公开(公告)号：US20120329231A1

公开(公告)日：2012-12-27

申请号：US13603100

申请日：2012-09-04

申请人： Vladimir Mikhalev ,  Jim Fulford ,  Yongjun Jeff Hu ,  Gordon A. Haller ,  Lequn Liu

发明人： Vladimir Mikhalev ,  Jim Fulford ,  Yongjun Jeff Hu ,  Gordon A. Haller ,  Lequn Liu

IPC分类号： H01L21/762 ,  H01L21/336

CPC分类号： H01L21/823462 ,  H01L21/02107 ,  H01L21/02164 ,  H01L21/02282 ,  H01L21/265 ,  H01L21/76224 ,  H01L21/76832 ,  H01L21/76834 ,  H01L21/823425 ,  H01L21/823481 ,  H01L29/66575 ,  H01L29/78 ,  H01L29/7846

摘要： Some embodiments include methods of forming isolation structures. A semiconductor base may be provided to have a crystalline semiconductor material projection between a pair of openings. SOD material (such as, for example, polysilazane) may be flowed within said openings to fill the openings. After the openings are filled with the SOD material, one or more dopant species may be implanted into the projection to amorphize the crystalline semiconductor material within an upper portion of said projection. The SOD material may then be annealed at a temperature of at least about 400° C. to form isolation structures. Some embodiments include semiconductor constructions that include a semiconductor material base having a projection between a pair of openings. The projection may have an upper region over a lower region, with the upper region being at least 75% amorphous, and with the lower region being entirely crystalline.

摘要翻译： 一些实施方案包括形成隔离结构的方法。 可以提供半导体基底以在一对开口之间具有晶体半导体材料突起。 SOD材料（例如，聚硅氮烷）可以在所述开口内流动以填充开口。 在用SOD材料填充开口之后，可以将一种或多种掺杂剂物质注入到投影中，使晶体半导体材料在所述突起的上部非晶化。 然后可以在至少约400℃的温度下对SOD材料进行退火以形成隔离结构。 一些实施例包括半导体结构，其包括在一对开口之间具有突起的半导体材料基底。 突起可以在下部区域上方具有上部区域，其中上部区域为至少75％的无定形，并且下部区域是完全结晶的。

公开(公告)号：US08906771B2

公开(公告)日：2014-12-09

申请号：US13603100

申请日：2012-09-04

申请人： Vladimir Mikhalev ,  Jim Fulford ,  Yongjun Jeff Hu ,  Gordon A. Haller ,  Lequn Liu

发明人： Vladimir Mikhalev ,  Jim Fulford ,  Yongjun Jeff Hu ,  Gordon A. Haller ,  Lequn Liu

IPC分类号： H01L21/336 ,  H01L21/8234 ,  H01L21/768 ,  H01L21/02 ,  H01L21/265 ,  H01L29/78 ,  H01L29/66

CPC分类号： H01L21/823462 ,  H01L21/02107 ,  H01L21/02164 ,  H01L21/02282 ,  H01L21/265 ,  H01L21/76224 ,  H01L21/76832 ,  H01L21/76834 ,  H01L21/823425 ,  H01L21/823481 ,  H01L29/66575 ,  H01L29/78 ,  H01L29/7846

摘要： Some embodiments include methods of forming isolation structures. A semiconductor base may be provided to have a crystalline semiconductor material projection between a pair of openings. SOD material (such as, for example, polysilazane) may be flowed within said openings to fill the openings. After the openings are filled with the SOD material, one or more dopant species may be implanted into the projection to amorphize the crystalline semiconductor material within an upper portion of said projection. The SOD material may then be annealed at a temperature of at least about 400° C. to form isolation structures. Some embodiments include semiconductor constructions that include a semiconductor material base having a projection between a pair of openings. The projection may have an upper region over a lower region, with the upper region being at least 75% amorphous, and with the lower region being entirely crystalline.

