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公开(公告)号：US11637271B2
公开(公告)日：2023-04-25
申请号：US17084684
申请日：2020-10-30
Applicant: Universal Display Corporation
Inventor： Ruiqing Ma , Jeffrey Silvernail , Prashant Mandlik , Julia J. Brown , John Felts
Abstract: A method of forming microelectronic systems on a flexible substrate includes depositing a plurality of layers on one side of the flexible substrate. Each of the plurality of layers is deposited from one of a plurality of sources. A vertical projection of a perimeter of each one of the plurality of sources does not intersect the flexible substrate. The flexible substrate is in motion during the depositing the plurality of layers via a roll to roll feed and retrieval system.
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公开(公告)号：US10862074B2
公开(公告)日：2020-12-08
申请号：US15459044
申请日：2017-03-15
Applicant: UNIVERSAL DISPLAY CORPORATION
Inventor： Ruiqing Ma , Jeff Silvernail , Prashant Mandlik , Julia J. Brown , John Felts
Abstract: A method of forming microelectronic systems on a flexible substrate includes depositing a plurality of layers on one side of the flexible substrate. Each of the plurality of layers is deposited from one of a plurality of sources. A vertical projection of a perimeter of each one of the plurality of sources does not intersect the flexible substrate. The flexible substrate is in motion during the depositing the plurality of layers via a roll to roll feed and retrieval system.
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公开(公告)号：US20160133838A1
公开(公告)日：2016-05-12
申请号：US14996600
申请日：2016-01-15
Applicant: Universal Display Corporation
Inventor： Ruiqing Ma , Jeffrey Silvernail , Prashant Mandlik , Julia J. Brown , John Felts
CPC classification number: H01L51/001 , C23C14/562 , C23C14/568 , H01L51/0021 , H01L51/0085 , H01L51/0097 , H01L51/50 , H01L51/5253 , H01L2251/5338 , H01L2251/56
Abstract: A method of forming microelectronic systems on a flexible substrate includes depositing (typically sequentially) on a first side of the flexible substrate at least one organic thin film layer, at least one electrode and at least one thin film encapsulation layer over the at least one organic thin film layer and the at least one electrode, wherein depositing the at least one organic thin film layer, depositing the at least one electrode and depositing the at least one thin film encapsulation layer each occur under vacuum and wherein no physical contact of the at least one organic thin film layer or the at least one electrode with another solid material occurs prior to depositing the at least one thin film encapsulation layer.
Abstract translation: 在柔性衬底上形成微电子系统的方法包括在柔性衬底的第一侧上沉积（通常顺序地）至少一个有机薄膜层，至少一个电极和至少一个有机薄膜封装层上的至少一个薄膜封装层 薄膜层和所述至少一个电极，其中沉积所述至少一个有机薄膜层，沉积所述至少一个电极并沉积所述至少一个薄膜封装层，每个都在真空下进行，并且其中至少一个 一个有机薄膜层或至少一个具有另一固体材料的电极在沉积至少一个薄膜封装层之前发生。
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Patent Agency Ranking
公开(公告)号：US20140166990A1
公开(公告)日：2014-06-19
申请号：US13716448
申请日：2012-12-17
Applicant: UNIVERSAL DISPLAY CORPORATION
Inventor： Ruiqing Ma , Jeff Silvernail , Prashant Mandlik , Julia J. Brown , John Felts
CPC classification number: H01L51/56 , H01L51/001 , H01L51/0021 , H01L51/0029 , H01L51/0097 , H01L51/5212 , H01L2251/5338 , H01L2251/568 , Y02E10/549 , Y02P70/521
Abstract: A method of forming microelectronic systems on a flexible substrate includes depositing a plurality of layers on one side of the flexible substrate. Each of the plurality of layers is deposited from one of a plurality of sources. A vertical projection of a perimeter of each one of the plurality of sources does not intersect the flexible substrate. The flexible substrate is in motion during the depositing the plurality of layers via a roll to roll feed and retrieval system.
