公开(公告)号：US20230236553A1

公开(公告)日：2023-07-27

申请号：US17695255

申请日：2022-03-15

Applicant: UNITED MICROELECTRONICS CORP.

Inventor： Chia-Wei CHEN ,  Ching-Pei LIN ,  Chung-Yi CHIU ,  Te-Hsuan CHEN ,  Ming-Wei CHEN ,  Hsiao-Ying YANG

IPC: G05B13/04 ,  H01L21/66

CPC classification number: G05B13/048 ,  H01L22/14 ,  H01L22/12

Abstract: A training method of a semiconductor process prediction model, a semiconductor process prediction device, and a semiconductor process prediction method are provided. The training method of the semiconductor process prediction model includes the following steps. The semiconductor process was performed on several samples. A plurality of process data of the samples are obtained. A plurality of electrical measurement data of the samples are obtained. Some of the samples having physical defects are filtered out according to the process data. The semiconductor process prediction model is trained according to the process data and the electrical measurement data of the filtered samples.

公开(公告)号：US20230238262A1

公开(公告)日：2023-07-27

申请号：US17695299

申请日：2022-03-15

Applicant: UNITED MICROELECTRONICS CORP.

Inventor： Hsiao-Ying YANG ,  Ching-Pei LIN ,  Chung-Yi CHIU ,  Ming-Wei CHEN ,  Te-Hsuan CHEN ,  Chia-Wei CHEN ,  Wen-Shan HUANG

IPC: H01L21/67 ,  G06N20/00

CPC classification number: H01L21/67276 ,  G06N20/00

Abstract: A semiconductor manufacturing process prediction method and a semiconductor manufacturing process prediction device are provided. The semiconductor manufacturing process prediction method includes the following steps. A plurality of process data are obtained. According to the process data, a machine learning model is used to execute prediction and obtain a prediction confidence and a prediction yield. Whether the prediction confidence is lower than a predetermined level is determined. If the prediction confidence is lower than the predetermined level, the machine learning model is modified. According to the process data, the prediction yield is adjusted.