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公开(公告)号：US20090238235A1
公开(公告)日：2009-09-24
申请号：US12053762
申请日：2008-03-24
CPC分类号： H05K7/20772 , G01N25/72 , G06F1/20 , G06F2200/201 , H05K7/20836
摘要： Method and apparatus are provided for detecting a defect in a cold plate, configured for cooling an electronics component. The method includes: establishing a first fluid flow through the cold plate, the first fluid flow being at a first temperature; impinging a second fluid flow onto the interface surface, the second fluid flow being at a second temperature, the first temperature and the second temperature being different temperatures; obtaining an isotherm mapping of the interface surface of the cold plate while the first fluid flow passes through the cold plate and the second fluid flow impinges onto the interface surface; and using the isotherm mapping to determine whether the cold plate has a defect. In one embodiment, an infrared-transparent manifold is employed in impinging the second fluid flow onto the interface surface, and the isotherm mapping of the interface surface is obtained through the infrared-transparent manifold.
摘要翻译： 提供了用于检测冷板中的缺陷的方法和装置，用于冷却电子部件。 该方法包括：建立通过冷板的第一流体流，第一流体流处于第一温度; 将第二流体流冲击到界面表面上，第二流体流处于第二温度，第一温度和第二温度是不同的温度; 当所述第一流体流过所述冷板并且所述第二流体流入所述界面时，获得所述冷板的界面的等温线映射; 并使用等温线映射来确定冷板是否有缺陷。 在一个实施例中，使用红外透明歧管将第二流体流注入界面表面，并且通过红外透明歧管获得界面表面的等温线映射。
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2.发明授权公开(公告)号：US07547231B1
公开(公告)日：2009-06-16
申请号：US12036878
申请日：2008-02-25
IPC分类号： H01R13/648
CPC分类号： H01R12/57 , H01R12/712 , H01R13/504 , H01R13/514
摘要： A large array connector is disclosed. The connector includes a plate comprising front, rear, top, bottom, first side, and second side portions. A plurality of guide blocks provide rigid support to at least the plate. A first guide block is mechanically coupled to a first end of the front portion. A second guide block is mechanically coupled to a second end of the front portion. A plurality of wafers is located between the first guide block and the second guide block. A front portion of each of the wafers is mateable with a mid-plane. A fill material is provided between a first portion of each of the wafers and the front portion of the plate. The fill material substantially mechanically couples the first portion of each of the wafers and the front portion of the plate, and provides rigid support to each of the wafers during plug-in with the mid-plane.
摘要翻译： 公开了一种大型阵列连接器。 连接器包括一个包括前，后，顶，底，第一侧和第二侧部的板。 多个引导块向至少该板提供刚性支撑。 第一引导块机械地联接到前部的第一端。 第二引导块机械地联接到前部的第二端。 多个晶片位于第一引导块和第二引导块之间。 每个晶片的前部可与中间平面配合。 在每个晶片的第一部分和板的前部之间提供填充材料。 填充材料基本上机械地联接每个晶片的第一部分和板的前部，并且在插入中间平面期间为每个晶片提供刚性支撑。
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公开(公告)号：US07520753B1
公开(公告)日：2009-04-21
申请号：US12058792
申请日：2008-03-31
IPC分类号： H01R12/00
CPC分类号： G01R1/0466 , G01R1/0408 , H01R12/714 , H01R13/2421 , H01R2201/20
摘要： A method of using a coil contact as an electrical interconnect includes inserting at least one coil contact into a dielectric plate or housing. The at least one coil contact includes a beryllium copper coil plated with gold and having a tapered shape such that each end has a diameter smaller than the diameter of a middle section. The housing comprises an upper half comprising a surface that slopes outwardly from a center of the housing towards a top opening, and a lower half comprising a surface that slopes outwardly from the center of the housing to a bottom opening. The sloping surfaces of the upper half and the lower half form a concave shape that captivates the middle section of the coil contact. Each end of the at least one coil contact extends to account for variations in surfaces of the processor and the circuit board.
摘要翻译： 使用线圈接触件作为电互连的方法包括将至少一个线圈接触件插入电介质板或壳体。 所述至少一个线圈触点包括镀有金的铍铜线圈，并且具有锥形形状，使得每个端部的直径小于中间部分的直径。 壳体包括上半部，其包括从壳体的中心朝向顶部开口向外倾斜的表面，并且下半部包括从壳体的中心向外倾斜到底部开口的表面。 上半部分和下半部分的倾斜表面形成一个凹陷的形状，其收缩线圈接触件的中间部分。 至少一个线圈接触件的每个端部延伸以考虑处理器和电路板的表面的变化。
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公开(公告)号：US08424201B2
公开(公告)日：2013-04-23
申请号：US12830774
申请日：2010-07-06
CPC分类号： H05K1/0271 , H01R12/716 , H01R12/721 , H05K3/341 , H05K3/3421 , H05K2201/068 , H05K2201/09063 , H05K2201/10189 , H05K2203/167 , Y02P70/613 , Y10T29/4913 , Y10T29/49144
摘要： Disclosed are an electronic component, an assembly of an electronic component and an electronic carrier substrate, and a method of connecting the electronic component to the carrier substrate. The carrier substrate has a first coefficient of thermal expansion (CTE), and the electronic component has a second CTE. The assembly further comprises a conductive material on the carrier substrate for connecting the electronic component to the carrier substrate, and the electrical component is connected to the carrier substrate by heating and then cooling this conductive material. The electronic component includes an expansion joint to allow the electronic component to expand and contract relative to the carrier substrate during the heating and cooling of the conductive material.
