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公开(公告)号：US07520753B1
公开(公告)日：2009-04-21
申请号：US12058792
申请日：2008-03-31
IPC分类号： H01R12/00
CPC分类号： G01R1/0466 , G01R1/0408 , H01R12/714 , H01R13/2421 , H01R2201/20
摘要： A method of using a coil contact as an electrical interconnect includes inserting at least one coil contact into a dielectric plate or housing. The at least one coil contact includes a beryllium copper coil plated with gold and having a tapered shape such that each end has a diameter smaller than the diameter of a middle section. The housing comprises an upper half comprising a surface that slopes outwardly from a center of the housing towards a top opening, and a lower half comprising a surface that slopes outwardly from the center of the housing to a bottom opening. The sloping surfaces of the upper half and the lower half form a concave shape that captivates the middle section of the coil contact. Each end of the at least one coil contact extends to account for variations in surfaces of the processor and the circuit board.
摘要翻译： 使用线圈接触件作为电互连的方法包括将至少一个线圈接触件插入电介质板或壳体。 所述至少一个线圈触点包括镀有金的铍铜线圈，并且具有锥形形状，使得每个端部的直径小于中间部分的直径。 壳体包括上半部，其包括从壳体的中心朝向顶部开口向外倾斜的表面，并且下半部包括从壳体的中心向外倾斜到底部开口的表面。 上半部分和下半部分的倾斜表面形成一个凹陷的形状，其收缩线圈接触件的中间部分。 至少一个线圈接触件的每个端部延伸以考虑处理器和电路板的表面的变化。
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公开(公告)号：US6011627A
公开(公告)日：2000-01-04
申请号：US56457
申请日：1998-04-07
CPC分类号： H01L21/67259
摘要： A universal mapping tool and method for mapping workpieces, such as semiconductor devices, is disclosed and described. The tool comprises a fixed and a movable gripping means adapted to mount a wide range of workpieces, means for optically locating the physical center of the workpiece fiducials mounted on the gripping means, and means for interpreting and storing the data obtained in the mapping operation.
摘要翻译： 公开并描述了用于映射工件的通用映射工具和方法，例如半导体器件。 该工具包括适于安装大范围工件的固定和可移动夹持装置，用于光学地定位安装在夹持装置上的工件基准的物理中心的装置，以及用于解释和存储在映射操作中获得的数据的装置。
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公开(公告)号：US06674297B1
公开(公告)日：2004-01-06
申请号：US10193006
申请日：2002-07-09
申请人： Robert F. Florence, Jr. , Emanuele F. Lopergolo , Vincent P. Mulligan , Charles R. Tompkins, Jr.
发明人： Robert F. Florence, Jr. , Emanuele F. Lopergolo , Vincent P. Mulligan , Charles R. Tompkins, Jr.
IPC分类号： G01R3102
CPC分类号： G01R1/06722 , G01R1/07314
摘要： A micro compliant, test probe interconnect apparatus for an integrated circuit device is disclosed. In an exemplary embodiment, the apparatus includes an elongated housing and a probe pin extending from a first end of the housing. A biasing mechanism holds the probe pin in a normally extended position, wherein the biasing mechanism is formed from a portion of the elongated housing. In a preferred embodiment, the biasing mechanism is a flexible tab, formed from a generally rectangular section of the elongated housing and bent inwardly therein to form a cantilever.
摘要翻译： 公开了一种用于集成电路器件的微兼容测试探针互连装置。 在示例性实施例中，该装置包括细长壳体和从壳体的第一端延伸的探针。 偏置机构将探针固定在正常伸展位置，其中偏置机构由细长壳体的一部分形成。 在优选实施例中，偏置机构是由细长壳体的大致矩形部分形成并在其中向内弯曲以形成悬臂的柔性凸片。
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4.发明授权公开(公告)号：US07399930B1
公开(公告)日：2008-07-15
申请号：US11623484
申请日：2007-01-16
IPC分类号： H01R12/04
CPC分类号： H05K3/225 , H05K1/113 , H05K3/0047 , H05K3/3447 , H05K3/4046 , H05K2201/09845 , H05K2201/10303 , H05K2203/0191 , H05K2203/0242 , Y10T29/49174 , Y10T29/49179
摘要： Methods and devices are provided for repairing a damaged contact pad that is located on a first surface of a printed circuit board and connected to a via that passes through the circuit board. According to the method, a countersink hole is created in the first surface of the printed circuit board in a location that is substantially centered on an axis passing through the via, and a replacement structure is inserted into the countersink hole. The replacement structure has a stem portion, a head portion, and a shoulder portion that connects the stern and head portions, with the angle of the shoulder portion substantially matching the angle of the shoulder of the countersink hole. The stem portion of the replacement structure is permanently attached to sidewalls of the via so as to electrically couple the head portion of the replacement structure to the via.
