ELECTRONIC ASSEMBLY
    1.
    发明公开
    ELECTRONIC ASSEMBLY 审中-公开

    公开(公告)号:US20240064940A1

    公开(公告)日:2024-02-22

    申请号:US18267988

    申请日:2021-11-03

    CPC classification number: H05K7/20509 H05K7/20445 H05K2201/10969 H05K1/0204

    Abstract: The invention relates to an electronic assembly (1) comprising a printed circuit board (4), an electronic module (2) fixed on a first side (5) of the printed circuit board (4), a casing (3) having a thermally conductive wall (9), fastening means (18) configured to keep the printed circuit board (4) at a distance from the thermally conductive wall (9) inside the casing (3), a housing (7) extending from an inner side (19) of the thermally conductive wall (9), and a cooling module (8) placed in the housing (7) so as to be thermally coupled to both the thermally conductive wall (9) and the electronic module (2), the housing (7) being configured to restrain the movements of the cooling module (8) in any direction parallel to the thermally conductive wall (9).

    ELECTRONIC ASSEMBLY
    2.
    发明申请

    公开(公告)号:US20250056717A1

    公开(公告)日:2025-02-13

    申请号:US18718436

    申请日:2022-01-24

    Abstract: An electronic assembly is disclosed. The electronic assembly includes a printed circuit board including an alternating arrangement of electrically conducting layers and electrically insulated layers, and at least one electronic module fixed on a first side of the printed circuit board. The electronic module includes multiple pins so as to electrically couple the electronic module and the printed circuit board. The electronic assembly also includes at least one cooling module placed on a second side of the printed circuit board. Each electrically conductive layer of the printed circuit board includes a non-electrically conductive area extending along at least a part of a closed outline positioned around a central axis going through a center of the cooling module and a center of the electronic module.

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