公开(公告)号：US07489914B2

公开(公告)日：2009-02-10

申请号：US11114733

申请日：2005-04-25

申请人： Vinu Govind ,  Sidharth Dalmia ,  Amit Bavisi ,  Venkatesh Sundraram ,  Madhavan Swaminathan ,  George White

发明人： Vinu Govind ,  Sidharth Dalmia ,  Amit Bavisi ,  Venkatesh Sundraram ,  Madhavan Swaminathan ,  George White

IPC分类号： H04B1/18

CPC分类号： H01P1/20381 ,  H01L2224/16227 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/19105 ,  H03B5/1203 ,  H03B5/1215 ,  H03B5/1228 ,  H03B5/1231 ,  H03F3/195 ,  H03F2200/111 ,  H03H7/09 ,  H03H7/1775 ,  H03H7/38 ,  H03H7/46 ,  H03H2001/0085 ,  H05K1/024 ,  H05K1/16 ,  H05K3/4623 ,  H05K3/4626

摘要： The present invention allows for the use of chip-package co-design of RF transceivers and their components by using discrete active devices in conjunction with passive components. Two particular components are described, including voltage controlled oscillators (VCOs) and low noise amplifiers (LNAs). The high quality passive components for use in the VCOs and LNAs may be obtained by the use of embedded passives in organic substrates. Further, the embedded passives may have multi-band characteristics, thereby allowing multi-band VCOs and LNAs to be implemented with fewer components. In situations where size is a concern, the active devices and passive components utilized in an RF transceiver may be implemented in a low form factor module of less than 1.1 mm thick according to an embodiment of the invention.

摘要翻译： 本发明允许通过使用分立的有源器件结合无源部件来使用RF收发器及其部件的芯片封装的共同设计。 描述了两个特定的部件，包括压控振荡器（VCO）和低噪声放大器（LNA）。 用于VCO和LNA的高品质无源元件可以通过在有机衬底中使用嵌入式无源器来获得。 此外，嵌入式无源器件可以具有多频带特性，从而允许以更少的部件实现多频带VCO和LNA。 在尺寸是关注的情况下，根据本发明的实施例，在RF收发器中使用的有源器件和无源部件可以以小于1.1mm厚的低形状因子模块来实现。

公开(公告)号：US20050248418A1

公开(公告)日：2005-11-10

申请号：US11114733

申请日：2005-04-25

申请人： Vinu Govind ,  Sidharth Dalmia ,  Amit Bavisi ,  Venkatesh Sundraram ,  Madhavan Swaminathan ,  George White

发明人： Vinu Govind ,  Sidharth Dalmia ,  Amit Bavisi ,  Venkatesh Sundraram ,  Madhavan Swaminathan ,  George White

IPC分类号： H01P1/203 ,  H03B1/00 ,  H03B5/12 ,  H03H7/09 ,  H03H7/38 ,  H03H7/46 ,  H03H11/00 ,  H05K1/02 ,  H05K1/16 ,  H05K3/46

CPC分类号： H01P1/20381 ,  H01L2224/16227 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/19105 ,  H03B5/1203 ,  H03B5/1215 ,  H03B5/1228 ,  H03B5/1231 ,  H03F3/195 ,  H03F2200/111 ,  H03H7/09 ,  H03H7/1775 ,  H03H7/38 ,  H03H7/46 ,  H03H2001/0085 ,  H05K1/024 ,  H05K1/16 ,  H05K3/4623 ,  H05K3/4626

摘要： The present invention allows for the use of chip-package co-design of RF transceivers and their components by using discrete active devices in conjunction with passive components. Two particular components are described, including voltage controlled oscillators (VCOs) and low noise amplifiers (LNAs). The high quality passive components for use in the VCOs and LNAs may be obtained by the use of embedded passives in organic substrates. Further, the embedded passives may have multi-band characteristics, thereby allowing multi-band VCOs and LNAs to be implemented with fewer components. In situations where size is a concern, the active devices and passive components utilized in an RF transceiver may be implemented in a low form factor module of less than 1.1 mm thick according to an embodiment of the invention.

摘要翻译： 本发明允许通过使用分立的有源器件结合无源部件来使用RF收发器及其部件的芯片封装的共同设计。 描述了两个特定的部件，包括压控振荡器（VCO）和低噪声放大器（LNA）。 用于VCO和LNA的高品质无源元件可以通过在有机衬底中使用嵌入式无源器来获得。 此外，嵌入式无源器件可以具有多频带特性，从而允许以更少的部件实现多频带VCO和LNA。 在尺寸是关注的情况下，根据本发明的实施例，在RF收发器中使用的有源器件和无源部件可以以小于1.1mm厚的低形状因子模块来实现。