公开(公告)号：US20160376697A1

公开(公告)日：2016-12-29

申请号：US14648226

申请日：2014-01-28

Applicant: ULVAC, Inc.

Inventor： Tetsushi Fujinaga ,  Masahiro Matsumoto ,  Makoto Arai ,  Eriko Mase ,  Harunori Iwai ,  Koji Takahashi ,  Atsuhito Ihori

IPC: C23C14/54 ,  H01J37/34 ,  C23C14/56 ,  C23C14/34 ,  H01J37/32 ,  C23C14/50

CPC classification number: C23C14/541 ,  C23C14/345 ,  C23C14/50 ,  C23C14/568 ,  H01J37/32009 ,  H01J37/3244 ,  H01J37/32697 ,  H01J37/32715 ,  H01J37/32724 ,  H01J37/34 ,  H01J37/3464 ,  H01J37/3497 ,  H01L21/67109 ,  H01L21/6838

Abstract: A thin substrate processing device includes a substrate processing unit configured to process a thin substrate, and a cooling unit configured to cool the thin substrate when the substrate processing unit is processing the thin substrate.

Abstract translation: 薄基板处理装置包括被配置为处理薄基板的基板处理单元和被配置为当基板处理单元正在处理薄基板时冷却薄基板的冷却单元。

公开(公告)号：US10370757B2

公开(公告)日：2019-08-06

申请号：US14648226

申请日：2014-01-28

Applicant: ULVAC, Inc.

Inventor： Tetsushi Fujinaga ,  Masahiro Matsumoto ,  Makoto Arai ,  Eriko Mase ,  Harunori Iwai ,  Koji Takahashi ,  Atsuhito Ihori

IPC: H01J37/34 ,  C23C14/54 ,  C23C14/50 ,  H01L21/67 ,  H01L21/683 ,  C23C14/56 ,  C23C14/34 ,  H01J37/32

Abstract: A thin substrate processing device include a substrate processing unit configured to process a thin substrate, and a cooling unit configured to cool the thin substrate when the substrate processing unit is processing the thin substrate.