公开(公告)号：US20180314004A1

公开(公告)日：2018-11-01

申请号：US15932800

申请日：2018-04-26

Applicant: University of Central Florida Research Foundation, Inc.

Inventor： Sasan Fathpour ,  Amirmahdi Honardoost ,  Saeed Khan

IPC: G02B6/132 ,  G02B6/122 ,  G02B6/12

CPC classification number: G02B6/132 ,  G02B6/12002 ,  G02B6/12004 ,  G02B6/1228 ,  G02B2006/1204 ,  G02B2006/12061 ,  G02B2006/12097 ,  G02B2006/12142 ,  G02B2006/12188

Abstract: A photonic integrated circuit and a method of fabrication are provided which includes: a substrate; a first optical waveguide disposed, at least in part, extending across the substrate, the first optical waveguide being configured to transmit a first mode of light; and a second optical waveguide located at least partially over the first optical waveguide, the second optical waveguide being configured to transmit a second mode of light, wherein the first optical waveguide is vertically coupled to the second optical waveguide through a third optical waveguide disposed below the second waveguide.

公开(公告)号：US10718904B2

公开(公告)日：2020-07-21

申请号：US15932800

申请日：2018-04-26

Applicant: UNIVERSITY OF CENTRAL FLORIDA RESEARCH FOUNDATION, INC.

Inventor： Sasan Fathpour ,  Amirmahdi Honardoost ,  Saeed Khan

IPC: G02B6/132 ,  G02B6/122 ,  G02B6/12

Abstract: A photonic integrated circuit and a method of fabrication are provided which includes: a substrate; a first optical waveguide disposed, at least in part, extending across the substrate, the first optical waveguide being configured to transmit a first mode of light; and a second optical waveguide located at least partially over the first optical waveguide, the second optical waveguide being configured to transmit a second mode of light, wherein the first optical waveguide is vertically coupled to the second optical waveguide through a third optical waveguide disposed below the second waveguide.