公开(公告)号：US10080295B2

公开(公告)日：2018-09-18

申请号：US13667651

申请日：2012-11-02

Applicant: Unimicron Technology Corporation

Inventor： Kun-Chen Tsai

IPC: H05K1/09 ,  H05K1/11 ,  H05K3/20 ,  H05K3/42 ,  H05K3/46

CPC classification number: H05K3/205 ,  H01L2924/0002 ,  H05K3/423 ,  H05K3/465 ,  H05K3/4682 ,  H05K2201/09563 ,  H05K2201/09881 ,  Y10T29/49128 ,  Y10T29/49165 ,  H01L2924/00

Abstract: Provided are a circuit board structure and a fabrication method thereof, including the steps of: forming a first circuit layer in a first dielectric layer and exposing the first circuit layer therefrom; forming a second dielectric layer on the first dielectric layer and the first circuit layer, and forming a second circuit layer on the second dielectric layer; forming a plurality of first conductive vias in the second dielectric layer for electrically connecting to the first circuit layer to thereby dispense with a core board and electroplated holes and thus facilitate miniaturization. Further, the first dielectric layer is liquid before being hardened and is formed on the first dielectric layer that enhances the bonding between layers of the circuit board and the structure.

公开(公告)号：US20130062100A1

公开(公告)日：2013-03-14

申请号：US13667651

申请日：2012-11-02

Applicant: Unimicron Technology Corporation

Inventor： Kun-Chen Tsai

IPC: H05K1/11 ,  H05K1/09

CPC classification number: H05K3/205 ,  H01L2924/0002 ,  H05K3/423 ,  H05K3/465 ,  H05K3/4682 ,  H05K2201/09563 ,  H05K2201/09881 ,  Y10T29/49128 ,  Y10T29/49165 ,  H01L2924/00

Abstract: Provided are a circuit board structure and a fabrication method thereof, including the steps of: forming a first circuit layer in a first dielectric layer and exposing the first circuit layer therefrom; forming a second dielectric layer on the first dielectric layer and the first circuit layer, and forming a second circuit layer on the second dielectric layer; forming a plurality of first conductive vias in the second dielectric layer for electrically connecting to the first circuit layer to thereby dispense with a core board and electroplated holes and thus facilitate miniaturization. Further, the first dielectric layer is liquid before being hardened and is formed on the first dielectric layer that enhances the bonding between layers of the circuit board and the structure.

Abstract translation: 提供一种电路板结构及其制造方法，包括以下步骤：在第一电介质层中形成第一电路层，并从其露出第一电路层; 在所述第一电介质层和所述第一电路层上形成第二电介质层，以及在所述第二电介质层上形成第二电路层; 在第二电介质层中形成多个第一导电通孔，用于电连接到第一电路层，从而省去芯板和电镀孔，从而便于小型化。 此外，第一电介质层在硬化之前是液体，并且形成在增强电路板的层之间的结合的第一电介质层和结构之间。