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公开(公告)号：US20230158294A1
公开(公告)日：2023-05-25
申请号：US17912478
申请日：2021-03-18
发明人： Annapurna Karicherla , Bo Lu , Kedar Shah , Peng Cong
CPC分类号： A61N1/0529 , G06F3/015 , H01B7/0846
摘要： The present disclosure relates to a monolithic thin-film lead assembly and methods of microfabricating a monolithic thin-film lead assembly. Particularly, aspects of the present disclosure are directed to a monolithic thin-film lead assembly that includes a cable having a proximal end, a distal end, a supporting structure that extends from the proximal end to the distal end, and conductive traces formed on a portion of the supporting structure. The supporting structure includes one or more layers of dielectric material. The monolithic thin-film lead assembly further includes an interface formed on the supporting structure at the distal end of the cable. The interface includes electrodes and/or sensors in electrical connection with the conductive traces, and the supporting structure has at least one curved portion disposed between a first set of electrodes and a second set of electrodes, and/or between a first set of sensors and a second set of sensors.
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公开(公告)号：US20200220285A1
公开(公告)日：2020-07-09
申请号：US16824013
申请日：2020-03-19
发明人： Kedar Shah
IPC分类号： H01R12/52 , H01R13/24 , A61N1/05 , A61B17/34 , A61B5/00 , H05K5/00 , H05K3/36 , H05K3/40 , H05K1/14 , H01R43/20 , H01R13/52 , H05K1/02 , H01R12/71 , H01R12/70 , A61B5/145 , A61N1/375
摘要： An example implantable connector for connecting an electronics package and a neural interface is made by way of a compressible contacts (e.g., a spring) that physical contacts a corresponding exposed bond pad. The compressible contact is held in compression with the exposed bond pad using a mechanical coupler. The compressible contact is physically separated and electrically isolated from other contacts by way of a compressible gasket. The compressible gasket is also held in compression using the mechanical coupler.
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公开(公告)号：US20180133487A1
公开(公告)日：2018-05-17
申请号：US15725866
申请日：2017-10-05
发明人： Kedar Shah , Peng Cong
CPC分类号： A61N1/3754 , A61N1/0534 , A61N1/36038 , A61N1/37205 , A61N1/37223 , A61N1/37229 , A61N1/37512 , A61N1/37514 , A61N1/3756 , A61N1/3758 , A61N1/3787
摘要： An implantable device includes a cylindrical housing, a metallic feedthrough, a metallic collar, and a battery. The cylindrical housing has a sidewall and an internal cavity, and is formed from a ceramic. One or more electrical components are integrated into the sidewall. The metallic feedthrough is joined to a first end of the cylindrical housing. The metallic collar is joined to a second end of the cylindrical housing. The battery is joined to the metallic collar.
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公开(公告)号：US20220037054A1
公开(公告)日：2022-02-03
申请号：US17277000
申请日：2019-09-13
发明人： Annapurna Karicherla , Bo Lu , Kedar Shah
摘要： The present disclosure relates to a monolithic thin-film lead assembly and methods of microfabricating a monolithic thin-film lead assembly. Particularly, aspects of the present disclosure are directed to a monolithic thin-film lead assembly that includes a cable having a proximal end, a distal end, a supporting structure that extends from the proximal end to the distal end, and a plurality of conductive traces formed on a portion of the supporting structure. The supporting structure includes one or more layers of dielectric material. The monolithic thin-film lead assembly may further include an electrode assembly formed on the supporting structure at the distal end of the cable. The electrode assembly includes one or more electrodes in electrical connection with one or more conductive traces of the plurality of conductive traces.
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公开(公告)号：US10773075B2
公开(公告)日：2020-09-15
申请号：US15925953
申请日：2018-03-20
发明人： Brian Pepin , Peng Cong , Kedar Shah , Shivkumar Sabesan
摘要： An electrode cuff for placement around a peripheral nerve can include one or more protrusions extending from a tissue-contacting surface of the electrode cuff. A protrusion can include one or more electrodes and can have a blunt distal end. The protrusion(s) can be driven into the nerve using a driving tool designed to apply mechanical oscillations and/or swift mechanical force to the electrode cuff. The mechanical oscillations and/or swift mechanical force can insert the blunt distal ends of the protrusions into the nerve without damaging fascicles within the nerve. During implantation, a sensor associated with the driving tool and/or the electrode cuff can provide dynamic feedback to a controller for controlling the driving tool. The sensor may detect pressure, temperature, acoustic activity, and/or electrical activity to indicate when the protrusions have pierced the epineurium, allowing the controller to cease the driving tool and thus avoid damage to the fascicles.
