公开(公告)号：US12103845B2

公开(公告)日：2024-10-01

申请号：US17075737

申请日：2020-10-21

Applicant: UNITED MICROELECTRONICS CORP.

Inventor： Jung-Hao Chang ,  Weng-Yi Chen

IPC: B81C1/00 ,  B81B7/00 ,  H04R7/06 ,  H04R19/04 ,  H04R31/00

CPC classification number: B81C1/00801 ,  B81B7/0025 ,  H04R7/06 ,  H04R19/04 ,  H04R31/003 ,  B81B2201/0257 ,  B81B2203/0127 ,  B81B2203/0353 ,  H04R2201/003

Abstract: A micro electromechanical system (MEMS) includes a substrate, a semiconductor device and a protection wall. The substrate has a surface. The semiconductor device is disposed on the surface. The protection wall has a poly-silicon layer surrounding the semiconductor device and connecting to the surface.

公开(公告)号：US10737932B2

公开(公告)日：2020-08-11

申请号：US16284735

申请日：2019-02-25

Applicant: UNITED MICROELECTRONICS CORP.

Inventor： Yuan-Sheng Lin ,  Jung-Hao Chang ,  Chang-Sheng Hsu ,  Weng-Yi Chen

IPC: B81B7/00 ,  B81C1/00

Abstract: A MEMS structure includes a substrate, a dielectric layer, a membrane, a backplate, and a blocking layer. The substrate has a through-hole. The dielectric layer is disposed on the substrate and has a cavity in communication with the through-hole. The membrane has at least one vent hole, is embedded in the dielectric layer and together with the dielectric layer defines a first chamber that communicates with the through-hole. The backplate is disposed on the dielectric layer. One end of the blocking layer is embedded in the dielectric layer, and the other end of the blocking layer extends into the cavity; the blocking layer is spatially isolated from the membrane and at least partially overlaps with the at least one vent hole.

公开(公告)号：US20230406692A1

公开(公告)日：2023-12-21

申请号：US17878924

申请日：2022-08-02

Applicant: UNITED MICROELECTRONICS CORP.

Inventor： Jung-Hao Chang ,  Weng-Yi Chen

IPC: B81B3/00 ,  B81C1/00

CPC classification number: B81B3/0021 ,  B81C1/00158 ,  B81B2201/0257 ,  B81B2203/0127 ,  B81B2203/0315 ,  B81C2201/0132 ,  B81C2201/0156 ,  B81C2201/0176

Abstract: A microelectromechanical system (MEMS) microphone includes a substrate, a membrane supported relative to the substrate, an opening extending through the entire thickness of the membrane, and a spacer disposed on the sidewall of the opening. The spacer protrudes beyond the top surface of the membrane.