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公开(公告)号：US08179674B2
公开(公告)日：2012-05-15
申请号：US12789583
申请日：2010-05-28
申请人： John B. Carter , Wael R. El-Essawy , Elmootazbellah N. Elnozahy , Madhusudan K. Iyengar , Thomas W. Keller, Jr. , Jian Li , Karthick Rajamani , Juan C. Rubio , William E. Speight , Lixin Zhang
发明人： John B. Carter , Wael R. El-Essawy , Elmootazbellah N. Elnozahy , Madhusudan K. Iyengar , Thomas W. Keller, Jr. , Jian Li , Karthick Rajamani , Juan C. Rubio , William E. Speight , Lixin Zhang
CPC分类号： G06F1/20
摘要： A scalable space-optimized and energy-efficient computing system is provided. The computing system comprises a plurality of modular compartments in at least one level of a frame configured in a hexadron configuration. The computing system also comprises an air inlet, an air mixing plenum, and at least one fan. In the computing system the plurality of modular compartments are affixed above the air inlet, the air mixing plenum is affixed above the plurality of modular compartments, and the at least one fan is affixed above the air mixing plenum. When at least one module is inserted into one of the plurality of modular compartments, the module couples to a backplane within the frame.
摘要翻译： 提供了可扩展的空间优化和节能计算系统。 计算系统包括在六排配置中配置的框架的至少一个级别中的多个模块化隔间。 计算系统还包括空气入口，空气混合增压室和至少一个风扇。 在计算系统中，多个模块化隔间固定在空气入口上方，空气混合气室固定在多个模块化隔间上方，并且至少一个风扇固定在空气混合气室的上方。 当至少一个模块被插入多个模块化隔间中的一个时，模块耦合到框架内的背板。
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公开(公告)号：US20110292594A1
公开(公告)日：2011-12-01
申请号：US12789583
申请日：2010-05-28
申请人： John B. Carter , Wael R. El-Essawy , Elmootazbellah N. Elnozahy , Madhusudan K. Iyengar , Thomas W. Keller, JR. , Jian Li , Karthick Rajamani , Juan C. Rubio , William E. Speight , Lixin Zhang
发明人： John B. Carter , Wael R. El-Essawy , Elmootazbellah N. Elnozahy , Madhusudan K. Iyengar , Thomas W. Keller, JR. , Jian Li , Karthick Rajamani , Juan C. Rubio , William E. Speight , Lixin Zhang
CPC分类号： G06F1/20
摘要： A scalable space-optimized and energy-efficient computing system is provided. The computing system comprises a plurality of modular compartments in at least one level of a frame configured in a hexadron configuration. The computing system also comprises an air inlet, an air mixing plenum, and at least one fan. In the computing system the plurality of modular compartments are affixed above the air inlet, the air mixing plenum is affixed above the plurality of modular compartments, and the at least one fan is affixed above the air mixing plenum. When at least one module is inserted into one of the plurality of modular compartments, the module couples to a backplane within the frame.
摘要翻译： 提供了可扩展的空间优化和节能计算系统。 计算系统包括在六排配置中配置的框架的至少一个级别中的多个模块化隔间。 计算系统还包括空气入口，空气混合增压室和至少一个风扇。 在计算系统中，多个模块化隔间固定在空气入口上方，空气混合气室固定在多个模块化隔间上方，并且至少一个风扇固定在空气混合气室的上方。 当至少一个模块被插入多个模块化隔间中的一个时，模块耦合到框架内的背板。
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公开(公告)号：US08358503B2
公开(公告)日：2013-01-22
申请号：US12789617
申请日：2010-05-28
申请人： John B. Carter , Wael R. El-Essawy , Elmootazbellah N. Elnozahy , Wesley M. Felter , Madhusudan K. Iyengar , Thomas W. Keller, Jr. , Karthick Rajamani , Juan C. Rubio , William E. Speight , Lixin Zhang
发明人： John B. Carter , Wael R. El-Essawy , Elmootazbellah N. Elnozahy , Wesley M. Felter , Madhusudan K. Iyengar , Thomas W. Keller, Jr. , Karthick Rajamani , Juan C. Rubio , William E. Speight , Lixin Zhang
IPC分类号： H05K7/20
摘要： A modular processing module is provided. The modular processing module comprises a set of processing module sides. Each processing module side comprises a circuit board, a plurality of connectors coupled to the circuit board, and a plurality of processing nodes coupled to the circuit board. Each processing module side in the set of processing module sides couples to another processing module side using at least one connector in the plurality of connectors such that, when all of the set of processing module sides are coupled together, the modular processing module is formed. The modular processing module comprises an exterior connection to a power source and a communication system.
摘要翻译： 提供模块化处理模块。 模块化处理模块包括一组处理模块侧面。 每个处理模块侧包括电路板，耦合到电路板的多个连接器以及耦合到电路板的多个处理节点。 处理模块组中的每个处理模块侧均使用多个连接器中的至少一个连接器耦合到另一个处理模块侧，使得当所有这组处理模块侧面耦合在一起时，形成模块化处理模块。 模块化处理模块包括到电源和通信系统的外部连接。
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公开(公告)号：US20110292597A1
公开(公告)日：2011-12-01
申请号：US12789617
申请日：2010-05-28
申请人： John B. Carter , Wael R. El-Essawy , Elmootazbellah N. Elnozahy , Wesley M. Felter , Madhusudan K. Iyengar , Thomas W. Keller, JR. , Karthick Rajamani , Juan C. Rubio , William E. Speight , Lixin Zhang
发明人： John B. Carter , Wael R. El-Essawy , Elmootazbellah N. Elnozahy , Wesley M. Felter , Madhusudan K. Iyengar , Thomas W. Keller, JR. , Karthick Rajamani , Juan C. Rubio , William E. Speight , Lixin Zhang
摘要： A modular processing module is provided. The modular processing module comprises a set of processing module sides. Each processing module side comprises a circuit board, a plurality of connectors coupled to the circuit board, and a plurality of processing nodes coupled to the circuit board. Each processing module side in the set of processing module sides couples to another processing module side using at least one connector in the plurality of connectors such that, when all of the set of processing module sides are coupled together, the modular processing module is formed. The modular processing module comprises an exterior connection to a power source and a communication system.
