Impact resistant OLED devices
    1.
    发明授权

    公开(公告)号:US10749123B2

    公开(公告)日:2020-08-18

    申请号:US14661355

    申请日:2015-03-18

    Abstract: A system and method for the fabrication of high efficiency OLED devices and more specifically, the fabrication of OLED panels optically coupled with impact resistant, transparent structures which permit operation of the OLED panel while providing impact resistance. The OLED device can be built directly on an impact resistant transparent structure, or attached to an impact resistant transparent structure after it is built on other types of substrate. The impact resistant transparent structure can be a toughened layer, such as a glass layer, an energy absorption layer, such as Polycarbonate (PC), or a combination of both. The OLED device is configured to transmit light through the impact resistant transparent structure to the viewer, and the impact resistant transparent structure provides impact resistance for the OLED from the force of any impacting object.

    System and method for matching electrode resistances in OLED light panels

    公开(公告)号:US10367161B2

    公开(公告)日:2019-07-30

    申请号:US15584354

    申请日:2017-05-02

    Abstract: Provided are an OLED device and a method of manufacturing the OLED device that may provide improved luminance uniformity. The disclosed OLED may have a first electrode that has a first sheet resistance Rs, and a second electrode that has a second sheet resistance, wherein the second sheet resistance may be in the range of 0.3 Rs-1.3 Rs. In addition, the disclosed OLED may have a plurality of equal potential difference between points on a first electrode and a second electrode. The equal potential difference may be provided by a gradient resistance formed on at least one of the electrodes.

    Flexible multilayer scattering substrate used in OLED

    公开(公告)号:US10020466B2

    公开(公告)日:2018-07-10

    申请号:US15873193

    申请日:2018-01-17

    CPC classification number: H01L51/5268 H01L51/0097 H01L51/5256

    Abstract: A flexible multilayer scattering substrate is disclosed. Built on a flexible supporting layer, the multilayer contains one or more scattering layers and other functional layers so that it can extract the trapped light in substrate and waveguide of an OLED. The processing of each layer is fully compatible with large area, flexible OLED manufactory, and by controlling processing conditions of each incorporated layer, the substrate microstructure can be tuned. Topographic features can be created on the top surface of substrate by changing the thickness and properties of the multilayer.

    Flexible Multilayer Scattering Substrate Used In OLED

    公开(公告)号:US20180159079A1

    公开(公告)日:2018-06-07

    申请号:US15873193

    申请日:2018-01-17

    CPC classification number: H01L51/5268 H01L51/0097 H01L51/5256

    Abstract: A flexible multilayer scattering substrate is disclosed. Built on a flexible supporting layer, the multilayer contains one or more scattering layers and other functional layers so that it can extract the trapped light in substrate and waveguide of an OLED. The processing of each layer is fully compatible with large area, flexible OLED manufactory, and by controlling processing conditions of each incorporated layer, the substrate microstructure can be tuned. Topographic features can be created on the top surface of substrate by changing the thickness and properties of the multilayer.

    Flexible multilayer scattering substrate used in OLED

    公开(公告)号:US09899631B2

    公开(公告)日:2018-02-20

    申请号:US15200596

    申请日:2016-07-01

    CPC classification number: H01L51/5268 H01L51/0097 H01L51/5256

    Abstract: A flexible multilayer scattering substrate is disclosed. Built on a flexible supporting layer, the multilayer contains one or more scattering layers and other functional layers so that it can extract the trapped light in substrate and waveguide of an OLED. The processing of each layer is fully compatible with large area, flexible OLED manufactory, and by controlling processing conditions of each incorporated layer, the substrate microstructure can be tuned. Topographic features can be created on the top surface of substrate by changing the thickness and properties of the multilayer.

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