/67057 ,  H01L21/67051

摘要： A substrate cleaning method can uniformly removing particles from substrates at a high removing efficiency. The substrate cleaning method includes the steps of immersing substrates W in a cleaning liquid in a cleaning tank 12, and generating ultrasonic waves in the cleaning liquid contained in the cleaning tank. A region in the cleaning tank toward which the cleaning liquid is supplied is varied with respect to a vertical level in the step of generating ultrasonic waves in the cleaning liquid while the cleaning liquid is being supplied into the cleaning tank.

摘要翻译： 基板清洗方法可以以高的去除效率从基板中均匀地除去颗粒。 基板清洗方法包括将清洗液中的基板W浸渍在清洗槽12中的步骤，在清洗槽内所含的清洗液中产生超声波。 在将清洗液供给到清洗槽中时，在清洗槽中供给清洗液的区域相对于在清洗液中产生超声波的步骤中的垂直高度变化。

公开(公告)号：US08152928B2

公开(公告)日：2012-04-10

申请号：US11798599

申请日：2007-05-15

申请人： Tsukasa Watanabe ,  Naoki Shindo ,  Koukichi Hiroshiro ,  Yuji Kamikawa

发明人： Tsukasa Watanabe ,  Naoki Shindo ,  Koukichi Hiroshiro ,  Yuji Kamikawa

IPC分类号： B08B6/00 ,  B08B7/00 ,  B08B7/02 ,  B08B3/12 ,  H01L21/304

CPC分类号： H01L21/67057 ,  H01L21/67051

摘要： A substrate cleaning method can uniformly removing particles from substrates at a high removing efficiency. The substrate cleaning method includes the steps of immersing substrates W in a cleaning liquid in a cleaning tank 12, and generating ultrasonic waves in the cleaning liquid contained in the cleaning tank. A region in the cleaning tank toward which the cleaning liquid is supplied is varied with respect to a vertical level in the step of generating ultrasonic waves in the cleaning liquid while the cleaning liquid is being supplied into the cleaning tank.

摘要翻译： 基板清洗方法可以以高的去除效率从基板中均匀地除去颗粒。 基板清洗方法包括将清洗液中的基板W浸渍在清洗槽12中的步骤，在清洗槽内所含的清洗液中产生超声波。 在将清洗液供给到清洗槽中时，在清洗槽中供给清洗液的区域相对于在清洗液中产生超声波的步骤中的垂直高度变化。

公开(公告)号：US08083857B2

公开(公告)日：2011-12-27

申请号：US12213011

申请日：2008-06-12

申请人： Tsukasa Watanabe ,  Naoki Shindo ,  Kazuyoshi Eshima

发明人： Tsukasa Watanabe ,  Naoki Shindo ,  Kazuyoshi Eshima

IPC分类号： B08B3/12

CPC分类号： H01L21/67057

摘要： The present invention provides a substrate cleaning method capable of reducing non-uniformity of a removal efficiency of particles between lots with a simple procedure. The substrate cleaning method comprises: a step of supplying a gas into a cleaning tank, while an irradiation of ultrasonic waves to the cleaning liquid in the cleaning tank is being stopped, so as to increase a dissolved gas concentration of the gas dissolved in the cleaning liquid in the cleaning tank to a saturated concentration; and a step of irradiating ultrasonic waves to the cleaning liquid in the cleaning tank so as to clean a substrate immersed in the cleaning liquid in the cleaning tank. In the step of increasing the dissolved gas concentration to the saturated concentration, the gas is supplied to the cleaning tank so as to increase the dissolved gas concentration of the cleaning liquid in the cleaning tank to the saturated concentration. In addition, in the step of increasing the dissolved gas concentration to the saturated concentration, the irradiation of the ultrasonic waves to the cleaning liquid in the cleaning tank is stopped.

摘要翻译： 本发明提供一种能够以简单的方法降低批次之间的颗粒去除效率的不均匀性的基板清洗方法。 基板清洗方法包括：在停止向清洗槽中的清洗液体照射超声波的同时向清洗槽供给气体的步骤，以增加溶解在清洗液中的气体的溶解气体浓度 清洗液中的液体达到饱和浓度; 以及向清洗槽内的清洗液照射超声波以清洗浸在清洗槽内的清洗液中的基板的工序。 在将溶解气体浓度提高到饱和浓度的步骤中，将气体供给至清洗槽，以将清洗槽内的清洗液的溶解气体浓度提高至饱和浓度。 此外，在将溶解气体浓度提高到饱和浓度的步骤中，超声波向清洗槽内的清洗液的照射停止。

公开(公告)号：US20130180659A1

公开(公告)日：2013-07-18

申请号：US13823205

申请日：2012-08-01

申请人： Norihiro Itoh ,  Kazuhiro Aiura ,  Naoki Shindo ,  Yosuke Hachiya

发明人： Norihiro Itoh ,  Kazuhiro Aiura ,  Naoki Shindo ,  Yosuke Hachiya

IPC分类号： H01L21/02 ,  H01L21/465

CPC分类号： H01L21/02041 ,  H01L21/465 ,  H01L21/67051 ,  H01L21/6719 ,  H01L21/68785 ,  H01L21/68792

摘要： A liquid treatment apparatus includes a substrate holder (21) that holds a substrate horizontally and rotates the substrate, a treatment liquid nozzle (82) that supplies a treatment liquid to the substrate held by the substrate holder, a cup (40) that is arranged outside of a peripheral edge of the substrate held by the substrate holder and receives the treatment liquid which has been supplied to the substrate by the treatment liquid nozzle, a top plate (32) that covers the substrate held by the substrate holder from above, a top plate rotation driving mechanism that rotates the top plate, and a liquid receiving member (130) that surrounds a peripheral edge of the top plate and has a circular liquid receiving space (132).

摘要翻译： 液体处理装置包括：水平地保持基板并旋转基板的基板保持件（21），将处理液体供给到由基板保持件保持的基板的处理液喷嘴（82），布置 在由基板保持器保持的基板的周缘的外侧，接收由处理液喷嘴供给到基板的处理液，从上方覆盖基板保持体的基板的顶板（32）， 旋转顶板的顶板旋转驱动机构和围绕顶板的周缘的液体接收构件（130），并具有圆形的液体容纳空间（132）。