摘要翻译： 公开了电子部件，电子部件和电子载体基板的组件以及将电子部件连接到载体基板的方法。 载体衬底具有第一热膨胀系数（CTE），并且电子部件具有第二CTE。 组件还包括在载体基板上的用于将电子部件连接到载体基板的导电材料，并且电气部件通过加热连接到载体基板，然后冷却该导电材料。 电子部件包括膨胀接头，以在导电材料的加热和冷却期间允许电子部件相对于载体基板膨胀和收缩。
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5.发明授权Apparatus for controlling alignment between precision ground plates and method of controlling a desired alignment between opposing precision ground plates 失效用于控制精密接地板之间的对准的装置和控制相对的精密接地板之间期望对准的方法公开(公告)号：US08106331B2
公开(公告)日：2012-01-31
申请号：US11866470
申请日：2007-10-03
CPC分类号： B26D7/2628 , B26F1/02 , B26F1/04 , H05K1/0306 , H05K3/005 , H05K2203/0173 , H05K2203/1105 , Y10T83/2092 , Y10T83/9423 , Y10T83/943 , Y10T83/944
摘要： An apparatus for maintaining alignment between precision ground plates includes a first plate including a main body portion having plurality of passages. The first plate also includes a first heating device mounted to heat the main body portion to a selected temperature. A second plate including a main body portion having a plurality of passages is positioned adjacent the first plate. The second plate includes a second heating device mounted to heat the main body portion to a selected temperature. A controller operatively connected to the first and second heating devices selectively establishes a desired temperature in each of the first and second plates to facilitate a desired alignment between the plurality of passages in the first plate and the plurality of passages in the second plate.
摘要翻译： 用于保持精密接地板之间的对准的装置包括：第一板，包括具有多个通道的主体部分。 第一板还包括安装成将主体部分加热至选定温度的第一加热装置。 包括具有多个通道的主体部分的第二板位于第一板附近。 第二板包括安装成将主体部分加热至选定温度的第二加热装置。 可操作地连接到第一和第二加热装置的控制器选择性地在第一和第二板中的每一个中建立期望的温度，以促进第一板中的多个通道和第二板中的多个通道之间的期望对准。
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6.发明申请Surface Mount Array Connector Leads Planarization Using Solder Reflow Method 审中-公开表面贴装阵列连接器使用焊料回流法实现平面化公开(公告)号：US20090111299A1
公开(公告)日：2009-04-30
申请号：US11866728
申请日：2007-10-31
申请人： Michael J. Domitrovits , Raymond F. Frizzell, JR. , Wai Mon Ma , Cheikhou O. Ndiaye , Nandakumar N. Ranadive
发明人： Michael J. Domitrovits , Raymond F. Frizzell, JR. , Wai Mon Ma , Cheikhou O. Ndiaye , Nandakumar N. Ranadive
CPC分类号： H01R43/0249 , B23K1/0016 , B23K2101/40 , H01R43/0235 , H01R43/0256 , H05K3/3426 , H05K3/3484 , H05K2201/10189 , H05K2201/10984 , Y02P70/613
摘要： A connector and method for making wherein the connector has a connector body, connector leads extending from the connector body for solder connection to an electronic circuit wherein the connector leads do not extend a uniform distance from the body connector body. A solder paste is formed on each connector lead by stenciling it onto a flat plate that is non-wettable to the solder paste. The solder paste is composed of first solder particles having a first lower melting point and second solder particles having a second higher melting point. The solder paste is heated to the first melting point for adhering the solder paste to the connector leads while planarizing the solder covered electrical leads with the flat plate. The connector leads are soldered to an electrical circuit by removing the flat plate and heating the solder paste to the second higher melting point.
摘要翻译： 一种用于制造的连接器和方法，其中连接器具有连接器主体，从连接器主体延伸用于焊接连接到电子电路的连接器引线，其中连接器引线不延伸与主体连接器主体的均匀距离。 在每个连接器引线上形成焊膏，将其模版到不能焊接到焊膏上的平板上。 焊膏由具有第一较低熔点的第一焊料颗粒和具有第二较高熔点的第二焊料颗粒组成。 将焊膏加热到第一熔点，以将焊膏粘附到连接器引线上，同时用平板平坦化焊料覆盖的电引线。 通过去除平板并将焊膏加热到第二较高熔点，将连接器引线焊接到电路。
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公开(公告)号：US20110067910A1
公开(公告)日：2011-03-24
申请号：US12562499
申请日：2009-09-18
CPC分类号： H05K3/3421 , H05K3/3452 , H05K2201/10189 , H05K2203/0191 , H05K2203/167 , Y02P70/613 , Y10T29/4913
摘要： A system to secure a component to a circuit board may include a printed circuit board, a surface mounted component, and a lead carried by the surface mounted component. The system may also include a stencil adhered between at least one of the printed circuit board and the surface mounted component, and the lead adjacent the stencil.
