公开(公告)号：US20240397621A1

公开(公告)日：2024-11-28

申请号：US18345440

申请日：2023-06-30

Applicant: UNIMICRON TECHNOLOGY CORP. ,  National Taiwan University

Inventor： Chin-Hsun WANG ,  Ruey-Beei WU ,  Chun-Jui HUANG ,  Wei-Yu LIAO ,  Ching-Sheng CHEN ,  Chi-Min CHANG

IPC: H05K1/11 ,  H05K1/02

Abstract: A circuit board device includes a transition region that includes a first conductive layer at a first level, a second conductive layer at a second level, and conductive vias. The first conductive layer includes a pad connected to the solderless connector, a transmission line, and a first reference layer. The transmission line includes first and second segments. A second width of the second segment is the same as or less than a first width of the first segment. The first reference layer has a first anti-pad region for the pad and the transmission line disposed therein. In a plan view, the first anti-pad region surrounding the pad is completely located within a second anti-pad region of a second reference layer of the second conductive layer. The conductive vias are disposed between the first and second conductive layers and surround the pad.

公开(公告)号：US20220240375A1

公开(公告)日：2022-07-28

申请号：US17452771

申请日：2021-10-28

Applicant: Unimicron Technology Corp.

Inventor： Ching-Sheng CHEN ,  Chi-Min CHANG ,  Yi-Pin LIN ,  Jun-Rui HUANG

IPC: H05K1/02 ,  H05K3/42 ,  H05K3/02 ,  H05K3/00

Abstract: A co-axial structure includes a substrate, a first conductive structure, a second conductive structure, and an insulating layer. The substrate includes a first surface. The first conductive structure includes a first circuit deposited on the first surface and a first via penetrating the substrate. The second conductive structure includes a second circuit deposited on the first surface and a second via penetrating the substrate. The first via and the second via extend along a first direction. The first circuit and the second circuit extend along a second direction, and the second direction is perpendicular to the first direction. The insulating layer is located between the first via and the second via. The first conductive structure and the second conductive structure are electrically insulated. The first circuit and the second circuit are coplanar.

公开(公告)号：US20220240368A1

公开(公告)日：2022-07-28

申请号：US17455918

申请日：2021-11-21

Applicant: Unimicron Technology Corp.

Inventor： Pei-Wei WANG ,  Heng-Ming NIEN ,  Ching-Sheng CHEN ,  Yi-Pin LIN ,  Shih-Liang CHENG

IPC: H05K1/02

Abstract: A co-axial structure includes a substrate, a first conductive structure, a second conductive structure, and an insulating layer. The substrate includes a first surface. The first conductive structure includes a first circuit deposited on the first surface and a first via penetrating the substrate. The second conductive structure includes a second circuit deposited on the first surface and a second via penetrating the substrate. The first via and the second via extend along a first direction. The first circuit and the second circuit extend along a second direction, and the second direction is perpendicular to the first direction. The insulating layer is located between the first via and the second via. The insulating layer includes a filler. The first conductive structure and the second conductive structure are electrically insulated. The first circuit and the second circuit are coplanar.

公开(公告)号：US20240023251A1

公开(公告)日：2024-01-18

申请号：US17899467

申请日：2022-08-30

Applicant: UNIMICRON TECHNOLOGY CORP.

Inventor： Shao-Chien LEE ,  Ching-Sheng CHEN ,  Heng-Ming NIEN ,  Pei-Wei WANG

IPC: H05K3/46 ,  H05K3/40 ,  H05K1/02 ,  H05K1/11

CPC classification number: H05K3/4679 ,  H05K3/4046 ,  H05K1/0298 ,  H05K1/116 ,  H05K2203/016 ,  H05K2203/1131

Abstract: A manufacturing method for circuit board structure includes steps of providing a carrier, forming a first build-up layer including a plurality of first circuits, forming a second build-up layer including a plurality of second circuits on a side of the first build-up layer located away from the carrier, attaching a side of the second build-up layer located away from the first build-up layer to a core layer, and removing the carrier from the first build-up layer, where the first circuits are finer than the second circuits.

公开(公告)号：US20220386460A1

公开(公告)日：2022-12-01

申请号：US17377280

申请日：2021-07-15

Applicant: Unimicron Technology Corp.

Inventor： Chi-Min CHANG ,  Ching-Sheng CHEN ,  Jun-Rui HUANG ,  Wei-Yu LIAO ,  Yi-Pin LIN

IPC: H05K1/11 ,  H05K1/18 ,  H05K3/42

Abstract: An interlayer connective structure is suitable for being formed in a wiring board, in which the wiring board includes two traces and an insulation part between the traces. The insulation part has a through hole. The interlayer connective structure located in the through hole is connected to the traces. The interlayer connective structure includes a column and a pair of protuberant parts. The protuberant parts are located at two ends of the through hole respectively and connected to the column and the traces. The protuberant parts stick out from the outer surfaces of the traces respectively. Each of the protuberant parts has a convex curved surface, in which the distance between the convex curved surface and the axis of the through hole is less than the radius of the through hole.