公开(公告)号：US20240266393A1

公开(公告)日：2024-08-08

申请号：US18119797

申请日：2023-03-09

Applicant: UNITED MICROELECTRONICS CORP.

Inventor： CHUNYUAN QI ,  XINGXING CHEN ,  ZHUONA MA ,  HUI LIU

IPC: H01L29/06 ,  H01L21/308 ,  H01L27/12 ,  H01L29/16

CPC classification number: H01L29/0657 ,  H01L21/3086 ,  H01L27/1203 ,  H01L29/1604

Abstract: A metasurface structure includes a substrate having a first region and a second region not overlapping with the first region; a first pillar element within the first region on the substrate; and a second pillar element within the second region on the substrate. The first pillar element has a first sectional profile and the second pillar element has a second sectional profile that is different from the first sectional profile. At least one of the first sectional profile and the second sectional profile is of a non-rectangular shape.