摘要翻译： 提供了用于修复位于印刷电路板的第一表面上并连接到通过电路板的通孔的损坏的接触垫的方法和装置。 根据该方法，在印刷电路板的第一表面中形成基本上位于通过通孔的轴的中心的位置上形成埋头孔，并且将更换结构插入到埋头孔中。 替换结构具有杆部，头部和连接船头和头部的肩部，肩部的角度基本上与埋头孔的肩部的角度相匹配。 替换结构的杆部分永久地附接到通孔的侧壁，以便将替换结构的头部部分电连接到通孔。
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公开(公告)号：US20100246935A1
公开(公告)日：2010-09-30
申请号：US12415036
申请日：2009-03-31
申请人： Donald A. Hallock , Vincent P. Mulligan , Joseph P. Palmeri , James I. Paradies , Nandu N. Ranadive
发明人： Donald A. Hallock , Vincent P. Mulligan , Joseph P. Palmeri , James I. Paradies , Nandu N. Ranadive
CPC分类号： G01N23/04 , G01N2223/1016 , G01N2223/401 , G06T7/001 , G06T2207/30152
摘要： A system to facilitate analysis of component leads is provided and includes a device to form a picture of the leads, from which an image is extracted, to apportion the image and to perform first and second scans of the portions, and a processor, including a memory unit having a set of computer-readable executable instructions stored thereon, which, when executed, cause the processor to receive data of each scan, to establish a rule, based on the data of the first scan of any one portion, governing when to judge that the data of the second scan of the one portion indicates a defect, to determine rule compliance for each of the second scans, to judge that any one second scan in a non-compliance state indicates a defect, and to report a location of the defect. A display unit displays the report to a user.
摘要翻译： 提供了一种便于元件引线分析的系统，并且包括用于形成从其中提取图像的引线的图片以分配图像并执行该部分的第一和第二扫描的装置，以及包括 存储单元，其具有存储在其上的一组计算机可读可执行指令，所述一组计算机可读可执行指令在被执行时使得处理器接收每次扫描的数据，以基于任何一个部分的第一次扫描的数据建立规则， 判断一部分的第二扫描的数据表示缺陷，以确定每个第二扫描的规则符合性，以判断在不合规状态中的任何一秒扫描指示缺陷，并报告 缺陷。 显示单元向用户显示报告。
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公开(公告)号：US20080251289A1
公开(公告)日：2008-10-16
申请号：US12136308
申请日：2008-06-10
IPC分类号： H01R12/04
CPC分类号： H05K3/225 , H05K1/113 , H05K3/0047 , H05K3/3447 , H05K3/4046 , H05K2201/09845 , H05K2201/10303 , H05K2203/0191 , H05K2203/0242 , Y10T29/49174 , Y10T29/49179
摘要： Methods and devices are provided for repairing a damaged contact pad that is located on a first surface of a printed circuit board and connected to a via that passes through the circuit board. According to the method, a countersink hole is created in the first surface of the printed circuit board in a location that is substantially centered on an axis passing through the via, and a replacement structure is inserted into the countersink hole. The replacement structure has a stem portion, a head portion, and a shoulder portion that connects the stem and head portions, with the angle of the shoulder portion substantially matching the angle of the shoulder of the countersink hole. The stem portion of the replacement structure is permanently attached to sidewalls of the via so as to electrically couple the head portion of the replacement structure to the via.
摘要翻译： 提供了用于修复位于印刷电路板的第一表面上并连接到通过电路板的通孔的损坏的接触垫的方法和装置。 根据该方法，在印刷电路板的第一表面中形成基本上位于通过通孔的轴的中心的位置上形成埋头孔，并且将更换结构插入到埋头孔中。 替换结构具有杆部，头部和肩部，其连接杆和头部，肩部的角度基本上与埋头孔的肩部的角度相匹配。 替换结构的杆部分永久地附接到通孔的侧壁，以便将替换结构的头部部分电连接到通孔。
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7.发明授权公开(公告)号：US07216051B2
公开(公告)日：2007-05-08
申请号：US11137878
申请日：2005-05-26
CPC分类号： G01R31/025
摘要： A technique for testing an electronics assembly for a power short circuit is provided. The technique includes pre-characterizing power off resistance of an electronic component(s) of a first packaging level from at least one power boundary of the electronic component(s). The characterizing of the power off resistance occurs prior to placement of the electronic component(s) into an electronics assembly of a higher packaging level. The technique further includes determining actual power off resistance of the electronics component(s) after placement thereof into the electronics assembly, with the actual power off resistance being determined from the at least one power boundary. Thereafter, the actual power off resistance of the electronic component(s) in the electronics assembly is compared with the pre-characterized power off resistance of the at least one electronic component(s), and a determination is made therefrom whether a power short circuit exists within the electronics assembly.
