公开(公告)号：US11177241B2

公开(公告)日：2021-11-16

申请号：US16814761

申请日：2020-03-10

申请人： WESTERN DIGITAL TECHNOLOGIES, INC.

发明人： Junrong Yan ,  Jianming Zhang ,  Min Zhao ,  Kailei Zhang ,  Chee Keong Chin ,  Kim Lee Bock

IPC分类号： H01L25/065 ,  H01L23/00

摘要： A semiconductor device is disclosed including a die stack including a number of dies aligned with each other with respect to an axis, and a top die that is offset along the axis the to prevent die cracking.

公开(公告)号：US20230137512A1

公开(公告)日：2023-05-04

申请号：US17517911

申请日：2021-11-03

申请人： WESTERN DIGITAL TECHNOLOGIES, INC.

发明人： Hui Xu ,  Kim Lee Bock ,  Rama Shukla ,  Chong Un Tan ,  Yoong Tatt Chin ,  Shrikar Bhagath

IPC分类号： H05K1/02 ,  H05K1/11

摘要： A semiconductor memory device, also referred to as a solid state drive, includes thermally conductive components such as a conductive coating to draw heat away from the semiconductive package. The coating may also be electrically conductive to provide shielding from and absorption of electromagnetic interference. In examples, a semiconductor device including a substrate may be affixed to an edge connector printed circuit board with solder balls to form a solid state drive. In further examples, the substrate may be omitted, and semiconductor memory dies, a controller die and other electronic components may be directly surface mounted to an edge connector printed circuit board to form a solid state drive.

公开(公告)号：US20230411340A1

公开(公告)日：2023-12-21

申请号：US17746104

申请日：2022-05-17

申请人： WESTERN DIGITAL TECHNOLOGIES, INC.

发明人： Lee Kong Yu ,  Yoong Tatt Chin ,  Kim Lee Bock ,  Paramjeet Gill ,  Wei Chiat Teng ,  Chong Un Tan

IPC分类号： H01L23/00 ,  G11C5/06 ,  G11C5/04

CPC分类号： H01L24/46 ,  G11C5/063 ,  H01L2924/1434 ,  H01L2224/46 ,  G11C5/04

摘要： A semiconductor device includes a signal carrier medium such as a PCB substrate having first and second opposed surfaces and a cavity formed in the second surface. A first set of one or more semiconductor dies are mounted on the first surface, and a second set of one or more semiconductor dies are mounted within the cavity. The first and/or second sets of semiconductor dies may be memory dies.

公开(公告)号：US20200381401A1

公开(公告)日：2020-12-03

申请号：US16814761

申请日：2020-03-10

申请人： WESTERN DIGITAL TECHNOLOGIES, INC.

发明人： Junrong Yan ,  Jianming Zhang ,  Min Zhao ,  Kailei Zhang ,  Chee Keong Chin ,  Kim Lee Bock

IPC分类号： H01L25/065 ,  H01L23/00

摘要： A semiconductor device is disclosed including a die stack including a number of dies aligned with each other with respect to an axis, and a top die that is offset along the axis the to prevent die cracking.