MODULAR JACK WITH REMOVABLE CONTACT ARRAY
    3.
    发明申请
    MODULAR JACK WITH REMOVABLE CONTACT ARRAY 审中-公开
    具有可拆卸接触阵列的模块式插座

    公开(公告)号:US20080311794A1

    公开(公告)日:2008-12-18

    申请号:US12191507

    申请日:2008-08-14

    IPC分类号: H01R13/66 H01R24/00

    摘要: A modular jack includes a housing having a socket and an opening arranged to receive a modular plug into the socket, and a sled including a contact array arranged within the socket, wherein the sled is removable from the socket through the opening of the housing without disassembling the housing.

    摘要翻译: 模块化插座包括具有插座和开口的开口,所述开口布置成将模块插头接纳到插座中,以及滑架,其包括布置在插座内的接触阵列,其中,所述滑座可从所述插座穿过所述壳体的开口而不拆卸 住房。