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    Heatsink allowing in-situ maintenance in a stackable module
    1.
    发明授权
    Heatsink allowing in-situ maintenance in a stackable module 有权
    散热器允许在可堆叠模块中进行现场维护

    公开(公告)号：US08279597B2

    公开(公告)日：2012-10-02

    申请号：US12788925

    申请日：2010-05-27

    申请人： Wael R. El-Essawy ,  Elmootazbellah N. Elnozahy ,  Madhusudan K. Iyengar ,  Thomas W. Keller, Jr. ,  Juan C. Rubio

    发明人： Wael R. El-Essawy ,  Elmootazbellah N. Elnozahy ,  Madhusudan K. Iyengar ,  Thomas W. Keller, Jr. ,  Juan C. Rubio

    IPC分类号： H05K7/20 ,  F28F7/00 ,  H05K5/00

    CPC分类号： H05K7/20 ,  G06F1/181 ,  G06F1/20

    摘要： A modular processing module allowing in-situ maintenance is provided. The modular processing module comprises a set of processing module sides. Each processing module side comprises a circuit board, a plurality of connectors, and a plurality of processing nodes. Each processing module side couples to another processing module side using at least one connector in the plurality of connectors such that, when all of the set of processing module sides are coupled together, the modular processing module is formed. The modular processing module comprises an exterior connection to a power source and a communication system and at least one heatsink that couples to at least a portion of the plurality of processing nodes on one of the processing module sides and is designed such that, when a set of heatsinks in the modular processing module are installed, an empty space is left in a center of the modular processing module.

    摘要翻译： 提供允许现场维护的模块化处理模块。 模块化处理模块包括一组处理模块侧面。 每个处理模块侧包括电路板，多个连接器和多个处理节点。 每个处理模块侧使用多个连接器中的至少一个连接器耦合到另一个处理模块侧，使得当所述一组处理模块侧面都耦合在一起时，形成模块化处理模块。 模块化处理模块包括到电源和通信系统的外部连接以及耦合到处理模块侧之一上的多个处理节点的至少一部分的至少一个散热器，并被设计成使得当一组 在模块化处理模块中安装散热器，在模块化处理模块的中心留有空的空间。

    Heatsink Allowing In-Situ Maintenance in a Stackable Module
    4.
    发明申请
    Heatsink Allowing In-Situ Maintenance in a Stackable Module 有权
    散热器可以在可堆叠模块中进行原位维护

    公开(公告)号：US20110292596A1

    公开(公告)日：2011-12-01

    申请号：US12788925

    申请日：2010-05-27

    申请人： Wael R. El-Essawy ,  Elmootazbellah N. Elnozahy ,  Madhusudan K. Iyengar ,  Thomas W. Keller, JR. ,  Juan C. Rubio

    发明人： Wael R. El-Essawy ,  Elmootazbellah N. Elnozahy ,  Madhusudan K. Iyengar ,  Thomas W. Keller, JR. ,  Juan C. Rubio

    IPC分类号： G06F1/20

    CPC分类号： H05K7/20 ,  G06F1/181 ,  G06F1/20

    摘要： A modular processing module allowing in-situ maintenance is provided. The modular processing module comprises a set of processing module sides. Each processing module side comprises a circuit board, a plurality of connectors, and a plurality of processing nodes. Each processing module side couples to another processing module side using at least one connector in the plurality of connectors such that, when all of the set of processing module sides are coupled together, the modular processing module is formed. The modular processing module comprises an exterior connection to a power source and a communication system and at least one heatsink that couples to at least a portion of the plurality of processing nodes on one of the processing module sides and is designed such that, when a set of heatsinks in the modular processing module are installed, an empty space is left in a center of the modular processing module.