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公开(公告)号：US10668273B2
公开(公告)日：2020-06-02
申请号：US15995923
申请日：2018-06-01
发明人： Kedar Shah
IPC分类号： A61N1/05
摘要： A device is described that includes a neural interface and a lead body. The lead body and the neural interface are formed from a flexible circuit. The flexible circuit includes an exposed electrode. The lead body includes an elongate planar strand that is coiled about a central axis of the lead body. The elongate planar strand includes a conductive trace extending between the exposed electrode and a distal end of the elongate planar strand.
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公开(公告)号：US20200155857A1
公开(公告)日：2020-05-21
申请号：US16658596
申请日：2019-10-21
发明人： Bo Lu , Kedar Shah
摘要： The present disclosure relates to branched proximal connectors for high density neural interfaces and methods of microfabricating the branched proximal connectors. Particularly, aspects of the present disclosure are directed to a branched connector that includes a main body having a base portion of a supporting structure and a plurality of conductive traces formed on the base portion, and a plurality of plugs extending from the main body. Each plug of the plurality of plugs include an end portion of the supporting structure comprised of the one or more layers of dielectric material, and a subset of conductive traces from the plurality of conductive traces. Each trace from the subset of conductive traces terminates at a bond pad exposed on a surface of the end portion of the supporting structure.
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公开(公告)号：US20220323773A1
公开(公告)日：2022-10-13
申请号：US17847457
申请日：2022-06-23
发明人： Bo Lu , Kedar Shah
摘要： The present disclosure relates to branched proximal connectors for high density neural interfaces and methods of microfabricating the branched proximal connectors. Particularly, aspects of the present disclosure are directed to a branched connector that includes a main body having a base portion of a supporting structure and a plurality of conductive traces formed on the base portion, and a plurality of plugs extending from the main body. Each plug of the plurality of plugs include an end portion of the supporting structure comprised of the one or more layers of dielectric material, and a subset of conductive traces from the plurality of conductive traces. Each trace from the subset of conductive traces terminates at a bond pad exposed on a surface of the end portion of the supporting structure.
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公开(公告)号：US11450977B2
公开(公告)日：2022-09-20
申请号：US16824013
申请日：2020-03-19
发明人： Kedar Shah
IPC分类号： H01R12/52 , H01R13/52 , H01R43/20 , H05K1/14 , H05K5/00 , H05K3/40 , H05K3/36 , A61B5/00 , A61B17/34 , A61N1/05 , H01R13/24 , A61N1/375 , A61B5/145 , H01R12/70 , H01R12/71 , H05K1/02 , A61N1/36 , H05K1/11 , A61B5/24
摘要： An implantable connector for connecting an electronics package and a neural interface is made by way of a compressible contacts (e.g., a spring) that physical contacts a corresponding exposed bond pad. The compressible contact is held in compression with the exposed bond pad using a mechanical coupler. The compressible contact is physically separated and electrically isolated from other contacts by way of a compressible gasket. The compressible gasket is also held in compression using the mechanical coupler.
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10.发明申请公开(公告)号：US20200171311A1
公开(公告)日：2020-06-04
申请号：US16636401
申请日：2018-08-03
发明人： Kedar Shah , Shiv Sabesan , Brian Pepin
摘要： A device includes a neural interface and a lead body. The lead body includes a bulk conductor and the neural interface includes a flexible circuit. The flexible circuit includes a microfabricated substrate and an exposed electrode. An interconnect region disposed between the electrode and the bulk conductor provides electrical connection between the electrode and the bulk conductor such that electrical signals can be communicated relative to the electrode via the bulk conductor. The interconnect region can be respectively connected to the electrode and bulk conductor by wire-bonding, welding, or other suitable connection methods.
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