摘要翻译： 提供了一种用于测试用于电源短路的电子组件的技术。 该技术包括从电子部件的至少一个电源边界预先表征第一封装级别的电子部件的断电电阻。 在将电子部件放置到更高封装水平的电子组件之前，断电阻力的表征发生。 该技术还包括在将电子元件放入电子组件之后确定电子元件的实际断电电阻，其中实际断电电阻是从至少一个电源边界确定的。 此后，将电子组件中的电子部件的实际断电电阻与至少一个电子部件的预表示的断电电阻进行比较，并且确定电力短路 存在于电子组件内。
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公开(公告)号：US07790985B2
公开(公告)日：2010-09-07
申请号：US12136308
申请日：2008-06-10
IPC分类号： H05K1/00
CPC分类号： H05K3/225 , H05K1/113 , H05K3/0047 , H05K3/3447 , H05K3/4046 , H05K2201/09845 , H05K2201/10303 , H05K2203/0191 , H05K2203/0242 , Y10T29/49174 , Y10T29/49179
摘要： Methods and devices are provided for repairing a damaged contact pad that is located on a first surface of a printed circuit board and connected to a via that passes through the circuit board. According to the method, a countersink hole is created in the first surface of the printed circuit board in a location that is substantially centered on an axis passing through the via, and a replacement structure is inserted into the countersink hole. The replacement structure has a stem portion, a head portion, and a shoulder portion that connects the stem and head portions, with the angle of the shoulder portion substantially matching the angle of the shoulder of the countersink hole. The stem portion of the replacement structure is permanently attached to sidewalls of the via so as to electrically couple the head portion of the replacement structure to the via.
摘要翻译： 提供了用于修复位于印刷电路板的第一表面上并连接到通过电路板的通孔的损坏的接触垫的方法和装置。 根据该方法，在印刷电路板的第一表面中形成基本上位于通过通孔的轴的中心的位置上形成埋头孔，并且将更换结构插入到埋头孔中。 替换结构具有杆部，头部和肩部，其连接杆和头部，肩部的角度基本上与埋头孔的肩部的角度相匹配。 替换结构的杆部分永久地附接到通孔的侧壁，以便将替换结构的头部部分电连接到通孔。
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公开(公告)号：US20080169119A1
公开(公告)日：2008-07-17
申请号：US11623484
申请日：2007-01-16
CPC分类号： H05K3/225 , H05K1/113 , H05K3/0047 , H05K3/3447 , H05K3/4046 , H05K2201/09845 , H05K2201/10303 , H05K2203/0191 , H05K2203/0242 , Y10T29/49174 , Y10T29/49179
摘要： Methods and devices are provided for repairing a damaged contact pad that is located on a first surface of a printed circuit board and connected to a via that passes through the circuit board. According to the method, a countersink hole is created in the first surface of the printed circuit board in a location that is substantially centered on an axis passing through the via, and a replacement structure is inserted into the countersink hole. The replacement structure has a stem portion, a head portion, and a shoulder portion that connects the stern and head portions, with the angle of the shoulder portion substantially matching the angle of the shoulder of the countersink hole. The stem portion of the replacement structure is permanently attached to sidewalls of the via so as to electrically couple the head portion of the replacement structure to the via.
摘要翻译： 提供了用于修复位于印刷电路板的第一表面上并连接到通过电路板的通孔的损坏的接触垫的方法和装置。 根据该方法，在印刷电路板的第一表面中形成基本上位于通过通孔的轴的中心的位置上形成埋头孔，并且将更换结构插入到埋头孔中。 替换结构具有杆部，头部和连接船头和头部的肩部，肩部的角度基本上与埋头孔的肩部的角度相匹配。 替换结构的杆部分永久地附接到通孔的侧壁，以便将替换结构的头部部分电连接到通孔。
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公开(公告)号：US6164633A
公开(公告)日：2000-12-26
申请号：US315380
申请日：1999-05-18
IPC分类号： B25B11/00 , H01L21/683
CPC分类号： B25B11/005 , H01L21/6838 , Y10S269/90
摘要： A vacuum holding chuck is presented. The vacuum holding chuck of the present invention is particularly well suited for holding semiconductor wafers of multiple diameters during various testing and manufacturing operations. In an exemplary embodiment, the vacuum chuck comprises a body having a first surface and an opposing second surface, wherein the first surface includes first and second recessed circular platforms to receive wafers having first and second diameters, respectively. The second surface includes at least one recessed circular platform to receive a wafer having a third diameter. Each circular platform is defined at least in part by an annular shoulder and each circular platform further includes a vacuum trough which is connected to a vacuum source which when activated, evacuates the air from the vacuum trough and securely holds a wafer in place within the circular platform.
摘要翻译： 提供真空保持卡盘。 本发明的真空保持卡盘在各种测试和制造操作中特别适用于保持多个直径的半导体晶片。 在示例性实施例中，真空卡盘包括具有第一表面和相对的第二表面的主体，其中第一表面包括分别具有第一和第二直径的第一和第二凹入圆形平台以接收晶片。 第二表面包括至少一个凹入的圆形平台以接收具有第三直径的晶片。 每个圆形平台至少部分地由环形肩部限定，并且每个圆形平台还包括真空槽，该真空槽连接到真空源，当真空源被激活时，将空气从真空槽排出并将晶片牢固地保持在圆形内的适当位置 平台。
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