    摘要翻译： 提供允许现场维护的模块化处理模块。 模块化处理模块包括一组处理模块侧面。 每个处理模块侧包括电路板，多个连接器和多个处理节点。 每个处理模块侧使用多个连接器中的至少一个连接器耦合到另一个处理模块侧，使得当所述一组处理模块侧面都耦合在一起时，形成模块化处理模块。 模块化处理模块包括到电源和通信系统的外部连接以及耦合到处理模块侧之一上的多个处理节点的至少一部分的至少一个散热器，并被设计成使得当一组 在模块化处理模块中安装散热器，在模块化处理模块的中心留有空的空间。

    Heatsink allowing in-situ maintenance in a stackable module
    6.
    发明授权
    Heatsink allowing in-situ maintenance in a stackable module 失效
    散热器允许在可堆叠模块中进行现场维护

    公开(公告)号：US08547692B2

    公开(公告)日：2013-10-01

    申请号：US13596828

    申请日：2012-08-28

    申请人： Wael R. El-Essawy ,  Elmootazbellah N. Elnozahy ,  Madhusudan K. Iyengar ,  Thomas W. Keller, Jr. ,  Juan C. Rubio

    发明人： Wael R. El-Essawy ,  Elmootazbellah N. Elnozahy ,  Madhusudan K. Iyengar ,  Thomas W. Keller, Jr. ,  Juan C. Rubio

    IPC分类号： H05K7/20 ,  F28F7/00 ,  H05K5/00

    CPC分类号： H05K7/20 ,  G06F1/181 ,  G06F1/20

    摘要： A modular processing module allowing in-situ maintenance is provided. The modular processing module comprises a set of processing module sides. Each processing module side comprises a circuit board, a plurality of connectors, and a plurality of processing nodes. Each processing module side couples to another processing module side using at least one connector in the plurality of connectors such that, when all of the set of processing module sides are coupled together, the modular processing module is formed. The modular processing module comprises an exterior connection to a power source and a communication system and at least one heatsink that couples to at least a portion of the plurality of processing nodes on one of the processing module sides and is designed such that, when a set of heatsinks in the modular processing module are installed, an empty space is left in a center of the modular processing module.

    摘要翻译： 提供允许现场维护的模块化处理模块。 模块化处理模块包括一组处理模块侧面。 每个处理模块侧包括电路板，多个连接器和多个处理节点。 每个处理模块侧使用多个连接器中的至少一个连接器耦合到另一个处理模块侧，使得当所述一组处理模块侧面都耦合在一起时，形成模块化处理模块。 模块化处理模块包括到电源和通信系统的外部连接以及耦合到处理模块侧之一上的多个处理节点的至少一部分的至少一个散热器，并被设计成使得当一组 在模块化处理模块中安装散热器，在模块化处理模块的中心留有空的空间。

    Heatsink Allowing In-Situ Maintenance in a Stackable Module
    7.
    发明申请
    Heatsink Allowing In-Situ Maintenance in a Stackable Module 失效
    散热器可以在可堆叠模块中进行原位维护

    公开(公告)号：US20120320524A1

    公开(公告)日：2012-12-20

    申请号：US13596828

    申请日：2012-08-28

    申请人： Wael R. El-Essawy ,  Elmootazbellah N. Elnozahy ,  Madhusudan K. Iyengar ,  Thomas W. Keller, JR. ,  Juan C. Rubio

    发明人： Wael R. El-Essawy ,  Elmootazbellah N. Elnozahy ,  Madhusudan K. Iyengar ,  Thomas W. Keller, JR. ,  Juan C. Rubio

    IPC分类号： G06F1/20

    CPC分类号： H05K7/20 ,  G06F1/181 ,  G06F1/20

    摘要： A modular processing module allowing in-situ maintenance is provided. The modular processing module comprises a set of processing module sides. Each processing module side comprises a circuit board, a plurality of connectors, and a plurality of processing nodes. Each processing module side couples to another processing module side using at least one connector in the plurality of connectors such that, when all of the set of processing module sides are coupled together, the modular processing module is formed. The modular processing module comprises an exterior connection to a power source and a communication system and at least one heatsink that couples to at least a portion of the plurality of processing nodes on one of the processing module sides and is designed such that, when a set of heatsinks in the modular processing module are installed, an empty space is left in a center of the modular processing module.

