PACKING OF POLYSILICON
    1.
    发明申请
    PACKING OF POLYSILICON 有权
    多晶硅包装

    公开(公告)号:US20140151259A1

    公开(公告)日:2014-06-05

    申请号:US14072277

    申请日:2013-11-05

    申请人: Wacker Chemie AG

    发明人: Hanns WOCHNER

    IPC分类号: B65D33/00 B65B3/04

    摘要: A bag contains polysilicon, has been welded and includes at least one weld seam and a polyethylene film having: a thickness of 150-900 μm; a stiffness at a flexural modulusFmax of 300-2000 mN and Ft of 100-1300 mN; a fracture force F determined by dynamic penetration testing of 200-1500 N; a fracture energy Ws of 2-30 J; a penetration energy Wtot of 2.2-30 J; a film tensile stress at 15% longitudinal and transverse elongation of 9-50 MPa; an Elmendorf longitudinal film tear resistance of 10-60 cN; an Elmendorf transverse film tear resistance of 18-60 cN; a longitudinal film elongation at break of 300-2000%; a transverse film elongation at break of 450-3000%; and a weld seam strength of 25-150 N/15 mm. A method includes filling a bag with polysilicon, and welding by pulse sealing with contact pressure greater than 0.01 N/mm2 to obtain a 25-150 N/15 mm weld seam strength.

    摘要翻译: 包含多晶硅的袋子已被焊接并且包括至少一个焊缝和聚乙烯膜,其具有150-900μm的厚度; 弯曲弹性模量Fmax为300-2000mN,Ft为100-1300mN; 通过动态穿透测试确定的断裂力F为200-1500 N; 断裂能Ws为2-30J; 渗透能量Wtot为2.2-30 J; 薄膜拉伸应力在15%纵向和横向延伸率为9-50MPa; Elmendorf纵向膜的抗撕裂性为10-60 cN; Elmendorf横向膜的抗撕裂强度为18-60 cN; 纵向膜断裂伸长率为300-2000%; 横断膜伸长率为450-3000%; 焊缝强度为25-150 N / 15 mm。 一种方法包括用多晶硅填充袋,并通过脉冲密封焊接接触压力大于0.01N / mm2,以获得25-150N / 15mm的焊缝强度。

    PROCESS FOR PRODUCING POLYCRYSTALLINE SILICON
    3.
    发明申请
    PROCESS FOR PRODUCING POLYCRYSTALLINE SILICON 有权
    生产多晶硅的工艺

    公开(公告)号:US20160273099A1

    公开(公告)日:2016-09-22

    申请号:US15032227

    申请日:2014-10-17

    申请人: WACKER CHEMIE AG

    发明人: Hanns WOCHNER

    IPC分类号: C23C16/442 C01B33/03

    摘要: Polycrystalline silicon having a low P, B, and other extraneous element contamination is produced by performing at least one process step in a cleanroom of class 1 to 100,000, wherein air is conducted into the cleanroom through at least one filter for separating particles ≧1 μm, and one filter for particles

    摘要翻译: 通过在1至100,000级的洁净室中进行至少一个工艺步骤来生产具有低P,B和其他外来元素污染物的多晶硅,其中通过至少一个用于分离≧1μm以上的颗粒的过滤器将空气导入洁净室 ,和一个小于1μm的颗粒过滤器,过滤器由低污染材料制成。

    POLYCRYSTALLINE SILICON CHUNKS AND METHOD FOR PRODUCING THEM
    5.
    发明申请
    POLYCRYSTALLINE SILICON CHUNKS AND METHOD FOR PRODUCING THEM 有权
    多晶硅切片及其制造方法

    公开(公告)号:US20140037959A1

    公开(公告)日:2014-02-06

    申请号:US13952050

    申请日:2013-07-26

    申请人: Wacker Chemie AG

    IPC分类号: C01B33/037 B02C19/00

    摘要: The present invention relates to polycrystalline silicon chunks which are cubic and have a metal content of less than 200 pptw and a dopant content of less than 50 ppta. Methods for producing polycrystalline silicon chunks, include the steps of providing a polycrystalline silicon rod, comminuting the polycrystalline silicon rod into cubic chunks, and cleaning the polycrystalline silicon chunks, wherein comminution takes place using a spiked-roll crusher having at least one spiked roll, the spiked roll including W2C phases or WC phases with 0.1-10% of a metal carbide selected from the group consisting of titanium carbide, chromium carbide, molybdenum carbide, vanadium carbide, and nickel carbide or consisting of steel with 1-25% W.

    摘要翻译: 本发明涉及立方体并且金属含量小于200pptw并且掺杂剂含量小于50ppta的多晶硅块。 制造多晶硅块的方法包括以下步骤:提供多晶硅棒,将多晶硅棒粉碎成立方体块,以及清洗多晶硅块,其中使用具有至少一个加标辊的加标辊式破碎机进行粉碎, 所述加标辊包括W2C相或WC相,其中0.1-10%的选自碳化钛,碳化铬,碳化钼,碳化钒和碳化镍的金属碳化物或由1-25%W的钢组成。