Drive method of liquid crystal display device and liquid crystal display device

    公开(公告)号:US10210831B2

    公开(公告)日:2019-02-19

    申请号:US15505104

    申请日:2016-12-27

    Abstract: The present provides a drive method of a liquid crystal display device and a liquid crystal display device. By burning sets of OTP data corresponding to the use durations which are different in a drive chip, and each set of OTP data comprises a gamma datum and a Vcom datum, and the liquid crystal display device selects the OTP data corresponding to the use duration according to the present use duration, and uses the gamma datum and the Vcom datum in the set of OTP data to drive a display panel to perform image display for avoiding that the gamma value deviates from the target gamma value, and the Vcom deviates from the best Vcom to ensure that the liquid crystal display device always uses the target gamma value and the best Vcom for driving, and always guarantee the display result and quality of the panel.

    Touch display device and improvement method therefor

    公开(公告)号:US10203787B2

    公开(公告)日:2019-02-12

    申请号:US15127459

    申请日:2016-08-17

    Abstract: A touch display device and an improvement method to a touch display device are disclosed. The improvement method first determines whether the touch display device turns on the touch mode. If yes, image data input to the touch display device is obtained and feature data is extracted from the image data. Then, adjustment or compensation factors are obtained according to the feature data. Grey level compensation sequence is also obtained. The duty cycle of the control signal for the touch display device is adjusted according to the factors and the grey level compensation sequence, so as to improve the display difference for a same grey level image due to the turning on of the touch mode.

    ARRAY SUBSTRATE AND CHIP BONDING METHOD

    公开(公告)号:US20210091027A1

    公开(公告)日:2021-03-25

    申请号:US16308484

    申请日:2018-09-27

    Abstract: The invention provides an array substrate and chip bonding method, the array substrate comprising: an active area, and a bonding area located around the active area, wherein the bonding area is provided with an input terminal group, a first output terminal group and a second output terminal a group; the first output terminal group is located at a side of the input terminal group away from the active area, and the second output terminal group is located between the first output terminal group and the input terminal group; when bonding chips, the first output terminal group or the second output terminal group is selected to cooperate with the input terminal group for chip bonding according to the chip type. By simultaneously providing the first and second output terminal groups, the bonding of the second type chip increases the distance between the chip and the edge of the array substrate.

    Narrow-bezel display panel and display device

    公开(公告)号:US11294210B2

    公开(公告)日:2022-04-05

    申请号:US16615354

    申请日:2019-11-06

    Abstract: A narrow-bezel display panel includes a display region, a lower border, a driving chip, and a flexible circuit board. The lower border is connected to the display region. The driving chip is placed in the lower border. The flexible circuit board is arranged in the lower border and electrically connected to the driving chip. The driving chip is provided with an accommodating region toward the flexible circuit board, and the accommodating region receives one end of the flexible circuit board. Accordingly, a size of the lower border of the display panel is reduced.

    Array substrate and chip bonding method

    公开(公告)号:US11101230B2

    公开(公告)日:2021-08-24

    申请号:US16308484

    申请日:2018-09-27

    Abstract: The invention provides an array substrate and chip bonding method, the array substrate comprising: an active area, and a bonding area located around the active area, wherein the bonding area is provided with an input terminal group, a first output terminal group and a second output terminal a group; the first output terminal group is located at a side of the input terminal group away from the active area, and the second output terminal group is located between the first output terminal group and the input terminal group; when bonding chips, the first output terminal group or the second output terminal group is selected to cooperate with the input terminal group for chip bonding according to the chip type. By simultaneously providing the first and second output terminal groups, the bonding of the second type chip increases the distance between the chip and the edge of the array substrate.

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