公开(公告)号：US20220056229A1

公开(公告)日：2022-02-24

申请号：US17428781

申请日：2020-02-19

Applicant: UNITIKA LTD.

Inventor： Takashi Okabe ,  Nobuyasu Okumura ,  Masafumi Yamamoto ,  Kumi Ashihara ,  Midori Shimomura ,  Yoshimi Ueno

IPC: C08J7/04 ,  C08J5/18 ,  C08L77/06 ,  G02B1/14

Abstract: A laminated film having a resin layer laminated on at least one surface of a base film. The laminated film is characterized by: the base film being a semi-aromatic polyamide film that has been at least uniaxially stretched; the resin layer having a thickness of 0.03 to 0.5 μm; and the close adhesion between the base film and the resin layer, according to the cross-cut method described in JIS K 5600, being 95% or more.

公开(公告)号：US09849653B2

公开(公告)日：2017-12-26

申请号：US14652311

申请日：2014-01-09

Applicant: UNITIKA LTD.

Inventor： Goro Araki ,  Nobuyasu Okumura ,  Yoshimi Ueno

IPC: B32B27/36 ,  B32B27/08 ,  B32B27/32 ,  B32B7/06 ,  B32B7/12 ,  B32B27/30 ,  B05D1/28 ,  B05D3/02 ,  B05D3/12 ,  C08J7/04

CPC classification number: B32B27/08 ,  B05D1/28 ,  B05D3/0272 ,  B05D3/12 ,  B32B7/06 ,  B32B7/12 ,  B32B27/306 ,  B32B27/32 ,  B32B27/36 ,  B32B2307/748 ,  B32B2405/00 ,  C08J7/047 ,  C08J2367/02 ,  C08J2423/26 ,  Y10T428/31797

Abstract: The present invention provides a mold release film including a resin layer provided on one surface of a polyester film, wherein the resin layer includes 100 parts by mass of a polypropylene-based modified polyolefin resin with the proportion of a modifying component of 1 to 10% by mass and 1 to 50 parts by mass of a cross-linking agent; the peel strength between the resin layer and a pressure-sensitive adhesive measured by bonding a rubber-based pressure-sensitive adhesive to the resin layer exceeds 3.0 N/cm; and the residual adhesion rate of a pressure-sensitive adhesive after bonding an acrylic pressure-sensitive adhesive to the resin layer is 80% or more.

公开(公告)号：US20150367610A1

公开(公告)日：2015-12-24

申请号：US14652311

申请日：2014-01-09

Applicant: UNITIKA LTD.

Inventor： Goro Araki ,  Nobuyasu Okumura ,  Yoshimi Ueno

IPC: B32B27/08 ,  B05D3/12 ,  B05D1/28 ,  B05D3/02 ,  B32B27/36 ,  B32B27/32

CPC classification number: B32B27/08 ,  B05D1/28 ,  B05D3/0272 ,  B05D3/12 ,  B32B7/06 ,  B32B7/12 ,  B32B27/306 ,  B32B27/32 ,  B32B27/36 ,  B32B2307/748 ,  B32B2405/00 ,  C08J7/047 ,  C08J2367/02 ,  C08J2423/26 ,  Y10T428/31797

Abstract: The present invention provides a mold release film including a resin layer provided on one surface of a polyester film, wherein the resin layer includes 100 parts by mass of a polypropylene-based modified polyolefin resin with the proportion of a modifying component of 1 to 10% by mass and 1 to 50 parts by mass of a cross-linking agent; the peel strength between the resin layer and a pressure-sensitive adhesive measured by bonding a rubber-based pressure-sensitive adhesive to the resin layer exceeds 3.0 N/cm; and the residual adhesion rate of a pressure-sensitive adhesive after bonding an acrylic pressure-sensitive adhesive to the resin layer is 80% or more.

Abstract translation: 本发明提供了一种脱模膜，其包括设置在聚酯膜的一个表面上的树脂层，其中，树脂层包含100质量份的改性成分的比例为1〜10质量％的聚丙烯系改性聚烯烃树脂， 和1〜50质量份的交联剂; 通过将橡胶系粘合剂与树脂层接合而测定的树脂层与压敏粘合剂之间的剥离强度超过3.0N / cm; 并且在将丙烯酸类压敏粘合剂粘合到树脂层上之后的粘合剂的残留附着率为80％以上。