Abstract translation: 在柔性基板上形成微电子系统的方法包括在柔性基板的一侧上沉积多个层。 多个层中的每一个从多个源中的一个源沉积。 多个源中的每一个的周边的垂直投影不与柔性基板相交。 柔性基板在通过辊到辊进给和取出系统沉积多个层期间运动。
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公开(公告)号：US20210074957A1
公开(公告)日：2021-03-11
申请号：US17084684
申请日：2020-10-30
Applicant: Universal Display Corporation
Inventor： Ruiqing Ma , Jeffrey Silvernail , Prashant Mandlik , Julia J. Brown , John Felts
Abstract: A method of forming microelectronic systems on a flexible substrate includes depositing a plurality of layers on one side of the flexible substrate. Each of the plurality of layers is deposited from one of a plurality of sources. A vertical projection of a perimeter of each one of the plurality of sources does not intersect the flexible substrate. The flexible substrate is in motion during the depositing the plurality of layers via a roll to roll feed and retrieval system.
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公开(公告)号：US20140166989A1
公开(公告)日：2014-06-19
申请号：US13716435
申请日：2012-12-17
Applicant: UNIVERSAL DISPLAY CORPORATION
Inventor： Ruiqing Ma , Jeff Silvernail , Prashant Mandlik , Julia J. Brown , John Felts
CPC classification number: H01L51/001 , C23C14/562 , C23C14/568 , H01L51/0021 , H01L51/0085 , H01L51/0097 , H01L51/50 , H01L51/5253 , H01L2251/5338 , H01L2251/56
Abstract: A method of forming microelectronic systems on a flexible substrate includes depositing (typically sequentially) on a first side of the flexible substrate at least one organic thin film layer, at least one electrode and at least one thin film encapsulation layer over the at least one organic thin film layer and the at least one electrode, wherein depositing the at least one organic thin film layer, depositing the at least one electrode and depositing the at least one thin film encapsulation layer each occur under vacuum and wherein no physical contact of the at least one organic thin film layer or the at least one electrode with another solid material occurs prior to depositing the at least one thin film encapsulation layer.
Abstract translation: 在柔性衬底上形成微电子系统的方法包括在柔性衬底的第一侧上沉积（通常顺序地）至少一个有机薄膜层，至少一个电极和至少一个有机薄膜封装层上的至少一个薄膜封装层 薄膜层和所述至少一个电极，其中沉积所述至少一个有机薄膜层，沉积所述至少一个电极并沉积所述至少一个薄膜封装层，每个都在真空下进行，并且其中至少一个 一个有机薄膜层或至少一个具有另一固体材料的电极在沉积至少一个薄膜封装层之前发生。
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公开(公告)号：US09843024B2
公开(公告)日：2017-12-12
申请号：US14559516
申请日：2014-12-03
Applicant: Universal Display Corporation
Inventor： Ruiqing Ma , John Felts , Jeffrey Silvernail , Zhaoqun Zhoi , Emory Krall , Julia J. Brown
CPC classification number: H01L51/56 , H01L51/0005 , H01L51/0026 , H01L51/003 , H01L51/5253
Abstract: Systems and methods for fabricating an OLED are provided, which include dispensing a substrate material onto a substrate carrier, the substrate carrier being rotated by one or more drums, curing the substrate material to form a substrate, depositing at least one OLED onto the substrate, and separating the substrate from the substrate carrier.
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公开(公告)号：US20170187006A1
公开(公告)日：2017-06-29
申请号：US15459044
申请日：2017-03-15
Applicant: UNIVERSAL DISPLAY CORPORATION
Inventor： Ruiqing Ma , Jeff Silvernail , Prashant Mandlik , Julia J. Brown , John Felts
CPC classification number: H01L51/56 , H01L51/001 , H01L51/0021 , H01L51/0029 , H01L51/0097 , H01L51/5212 , H01L2251/5338 , H01L2251/568 , Y02E10/549 , Y02P70/521
Abstract: A method of forming microelectronic systems on a flexible substrate includes depositing a plurality of layers on one side of the flexible substrate. Each of the plurality of layers is deposited from one of a plurality of sources. A vertical projection of a perimeter of each one of the plurality of sources does not intersect the flexible substrate. The flexible substrate is in motion during the depositing the plurality of layers via a roll to roll feed and retrieval system.
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