ELECTRONIC ASSEMBLY
    1.
    发明公开
    ELECTRONIC ASSEMBLY 审中-公开

    公开(公告)号:US20240064940A1

    公开(公告)日:2024-02-22

    申请号:US18267988

    申请日:2021-11-03

    CPC classification number: H05K7/20509 H05K7/20445 H05K2201/10969 H05K1/0204

    Abstract: The invention relates to an electronic assembly (1) comprising a printed circuit board (4), an electronic module (2) fixed on a first side (5) of the printed circuit board (4), a casing (3) having a thermally conductive wall (9), fastening means (18) configured to keep the printed circuit board (4) at a distance from the thermally conductive wall (9) inside the casing (3), a housing (7) extending from an inner side (19) of the thermally conductive wall (9), and a cooling module (8) placed in the housing (7) so as to be thermally coupled to both the thermally conductive wall (9) and the electronic module (2), the housing (7) being configured to restrain the movements of the cooling module (8) in any direction parallel to the thermally conductive wall (9).

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