公开(公告)号：US3867759A

公开(公告)日：1975-02-25

申请号：US36965473

申请日：1973-06-13

Applicant: US AIR FORCE

Inventor： SIEFKER ROBERT G

IPC: H05K1/02 ,  H05K1/14 ,  H05K3/42 ,  H05K3/46 ,  H05K3/36

CPC classification number: H05K1/142 ,  H05K1/0237 ,  H05K3/429 ,  H05K3/4614 ,  H05K3/4623 ,  H05K2201/09536 ,  H05K2201/096 ,  H05K2201/09963 ,  H05K2201/10303 ,  H05K2203/061 ,  Y10T29/49126

Abstract: The method of manufacturing the integrated package includes, but is not limited to, the steps of: fabricating a plurality of identical strip transmission line printed circuit board segments, which are to be used to form a plurality, preferably two, of printed circuit boards, with each board to be a layer in and of the multi-layered integrated package; joining the segments, which collectively constitute and define each circuit board layer, in coplanar relationship, to form the respective circuit boards, drilling, and plating with an electrically conductive material, a plurality of signal path holes in and through each segment of each circuit board (i.e., each layer); inserting one end of a different two-ended electrically conductive wire into each plated signal path hole in the first circuit board layer, and soldering that end in place to its respective plated signal path hole, thereby providing electrical contact by and between each wire and its respective plated hole in the first layer; inserting the other end of each wire in a different plated signal path hole in the second circuit board layer, and soldering that end in place to its respective plated signal path hole, thereby providing electrical contact by and between each end of each wire and the two plated signal path holes to which each wire is soldered, and also thereby providing electrical conductivity between, and from and to, the first and the second layers of printed circuit boards; and, bonding the second layer to the first layer in stacked relationship. By cascading the interconnection (i.e., adding a third layer to the two-layered package, and electrically interconnecting the third layer to the second layer), an integrated package of as many layers as desired or as needed may be formed, without having to penetrate more than any two adjacent layers of circuit boards at any one time. The method may be significantly varied, by performing additional steps to drill, plate and align one or more grounded holes in the circuit board layers, to improve the electrical performance of the transition.