摘要:
The invention provides a camera module and a method for fabricating the same. A camera module includes an image sensor device chip having a plurality of solder balls on a bottom surface thereof. An optical lens is disposed on the image sensor device chip. A metal plate has a part that extending over the bottom surface of the image sensor device. A metal coating layer surrounds vertical surfaces of the optical lens and a top surface of the part of the metal plate. A first light shielding layer covers vertical surfaces of the metal coating layer.
摘要:
The invention provides a camera module and a method for fabricating the same. A camera module includes an image sensor device chip having a plurality of solder balls on a bottom surface thereof. An optical lens is disposed on the image sensor device chip. A metal plate has a part that extending over the bottom surface of the image sensor device. A metal coating layer surrounds vertical surfaces of the optical lens and a top surface of the part of the metal plate. A first light shielding layer covers vertical surfaces of the metal coating layer.
摘要:
A method for forming an image sensing device is disclosed, including providing a molding apparatus, disposing a lens in the molding apparatus, injecting an injection material into a chamber of the molding apparatus to form a shell which is connected to the lens, opening the chamber of the molding apparatus to remove the lens and the shell connected to the lens, and assembling the shell with an image sensing element.
摘要:
An industrial computer casing comprises a seat; a front frame at a front side of the seat and formed with a frame hole and a long hole at an upper side of the frame hole; a door plate covering upon a front end of the front frame; the door plate having a plurality of via holes; a tray installed with a data processing unit; the tray passing through the long hole and running across the frame supporter and the supporting plate so as to be positioned at an upper front side of the casing; and a back plate at a backside of the seat; a mother board installed on the seat and in an open space between the frame supporter and the back plate; and an upper cover covering upon the seat.
摘要:
An electronic assembly for an image sensing device is disclosed, comprising an image sensing element, a lens set comprising a feet enclosing a cavity to receive the image sensing element and an opaque conductive layer disposed on at least a portion of a top side, a sidewall and a bottom side of the lens set, wherein the opaque conductive layer is electrically connected to a grounding layer to reduce electromagnetic interference (EMI) to the image sensing element.
摘要:
The present invention relates to metallocene-based phosphine ligands having chirality at phosphorus and at least one other element of chirality (planar chirality and/or chirality at carbon); and to the use of such ligands in asymmetric transformation reactions to generate high enantiomeric excesses of formed compounds. A method for the preparation of ligands according to the invention involving the conversion of the ortho-lithiated substituted metallocene to a phosphine chiral at phosphorus is also disclosed.
摘要:
An electronic assembly for an image sensing device is disclosed, comprising an image sensing element, a lens set comprising a feet enclosing a cavity to receive the image sensing element and an opaque conductive layer disposed on at least a portion of a top side, a sidewall and a bottom side of the lens set, wherein the opaque conductive layer is electrically connected to a grounding layer to reduce electromagnetic interference (EMI) to the image sensing element.
摘要:
In a swappable data access unit rack structure installable in a computer casing, a chassis is a box body composed of a lower casing, a front frame, a rear panel and an upper casing. The front frame has a frame hole, a transversal long hole at its upper edge, and a frame at the rear of the front frame. An upper distal surface of the frame is of the same height with a lower edge of the long hole of the front frame. A rack panel is fixed at the upper edge of the inner side of the lower casing. The long hole, the upper distal surface of the frame and the rack panel define a horizontal bay and a tray for carrying a data access unit. The tray is slidably slid into the bay and mounted across the upper distal surface of the frame and the rack panel.
摘要:
Image capture lens modules and wafer level packaged image capture devices are presented. The image capture lens module includes a compound lens with a first lens element and a second lens element molded on both sides of a substrate, and a field stop disposed at an interface between the first lens element and the substrate or at an interface between the second lens element and the substrate, wherein the field stop is a coating layer with a polygonal transparent area.
摘要:
The invention provides a compact camera module and a method for fabricating the same. A compact camera module includes an image sensor device package. A back spacer ring is disposed on the image sensor device package. A first edge of the back spacer ring is aligned to a second edge of the image sensor device package. An optical lens plate disposed over the back spacer ring. A front spacer ring is sandwiched between the back spacer ring and the optical lens plate. A third edge of the front spacer ring is aligned to a fourth edge of the optical lens plate.