公开(公告)号：US11784155B2

公开(公告)日：2023-10-10

申请号：US17702868

申请日：2022-03-24

Applicant: WOLFSPEED, INC.

Inventor： Sung Chul Joo ,  Jack Powell ,  Donald Farrell ,  Bradley Millon

IPC: H01L23/66 ,  H01L23/00 ,  H01P11/00 ,  H01P3/00

CPC classification number: H01L24/37 ,  H01L23/562 ,  H01L23/66 ,  H01L24/35 ,  H01L24/40 ,  H01L24/84 ,  H01P3/003 ,  H01P11/003 ,  H01L2223/6627 ,  H01L2224/37012 ,  H01L2224/40157 ,  H01L2924/19033 ,  H01L2924/35121

Abstract: A system configured to increase a reliability of electrical connections in a device. The system including a lead configured to electrically connect a pad of at least one support structure to a pad of at least one electrical component. The lead includes an upper portion that includes a lower surface arranged on a lower surface thereof. The lower surface of the upper portion is arranged vertically above a first upper surface of a first pad connection portion; and the lower surface of the upper portion is arranged vertically above a second upper surface of the second pad connection portion. A process configured to increase a reliability of electrical connections in a device is also disclosed.

公开(公告)号：US20230019230A1

公开(公告)日：2023-01-19

申请号：US17935509

申请日：2022-09-26

Applicant: Wolfspeed, Inc.

Inventor： Sung Chul Joo ,  Alexander Komposch ,  Brian William Condie ,  Benjamin Law ,  Jae Hyung Jeremiah Park

IPC: H01L23/00

Abstract: A semiconductor device package includes a substrate, a silicon (Si) or silicon carbide (SiC) semiconductor die, and a metal layer on a surface of the semiconductor die. The metal layer includes a bonding surface that is attached to a surface of the substrate by a die attach material. The bonding surface includes opposing edges that extend along a perimeter of the semiconductor die, and one or more non-orthogonal corners that are configured to reduce stress at an interface between the bonding surface and the die attach material. Related devices and fabrication methods are also discussed.