公开(公告)号：US20150108587A1

公开(公告)日：2015-04-23

申请号：US14057095

申请日：2013-10-18

Applicant: UNITED MICROELECTRONICS CORP.

Inventor： Wei-Chih Chen ,  Chung-Hsien Tsai ,  Tung-Ming Chen ,  Chih-Sheng Chang ,  Jun-Chi Huang ,  Chih-Jen Lin ,  Yu-Hsiang Lin

IPC: H01L29/78 ,  H01L29/423 ,  H01L29/66

CPC classification number: H01L21/28052 ,  H01L21/2652 ,  H01L21/28114 ,  H01L29/42372 ,  H01L29/665 ,  H01L29/6656 ,  H01L29/6659 ,  H01L29/7843 ,  H01L29/7847

Abstract: A semiconductor structure and a method for forming the same are provided. The method includes following steps. A gate electrode layer is formed on a substrate. A spacer structure is formed on a sidewall of the gate electrode layer. A dielectric cap film is formed to cover the gate electrode layer and the spacer structure. A source/drain implantation is performed to the substrate with the dielectric cap film exposed to a condition of the source/drain implantation.

Abstract translation: 提供半导体结构及其形成方法。 该方法包括以下步骤。 在基板上形成栅极电极层。 间隔结构形成在栅电极层的侧壁上。 形成介电盖膜以覆盖栅电极层和间隔结构。 在介质盖膜暴露于源极/漏极注入的条件下，对衬底进行源极/漏极注入。

公开(公告)号：US09355848B2

公开(公告)日：2016-05-31

申请号：US14057095

申请日：2013-10-18

Applicant: UNITED MICROELECTRONICS CORP.

Inventor： Wei-Chih Chen ,  Chung-Hsien Tsai ,  Tung-Ming Chen ,  Chih-Sheng Chang ,  Jun-Chi Huang ,  Chih-Jen Lin ,  Yu-Hsiang Lin

IPC: H01L21/336 ,  H01L21/28 ,  H01L29/423 ,  H01L21/265 ,  H01L29/66 ,  H01L29/78

CPC classification number: H01L21/28052 ,  H01L21/2652 ,  H01L21/28114 ,  H01L29/42372 ,  H01L29/665 ,  H01L29/6656 ,  H01L29/6659 ,  H01L29/7843 ,  H01L29/7847

Abstract: A semiconductor structure and a method for forming the same are provided. The method includes following steps. A gate electrode layer is formed on a substrate. A spacer structure is formed on a sidewall of the gate electrode layer. A dielectric cap film is formed to cover the gate electrode layer and the spacer structure. A source/drain implantation is performed to the substrate with the dielectric cap film exposed to a condition of the source/drain implantation.

Abstract translation: 提供半导体结构及其形成方法。 该方法包括以下步骤。 在基板上形成栅极电极层。 间隔结构形成在栅电极层的侧壁上。 形成介电盖膜以覆盖栅电极层和间隔结构。 在介质盖膜暴露于源极/漏极注入的条件下，对衬底进行源极/漏极注入。