公开(公告)号：US20140091383A1

公开(公告)日：2014-04-03

申请号：US14098290

申请日：2013-12-05

Applicant: United Microelectronics Corp.

Inventor： Ko-Chi Chen ,  Ping-Chia Shih ,  Chih-Ming Wang ,  Chi-Cheng Huang ,  Hsiang-Chen Lee

IPC: H01L29/792 ,  H01L29/78

CPC classification number: H01L29/792 ,  H01L27/11573 ,  H01L29/40117 ,  H01L29/665 ,  H01L29/66833 ,  H01L29/7833

Abstract: A method for fabricating a semiconductor device is described. A stacked gate dielectric is formed over a substrate, including a first dielectric layer, a second dielectric layer and a third dielectric layer from bottom to top. A conductive layer is formed on the stacked gate dielectric and then patterned to form a gate conductor. The exposed portion of the third and the second dielectric layers are removed with a selective wet cleaning step. S/D extension regions are formed in the substrate with the gate conductor as a mask. A first spacer is formed on the sidewall of the gate conductor and a portion of the first dielectric layer exposed by the first spacer is removed. S/D regions are formed in the substrate at both sides of the first spacer. A metal silicide layer is formed on the S/D regions.

Abstract translation: 对半导体装置的制造方法进行说明。 堆叠的栅极电介质形成在衬底上，包括从底部到顶部的第一介电层，第二电介质层和第三电介质层。 在堆叠的栅极电介质上形成导电层，然后将其图案化以形成栅极导体。 通过选择性湿式清洗步骤除去第三和第二介电层的暴露部分。 在栅极导体作为掩模的基板中形成S / D延伸区域。 在栅极导体的侧壁上形成第一间隔物，并且去除由第一间隔物露出的第一电介质层的一部分。 在第一间隔物的两侧的基板中形成S / D区域。 在S / D区域上形成金属硅化物层。