公开(公告)号：US20240237209A9

公开(公告)日：2024-07-11

申请号：US17986899

申请日：2022-11-15

Applicant: Unimicron Technology Corp.

Inventor： Ping-Tsung Lin ,  Kai-Ming Yang ,  Chia-Yu Peng ,  Pu-Ju Lin ,  Cheng-Ta Ko

IPC: H05K1/11 ,  H05K1/02 ,  H05K3/34 ,  H05K3/40

CPC classification number: H05K1/114 ,  H05K1/024 ,  H05K3/3442 ,  H05K3/4007 ,  H05K2201/0195 ,  H05K2203/041

Abstract: A circuit board structure includes a carrier, a thin film redistribution layer disposed on the carrier, solder balls electrically connected to the thin film redistribution layer and the carrier, and a surface treatment layer. The thin film redistribution layer includes a plurality of pads, a first dielectric layer, a first metal layer, a second dielectric layer, a second metal layer, and a third dielectric layer. A plurality of first openings of the first dielectric layer expose part of the pads, and a first surface of the first dielectric layer is higher upper surfaces of the pads. The solder balls are disposed in a plurality of third openings of the third dielectric layer and are electrically connected to the second metal layer and the carrier. The surface treatment layer is disposed on the upper surfaces, and a top surface of the surface treatment layer is higher than the first surface.

公开(公告)号：US20240138063A1

公开(公告)日：2024-04-25

申请号：US17986899

申请日：2022-11-15

Applicant: Unimicron Technology Corp.

Inventor： Ping-Tsung Lin ,  Kai-Ming Yang ,  Chia-Yu Peng ,  Pu-Ju Lin ,  Cheng-Ta Ko

IPC: H05K1/11 ,  H05K1/02 ,  H05K3/34 ,  H05K3/40

CPC classification number: H05K1/114 ,  H05K1/024 ,  H05K3/3442 ,  H05K3/4007 ,  H05K2201/0195 ,  H05K2203/041

Abstract: A circuit board structure includes a carrier, a thin film redistribution layer disposed on the carrier, solder balls electrically connected to the thin film redistribution layer and the carrier, and a surface treatment layer. The thin film redistribution layer includes a plurality of pads, a first dielectric layer, a first metal layer, a second dielectric layer, a second metal layer, and a third dielectric layer. A plurality of first openings of the first dielectric layer expose part of the pads, and a first surface of the first dielectric layer is higher upper surfaces of the pads. The solder balls are disposed in a plurality of third openings of the third dielectric layer and are electrically connected to the second metal layer and the carrier. The surface treatment layer is disposed on the upper surfaces, and a top surface of the surface treatment layer is higher than the first surface.