摘要翻译： 一些实施方案包括形成隔离结构的方法。 可以提供半导体基底以在一对开口之间具有晶体半导体材料突起。 SOD材料（例如，聚硅氮烷）可以在所述开口内流动以填充开口。 在用SOD材料填充开口之后，可以将一种或多种掺杂剂物质注入到投影中，使晶体半导体材料在所述突起的上部非晶化。 然后可以在至少约400℃的温度下对SOD材料进行退火以形成隔离结构。 一些实施例包括半导体结构，其包括在一对开口之间具有突起的半导体材料基底。 突起可以在下部区域上方具有上部区域，其中上部区域为至少75％的无定形，并且下部区域是完全结晶的。

公开(公告)号：US08274081B2

公开(公告)日：2012-09-25

申请号：US12728942

申请日：2010-03-22

申请人： Vladimir Mikhalev ,  Jim Fulford ,  Yongjun Jeff Hu ,  Gordon A. Haller ,  Lequn Liu

发明人： Vladimir Mikhalev ,  Jim Fulford ,  Yongjun Jeff Hu ,  Gordon A. Haller ,  Lequn Liu

IPC分类号： H01L29/04 ,  H01L33/16

CPC分类号： H01L21/823462 ,  H01L21/02107 ,  H01L21/02164 ,  H01L21/02282 ,  H01L21/265 ,  H01L21/76224 ,  H01L21/76832 ,  H01L21/76834 ,  H01L21/823425 ,  H01L21/823481 ,  H01L29/66575 ,  H01L29/78 ,  H01L29/7846

摘要： Some embodiments include methods of forming isolation structures. A semiconductor base may be provided to have a crystalline semiconductor material projection between a pair of openings. SOD material (such as, for example, polysilazane) may be flowed within said openings to fill the openings. After the openings are filled with the SOD material, one or more dopant species may be implanted into the projection to amorphize the crystalline semiconductor material within an upper portion of said projection. The SOD material may then be annealed at a temperature of at least about 400° C. to form isolation structures. Some embodiments include semiconductor constructions that include a semiconductor material base having a projection between a pair of openings. The projection may have an upper region over a lower region, with the upper region being at least 75% amorphous, and with the lower region being entirely crystalline.

摘要翻译： 一些实施方案包括形成隔离结构的方法。 可以提供半导体基底以在一对开口之间具有晶体半导体材料突起。 SOD材料（例如，聚硅氮烷）可以在所述开口内流动以填充开口。 在用SOD材料填充开口之后，可以将一种或多种掺杂剂物质注入到投影中，使晶体半导体材料在所述突起的上部非晶化。 然后可以在至少约400℃的温度下对SOD材料进行退火以形成隔离结构。 一些实施例包括半导体结构，其包括在一对开口之间具有突起的半导体材料基底。 突起可以在下部区域上方具有上部区域，其中上部区域为至少75％的无定形，并且下部区域是完全结晶的。

公开(公告)号：US20110227071A1

公开(公告)日：2011-09-22

申请号：US12728942

申请日：2010-03-22

申请人： Vladimir Mikhalev ,  Jim Fulford ,  Yongjun Jeff Hu ,  Gordon A. Haller ,  Lequn Liu

发明人： Vladimir Mikhalev ,  Jim Fulford ,  Yongjun Jeff Hu ,  Gordon A. Haller ,  Lequn Liu

IPC分类号： H01L29/78 ,  H01L21/8234 ,  H01L21/22 ,  H01L21/336

CPC分类号： H01L21/823462 ,  H01L21/02107 ,  H01L21/02164 ,  H01L21/02282 ,  H01L21/265 ,  H01L21/76224 ,  H01L21/76832 ,  H01L21/76834 ,  H01L21/823425 ,  H01L21/823481 ,  H01L29/66575 ,  H01L29/78 ,  H01L29/7846

摘要： Some embodiments include methods of forming isolation structures. A semiconductor base may be provided to have a crystalline semiconductor material projection between a pair of openings. SOD material (such as, for example, polysilazane) may be flowed within said openings to fill the openings. After the openings are filled with the SOD material, one or more dopant species may be implanted into the projection to amorphize the crystalline semiconductor material within an upper portion of said projection. The SOD material may then be annealed at a temperature of at least about 400° C. to form isolation structures. Some embodiments include semiconductor constructions that include a semiconductor material base having a projection between a pair of openings. The projection may have an upper region over a lower region, with the upper region being at least 75% amorphous, and with the lower region being entirely crystalline.

摘要翻译： 一些实施方案包括形成隔离结构的方法。 可以提供半导体基底以在一对开口之间具有晶体半导体材料突起。 SOD材料（例如，聚硅氮烷）可以在所述开口内流动以填充开口。 在用SOD材料填充开口之后，可以将一种或多种掺杂剂物质注入到投影中，使晶体半导体材料在所述突起的上部非晶化。 然后可以在至少约400℃的温度下对SOD材料进行退火以形成隔离结构。 一些实施例包括半导体结构，其包括在一对开口之间具有突起的半导体材料基底。 突起可以在下部区域上方具有上部区域，其中上部区域为至少75％的无定形，并且下部区域是完全结晶的。