摘要:
Image capture lens modules and wafer level packaged image capture devices are presented. The image capture lens module includes a compound lens with a first lens element and a second lens element molded on both sides of a substrate, and a field stop disposed at an interface between the first lens element and the substrate or at an interface between the second lens element and the substrate, wherein the field stop is a coating layer with a polygonal transparent area.
摘要:
An electronic assembly for an image sensing device is disclosed, comprising an image sensing element, a lens set comprising a feet enclosing a cavity to receive the image sensing element and an opaque conductive layer disposed on at least a portion of a top side, a sidewall and a bottom side of the lens set, wherein the opaque conductive layer is electrically connected to a grounding layer to reduce electromagnetic interference (EMI) to the image sensing element.
摘要:
An electronic assembly for an image sensing device is disclosed, comprising an image sensing element, a lens set comprising a feet enclosing a cavity to receive the image sensing element and an opaque conductive layer disposed on at least a portion of a top side, a sidewall and a bottom side of the lens set, wherein the opaque conductive layer is electrically connected to a grounding layer to reduce electromagnetic interference (EMI) to the image sensing element.
摘要:
The invention provides a compact camera module and a method for fabricating the same. A compact camera module includes an image sensor device package. A back spacer ring is disposed on the image sensor device package. A first edge of the back spacer ring is aligned to a second edge of the image sensor device package. An optical lens plate disposed over the back spacer ring. A front spacer ring is sandwiched between the back spacer ring and the optical lens plate. A third edge of the front spacer ring is aligned to a fourth edge of the optical lens plate.
摘要:
A method for forming an image sensing device is disclosed, including providing a molding apparatus, disposing a lens in the molding apparatus, injecting an injection material into a chamber of the molding apparatus to form a shell which is connected to the lens, opening the chamber of the molding apparatus to remove the lens and the shell connected to the lens, and assembling the shell with an image sensing element.
摘要:
A method for forming an image sensing device is disclosed, including providing a molding apparatus, disposing a lens in the molding apparatus, injecting an injection material into a chamber of the molding apparatus to form a shell which is connected to the lens, opening the chamber of the molding apparatus to remove the lens and the shell connected to the lens, and assembling the shell with an image sensing element.
摘要:
An apparatus includes an image sensor having N image sensor regions arranged thereon. A lens array having a including N lens structures is disposed proximate to the image sensor. Each one of the N lens structures is arranged to focus a single image onto a respective one of the N image sensor regions. The N lens structures include a first lens structure having a first focal length and positioned the first focal length away from the respective one of the N image sensor regions. A second lens structure having a second focal length is positioned the second focal length away from the respective one of the N image sensor regions. A third lens structure having a third focal length is positioned the third focal length away from the respective one of the N image sensor regions. The first, second and third focal lengths are different.
摘要:
An optical element and image capture lens structure. The optical element includes a substrate and an optical component with at least one effective area and non-effective area, formed on the substrate, wherein the non-effective area has a rough surface. The image capture lens structure includes a substrate, an optical component formed on the substrate, and a spacer with a micro structure, attached to the substrate by an adhesive, wherein the micro structure is located between the adhesive and the optical component to prevent the overflow of the adhesive.
摘要:
Image capture lens modules and image capture systems are presented. An image capture lens module includes a first compound lens with a first lens element, a second lens element, and a third lens element arranged in sequence from an object side to an image side. A second compound lens includes a fourth lens element, a fourth lens element, and a fifth lens element arranged in sequence from an object side to an image side. A curvature radius of the first lens element is positive, a curvature radius of the third lens element is negative, a curvature radius of the fourth lens element is negative, and a curvature radius of the sixth lens element is negative. An abbe number of the first lens element exceeds 55 and an abbe number of the third lens element is less than 30.
摘要:
A MEMS oscillating laser scanning unit (LSU) composed of a MEMS Control Module, a Pre-scan Module and a Post-scan Module is disclosed. The MEMS Control Module consists of a laser source and a MEMS oscillating mirror. The laser source and the MEMS oscillating mirror both are aligned with the same side, opposite to target surface so that laser beam emits from the side of the target surface, reverses by a reflection mirror of the Pre-scan Module and then moves along a plane formed by a central axis as well as an oscillatory rotary axis of the MEMS oscillating mirror, enters center of the MEMS oscillatory mirror. Thus, scanning spots on the target surface are all symmetrical to the central axis. Thus effective area of the MEMS oscillating mirror is reduced and further reduce the cost as well as improve scanning efficiency. Moreover, design of the fθ Lens is simpler and the volume of the LSU is reduced.