摘要翻译： 将组件固定到电路板的系统可以包括印刷电路板，表面安装部件和由表面安装部件承载的引线。 该系统还可以包括粘附在印刷电路板和表面安装部件中的至少一个之间的模板以及与模板相邻的引线。
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公开(公告)号：US07791892B2
公开(公告)日：2010-09-07
申请号：US11669362
申请日：2007-01-31
IPC分类号： H05K1/14
CPC分类号： H05K1/0271 , H01R12/716 , H01R12/721 , H05K3/341 , H05K3/3421 , H05K2201/068 , H05K2201/09063 , H05K2201/10189 , H05K2203/167 , Y02P70/613 , Y10T29/4913 , Y10T29/49144
摘要： Disclosed are an electronic component, an assembly of an electronic component and an electronic carrier substrate, and a method of connecting the electronic component to the carrier substrate. The carrier substrate has a first coefficient of thermal expansion (CTE), and the electronic component has a second CTE. The assembly further comprises a conductive material on the carrier substrate for connecting the electronic component to the carrier substrate, and the electrical component is connected to the carrier substrate by heating and then cooling this conductive material. The electronic component includes an expansion joint to allow the electronic component to expand and contract relative to the carrier substrate during the heating and cooling of the conductive material.
摘要翻译： 公开了电子部件，电子部件和电子载体基板的组件以及将电子部件连接到载体基板的方法。 载体衬底具有第一热膨胀系数（CTE），并且电子部件具有第二CTE。 组件还包括在载体基板上的用于将电子部件连接到载体基板的导电材料，并且电气部件通过加热连接到载体基板，然后冷却该导电材料。 电子部件包括膨胀接头，以在导电材料的加热和冷却期间允许电子部件相对于载体基板膨胀和收缩。
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9.发明申请METHOD AND APPARATUS FOR CONTROLLING SIZE AND ALIGNMENT OF PRECISION GROUND PLATES 失效用于控制精密接地板尺寸和对准的方法和装置公开(公告)号：US20090090229A1
公开(公告)日：2009-04-09
申请号：US11866470
申请日：2007-10-03
IPC分类号： B26D7/06
CPC分类号： B26D7/2628 , B26F1/02 , B26F1/04 , H05K1/0306 , H05K3/005 , H05K2203/0173 , H05K2203/1105 , Y10T83/2092 , Y10T83/9423 , Y10T83/943 , Y10T83/944
摘要： An apparatus for maintaining alignment between precision ground plates includes a first plate including a main body portion having plurality of passages. The first plate also includes a first heating device mounted to heat the main body portion to a selected temperature. A second plate including a main body portion having a plurality of passages is positioned adjacent the first plate. The second plate includes a second heating device mounted to heat the main body portion to a selected temperature. A controller operatively connected to the first and second heating devices selectively establishes a desired temperature in each of the first and second plates to facilitate a desired alignment between the plurality of passages in the first plate and the plurality of passages in the second plate.
摘要翻译： 用于保持精密接地板之间的对准的装置包括：第一板，包括具有多个通道的主体部分。 第一板还包括安装成将主体部分加热至选定温度的第一加热装置。 包括具有多个通道的主体部分的第二板位于第一板附近。 第二板包括安装成将主体部分加热至选定温度的第二加热装置。 可操作地连接到第一和第二加热装置的控制器选择性地在第一和第二板中的每一个中建立期望的温度，以促进第一板中的多个通道和第二板中的多个通道之间的期望对准。
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公开(公告)号：US20080172853A1
公开(公告)日：2008-07-24
申请号：US11626623
申请日：2007-01-24
CPC分类号： H01R43/205 , Y10T29/49153 , Y10T29/4921 , Y10T29/49822 , Y10T29/53274 , Y10T29/53283 , Y10T156/1168
摘要： A method and apparatus are provided for removing a component from a medium, where the apparatus includes an attachment member insertable into a portion of a component, an amount of adhesive for adhering the attachment member to the component, and a pulling element. The method includes pulling, with the pulling element, the attachment member in a direction opposite a medium in which the component is inserted.
摘要翻译： 提供了一种用于从介质中去除部件的方法和装置，其中该装置包括可插入到部件的一部分中的附接部件，用于将附接部件粘附到部件上的粘合剂的量以及牵引元件。 所述方法包括以与所述部件插入的介质相反的方向拉动所述附接构件。
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