    摘要翻译： 提供允许现场维护的模块化处理模块。 模块化处理模块包括一组处理模块侧面。 每个处理模块侧包括电路板，多个连接器和多个处理节点。 每个处理模块侧使用多个连接器中的至少一个连接器耦合到另一个处理模块侧，使得当所述一组处理模块侧面都耦合在一起时，形成模块化处理模块。 模块化处理模块包括到电源和通信系统的外部连接以及耦合到处理模块侧之一上的多个处理节点的至少一部分的至少一个散热器，并被设计成使得当一组 在模块化处理模块中安装散热器，在模块化处理模块的中心留有空的空间。

    Automatically detecting and locating equipment within an equipment rack
    9.
    发明授权
    Automatically detecting and locating equipment within an equipment rack 有权
    自动检测和定位设备机架内的设备

    公开(公告)号：US08914495B2

    公开(公告)日：2014-12-16

    申请号：US13154825

    申请日：2011-06-07

    申请人： Rajarshi Das ,  Wael R. El-Essawy ,  Thomas W. Keller, Jr. ,  Jeffrey O. Kephart ,  Juan C. Rubio

    发明人： Rajarshi Das ,  Wael R. El-Essawy ,  Thomas W. Keller, Jr. ,  Jeffrey O. Kephart ,  Juan C. Rubio

    IPC分类号： G06F15/173 ,  H05K7/14

    CPC分类号： H05K7/1498

    摘要： A mechanism is provided for automatically detecting and locating equipment within an intelligent equipment rack. The intelligent equipment rack comprises a rack controller that determines whether a signal has been received indicating that a rack space in a plurality of rack spaces in the intelligent equipment rack has been occupied by a piece of electronic equipment. Responsive to receiving the signal indicating that the rack space has been occupied by the piece of electronic equipment, the rack controller updates a rack information table in the memory with occupation information related to the rack space occupied by the piece of electronic equipment.

    摘要翻译： 提供了一种用于自动检测和定位智能设备机架内的设备的机构。 智能设备机架包括：机架控制器，其确定是否已经接收到指示智能设备机架中的多个机架空间中的机架空间已被一块电子设备占用的信号。 响应于接收到指示机架空间已被该电子设备占用的信号，机架控制器利用与该电子设备所占用的机架空间有关的占用信息来更新存储器中的机架信息表。

    Liquid Cooling System for Stackable Modules in Energy-Efficient Computing Systems
    10.
    发明申请
    Liquid Cooling System for Stackable Modules in Energy-Efficient Computing Systems 有权
    节能计算系统中可堆叠模块的液体冷却系统

    公开(公告)号：US20120194996A1

    公开(公告)日：2012-08-02

    申请号：US13435811

    申请日：2012-03-30

    申请人： Wael R. El-Essawy ,  Thomas W. Keller, JR. ,  Jarrod A. Roy ,  Juan C. Rubio

    发明人： Wael R. El-Essawy ,  Thomas W. Keller, JR. ,  Jarrod A. Roy ,  Juan C. Rubio

    IPC分类号： H05K7/20

    CPC分类号： H05K7/02 ,  G06F1/18 ,  G06F1/181 ,  G06F1/20 ,  H05K7/20

    摘要： A computing system is provided. In the computing system, a plurality of modules physically arranged in a three dimensional hexadron configuration. In the computing system, the at least one module is either a liquid-tight module filled with a non-conductive liquid coolant or a module cooled with a liquid coolant circulating through cold plates mounted on electronic components. In the computing system, the liquid coolant is circulated in a closed loop by at least one pump through a plurality of hoses through at least one of a plurality of heat exchangers. In the computing system, the plurality of heat exchangers is coupled to an exterior portion of the surface of the computing system. In the computing system, the plurality of heat exchangers cool the liquid coolant through tinned tubes exposed to the surrounding air.

    摘要翻译： 提供了一种计算系统。 在计算系统中，以三维十六指肠配置物理排列的多个模块。 在计算系统中，所述至少一个模块是填充有非导电液体冷却剂的液密模块或者通过冷却剂循环冷却的模块，所述冷却剂循环通过安装在电子部件上的冷板。 在计算系统中，液体冷却剂通过至少一个泵通过多个软管通过多个热交换器中的至少一个在闭环中循环。 在计算系统中，多个热交换器耦合到计算系统表面的外部部分。 在计算系统中，多个热交换器通过暴露于周围空气的镀锡管冷却液体冷却剂。