Heat assisted perpendicular spin transfer torque MRAM memory cell

    公开(公告)号:US10777248B1

    公开(公告)日:2020-09-15

    申请号:US16459389

    申请日:2019-07-01

    摘要: A magnetoresistive random access memory (MRAM) memory cell comprises a pinned layer having fixed direction of magnetization that is perpendicular to a plane of the pinned layer, a first free layer having a direction of magnetization that can be switched and is perpendicular to a plane of the first free layer, a tunnel barrier positioned between the pinned layer and the first free layer, a second free layer having a direction of magnetization that can be switched, and a spacer layer positioned between the first free layer and the second free layer. Temperature dependence of coercivity of the second free layer is greater than temperature dependence of coercivity of the first free layer.

    Perpendicular SOT MRAM
    4.
    发明授权

    公开(公告)号:US10891999B1

    公开(公告)日:2021-01-12

    申请号:US16458651

    申请日:2019-07-01

    IPC分类号: G11C11/16 H01L43/08 H01L43/06

    摘要: A MRAM memory cell comprises a SHE layer, a magnetic bit layer with perpendicular anisotropy and an Oersted layer. The magnetic bit layer has a switchable direction of magnetization in order to store data. Data is written to the MRAM memory cell using the Spin Hall Effect so that spin current generated in the SHE layer exerts a torque on the magnetic bit layer while the Oersted layer provides heat and an Oersted field to enable deterministic switching. Data is read form the MRAM memory cell using the Anomalous Hall Effect and sensing voltage at the Oersted layer.

    Perpendicular spin transfer torque MRAM memory cell with in-stack thermal barriers

    公开(公告)号:US11004489B2

    公开(公告)日:2021-05-11

    申请号:US16459369

    申请日:2019-07-01

    摘要: A perpendicular spin transfer torque MRAM memory cell includes a magnetic tunnel junction stack comprising a pinned layer having a fixed direction of magnetization, a free layer having a direction of magnetization that can be switched, a tunnel barrier between the pinned layer and the free layer, a cap layer above the free layer and one or more in-stack multi-layer thermal barrier layers having multiple internal interfaces between materials. The thermal barrier layers have high enough thermal resistivity to maintain the heat generated in the memory cell and low enough electrical resistivity to not materially change the electrical resistance of the memory cell. One embodiment further includes a thermal barrier liner surrounding the free layer, pinned layer, tunnel barrier and cap layer.