公开(公告)号：US11753500B2

公开(公告)日：2023-09-12

申请号：US17426228

申请日：2020-01-21

Applicant: UNITIKA LTD.

Inventor： Ayumi Yanaka ,  Yumeto Fukubayashi ,  Takatoshi Murakami

IPC: C08G59/40 ,  C08G59/42 ,  C08L63/00 ,  C08J5/24 ,  B32B27/38 ,  C08G59/02 ,  C08G59/22 ,  C08G59/32 ,  C08J5/04

CPC classification number: C08G59/4042 ,  C08G59/022 ,  C08G59/22 ,  C08G59/32 ,  C08G59/4238 ,  C08J5/04 ,  C08J5/249 ,  C08L63/00 ,  C08J2367/00 ,  C08L2201/08 ,  C08L2203/20

Abstract: The present invention provides an epoxy resin solution, from which an epoxy resin-cured product adequately excellent in heat-resisting properties and dielectric properties can be obtained with adequately good working properties ensured. The present invention relates to an epoxy resin solution containing at least a curing agent and an epoxy resin mixed in an organic solvent, wherein the curing agent comprises an imide group-containing curing agent having 1-4 imide groups and 2-4 glycidyl group-reactive functional groups in a molecule.