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公开(公告)号:US20250107137A1
公开(公告)日:2025-03-27
申请号:US18398222
申请日:2023-12-28
Inventor: Ming QIAO , Jiawei WANG , Dingxiang MA , Yue GAO , Gen LIU , Shengduo WANG , Yuanqing YE , Bo ZHANG
IPC: H01L29/78 , H01L29/06 , H01L29/417
Abstract: A lateral power semiconductor device layout and a device structure belong to the technical field of power semiconductor devices. A method for designing a lateral power semiconductor device layout with high integrity and high cell density has the following advantages of reducing a specific on-resistance of the device, increasing a width of a channel per unit area, improving the current capability of the device, optimizing the static characteristic of the device, reducing the area of a drain region and the parasitic capacitance of the device, reducing the delay time of a cell switch caused by an excessively long gate electrode of a traditional finger cell, optimizing the dynamic characteristic of the device, optimizing the cell edge of the device and the curvature effect of a terminal, and reducing the pre-breakdown risk of the device.
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公开(公告)号:US20240395930A1
公开(公告)日:2024-11-28
申请号:US18382561
申请日:2023-10-23
Inventor: Ming QIAO , Yue GAO , Jiawei WANG , Dingxiang MA , Bo ZHANG
IPC: H01L29/78 , H01L29/10 , H01L29/423
Abstract: A lateral power semiconductor device is provided and includes a second doping type substrate, a first doping type buried layer, a second doping type epitaxial layer, a first doping type drift area, a second doping type first body area, a first doping type drain area, a first doping type source area, a second doping type second body area, a dielectric layer, a control gate, a body electrode, second doping type polysilicon and first doping type polysilicon. The control gate is led out and connected to different potentials; when the device is in an off state, the control gate is connected to a low potential to assist the drift area in depletion; and when the device is in an on state, the control gate is connected to a high potential, and more carriers are induced on a silicon surface below the control gate.
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