公开(公告)号：US20230238262A1

公开(公告)日：2023-07-27

申请号：US17695299

申请日：2022-03-15

Applicant: UNITED MICROELECTRONICS CORP.

Inventor： Hsiao-Ying YANG ,  Ching-Pei LIN ,  Chung-Yi CHIU ,  Ming-Wei CHEN ,  Te-Hsuan CHEN ,  Chia-Wei CHEN ,  Wen-Shan HUANG

IPC: H01L21/67 ,  G06N20/00

CPC classification number: H01L21/67276 ,  G06N20/00

Abstract: A semiconductor manufacturing process prediction method and a semiconductor manufacturing process prediction device are provided. The semiconductor manufacturing process prediction method includes the following steps. A plurality of process data are obtained. According to the process data, a machine learning model is used to execute prediction and obtain a prediction confidence and a prediction yield. Whether the prediction confidence is lower than a predetermined level is determined. If the prediction confidence is lower than the predetermined level, the machine learning model is modified. According to the process data, the prediction yield is adjusted.