-
公开(公告)号:US20190157741A1
公开(公告)日:2019-05-23
申请号:US16258275
申请日:2019-01-25
Applicant: VIASAT, INC.
Inventor: DONALD L. RUNYON , DOMINIC Q. NGUYEN , JAMES W. MAXWELL
CPC classification number: H01Q1/02 , H01P1/00 , H01P5/12 , H01P11/001 , H01Q1/28 , H01Q13/02 , H01Q21/0037 , H01Q21/0075 , Y10T29/49002 , Y10T29/49016
Abstract: In an example embodiment, an azimuth combiner comprises: a septum layer comprising a plurality of septum dividers; first and second housing layers attached to first and second sides of the septum layer; a linear array of ports on a first end of the combiner; wherein the first and second housing layers each comprise waveguide H-plane T-junctions; wherein the waveguide T-junctions can be configured to perform power dividing/combining; and wherein the septum layer evenly bisects each port of the linear array of ports. A stack of such azimuth combiners can form a two dimensional planar array of ports to which can be added a horn aperture layer, and a grid layer, to form a dual-polarized, dual-BFN, dual-band antenna array.
-
公开(公告)号:US20190006732A1
公开(公告)日:2019-01-03
申请号:US16106769
申请日:2018-08-21
Applicant: VIASAT, INC.
Inventor: DONALD L. RUNYON , DOMINIC Q. NGUYEN , JAMES W. MAXWELL
Abstract: In an example embodiment, an azimuth combiner comprises: a septum layer comprising a plurality of septum dividers; first and second housing layers attached to first and second sides of the septum layer; a linear array of ports on a first end of the combiner; wherein the first and second housing layers each comprise waveguide H-plane T-junctions; wherein the waveguide T-junctions can be configured to perform power dividing/combining; and wherein the septum layer evenly bisects each port of the linear array of ports. A stack of such azimuth combiners can form a two dimensional planar array of ports to which can be added a horn aperture layer, and a grid layer, to form a dual-polarized, dual-BFN, dual-band antenna array.
-
公开(公告)号:US20160020525A1
公开(公告)日:2016-01-21
申请号:US14868627
申请日:2015-09-29
Applicant: VIASAT, INC.
Inventor: DONALD L. RUNYON , DOMINIC Q. NGUYEN , JAMES W. MAXWELL
CPC classification number: H01Q1/02 , H01P1/00 , H01P5/12 , H01P11/001 , H01Q1/28 , H01Q13/02 , H01Q21/0037 , H01Q21/0075 , Y10T29/49002 , Y10T29/49016
Abstract: In an example embodiment, an azimuth combiner comprises: a septum layer comprising a plurality of septum dividers; first and second housing layers attached to first and second sides of the septum layer; a linear array of ports on a first end of the combiner; wherein the first and second housing layers each comprise waveguide H-plane T-junctions; wherein the waveguide T-junctions can be configured to perform power dividing/combining; and wherein the septum layer evenly bisects each port of the linear array of ports. A stack of such azimuth combiners can form a two dimensional planar array of ports to which can be added a horn aperture layer, and a grid layer, to form a dual-polarized, dual-BFN, dual-band antenna array.
-
公开(公告)号:US20150180111A1
公开(公告)日:2015-06-25
申请号:US14622430
申请日:2015-02-13
Applicant: VIASAT, INC.
Inventor: DONALD L. RUNYON , DOMINIC Q. NGUYEN , JAMES W. MAXWELL
IPC: H01P5/12
CPC classification number: H01Q1/02 , H01P1/00 , H01P5/12 , H01P11/001 , H01Q1/28 , H01Q13/02 , H01Q21/0037 , H01Q21/0075 , Y10T29/49002 , Y10T29/49016
Abstract: In an example embodiment, an azimuth combiner comprises: a septum layer comprising a plurality of septum dividers; first and second housing layers attached to first and second sides of the septum layer; a linear array of ports on a first end of the combiner; wherein the first and second housing layers each comprise waveguide H-plane T-junctions; wherein the waveguide T-junctions can be configured to perform power dividing/combining; and wherein the septum layer evenly bisects each port of the linear array of ports. A stack of such azimuth combiners can form a two dimensional planar array of ports to which can be added a horn aperture layer, and a grid layer, to form a dual-polarized, dual-BFN, dual-band antenna array.
Abstract translation: 在示例实施例中,方位组合器包括:隔膜层,包括多个隔膜分隔件; 第一和第二壳体层附接到隔膜层的第一和第二侧; 在组合器的第一端上的端口的线性阵列; 其中所述第一和第二壳体层各自包括波导H平面T形接头; 其中所述波导T形结可以被配置为执行功率分配/组合; 并且其中所述隔膜层将所述线性阵列阵列的每个端口均匀地平分。 这种方位组合器的堆叠可以形成端口的二维平面阵列,其可以添加喇叭孔径层和栅格层,以形成双极化双BFN双频天线阵列。
-
-
-