公开(公告)号：US20220240368A1

公开(公告)日：2022-07-28

申请号：US17455918

申请日：2021-11-21

Applicant: Unimicron Technology Corp.

Inventor： Pei-Wei WANG ,  Heng-Ming NIEN ,  Ching-Sheng CHEN ,  Yi-Pin LIN ,  Shih-Liang CHENG

IPC: H05K1/02

Abstract: A co-axial structure includes a substrate, a first conductive structure, a second conductive structure, and an insulating layer. The substrate includes a first surface. The first conductive structure includes a first circuit deposited on the first surface and a first via penetrating the substrate. The second conductive structure includes a second circuit deposited on the first surface and a second via penetrating the substrate. The first via and the second via extend along a first direction. The first circuit and the second circuit extend along a second direction, and the second direction is perpendicular to the first direction. The insulating layer is located between the first via and the second via. The insulating layer includes a filler. The first conductive structure and the second conductive structure are electrically insulated. The first circuit and the second circuit are coplanar.

公开(公告)号：US20240023251A1

公开(公告)日：2024-01-18

申请号：US17899467

申请日：2022-08-30

Applicant: UNIMICRON TECHNOLOGY CORP.

Inventor： Shao-Chien LEE ,  Ching-Sheng CHEN ,  Heng-Ming NIEN ,  Pei-Wei WANG

IPC: H05K3/46 ,  H05K3/40 ,  H05K1/02 ,  H05K1/11

CPC classification number: H05K3/4679 ,  H05K3/4046 ,  H05K1/0298 ,  H05K1/116 ,  H05K2203/016 ,  H05K2203/1131

Abstract: A manufacturing method for circuit board structure includes steps of providing a carrier, forming a first build-up layer including a plurality of first circuits, forming a second build-up layer including a plurality of second circuits on a side of the first build-up layer located away from the carrier, attaching a side of the second build-up layer located away from the first build-up layer to a core layer, and removing the carrier from the first build-up layer, where the first circuits are finer than the second circuits.