摘要翻译： 提供模块化处理模块。 模块化处理模块包括一组处理模块侧面。 每个处理模块侧包括电路板，耦合到电路板的多个连接器以及耦合到电路板的多个处理节点。 处理模块组中的每个处理模块侧均使用多个连接器中的至少一个连接器耦合到另一个处理模块侧，使得当所有这组处理模块侧面耦合在一起时，形成模块化处理模块。 模块化处理模块包括到电源和通信系统的外部连接。
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公开(公告)号：US08279597B2
公开(公告)日：2012-10-02
申请号：US12788925
申请日：2010-05-27
申请人： Wael R. El-Essawy , Elmootazbellah N. Elnozahy , Madhusudan K. Iyengar , Thomas W. Keller, Jr. , Juan C. Rubio
发明人： Wael R. El-Essawy , Elmootazbellah N. Elnozahy , Madhusudan K. Iyengar , Thomas W. Keller, Jr. , Juan C. Rubio
摘要： A modular processing module allowing in-situ maintenance is provided. The modular processing module comprises a set of processing module sides. Each processing module side comprises a circuit board, a plurality of connectors, and a plurality of processing nodes. Each processing module side couples to another processing module side using at least one connector in the plurality of connectors such that, when all of the set of processing module sides are coupled together, the modular processing module is formed. The modular processing module comprises an exterior connection to a power source and a communication system and at least one heatsink that couples to at least a portion of the plurality of processing nodes on one of the processing module sides and is designed such that, when a set of heatsinks in the modular processing module are installed, an empty space is left in a center of the modular processing module.
摘要翻译： 提供允许现场维护的模块化处理模块。 模块化处理模块包括一组处理模块侧面。 每个处理模块侧包括电路板，多个连接器和多个处理节点。 每个处理模块侧使用多个连接器中的至少一个连接器耦合到另一个处理模块侧，使得当所述一组处理模块侧面都耦合在一起时，形成模块化处理模块。 模块化处理模块包括到电源和通信系统的外部连接以及耦合到处理模块侧之一上的多个处理节点的至少一部分的至少一个散热器，并被设计成使得当一组 在模块化处理模块中安装散热器，在模块化处理模块的中心留有空的空间。
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公开(公告)号：US20110292596A1
公开(公告)日：2011-12-01
申请号：US12788925
申请日：2010-05-27
申请人： Wael R. El-Essawy , Elmootazbellah N. Elnozahy , Madhusudan K. Iyengar , Thomas W. Keller, JR. , Juan C. Rubio
发明人： Wael R. El-Essawy , Elmootazbellah N. Elnozahy , Madhusudan K. Iyengar , Thomas W. Keller, JR. , Juan C. Rubio
IPC分类号： G06F1/20
摘要： A modular processing module allowing in-situ maintenance is provided. The modular processing module comprises a set of processing module sides. Each processing module side comprises a circuit board, a plurality of connectors, and a plurality of processing nodes. Each processing module side couples to another processing module side using at least one connector in the plurality of connectors such that, when all of the set of processing module sides are coupled together, the modular processing module is formed. The modular processing module comprises an exterior connection to a power source and a communication system and at least one heatsink that couples to at least a portion of the plurality of processing nodes on one of the processing module sides and is designed such that, when a set of heatsinks in the modular processing module are installed, an empty space is left in a center of the modular processing module.
摘要翻译： 提供允许现场维护的模块化处理模块。 模块化处理模块包括一组处理模块侧面。 每个处理模块侧包括电路板，多个连接器和多个处理节点。 每个处理模块侧使用多个连接器中的至少一个连接器耦合到另一个处理模块侧，使得当所述一组处理模块侧面都耦合在一起时，形成模块化处理模块。 模块化处理模块包括到电源和通信系统的外部连接以及耦合到处理模块侧之一上的多个处理节点的至少一部分的至少一个散热器，并被设计成使得当一组 在模块化处理模块中安装散热器，在模块化处理模块的中心留有空的空间。
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公开(公告)号：US08547692B2
公开(公告)日：2013-10-01
申请号：US13596828
申请日：2012-08-28
申请人： Wael R. El-Essawy , Elmootazbellah N. Elnozahy , Madhusudan K. Iyengar , Thomas W. Keller, Jr. , Juan C. Rubio
发明人： Wael R. El-Essawy , Elmootazbellah N. Elnozahy , Madhusudan K. Iyengar , Thomas W. Keller, Jr. , Juan C. Rubio
摘要： A modular processing module allowing in-situ maintenance is provided. The modular processing module comprises a set of processing module sides. Each processing module side comprises a circuit board, a plurality of connectors, and a plurality of processing nodes. Each processing module side couples to another processing module side using at least one connector in the plurality of connectors such that, when all of the set of processing module sides are coupled together, the modular processing module is formed. The modular processing module comprises an exterior connection to a power source and a communication system and at least one heatsink that couples to at least a portion of the plurality of processing nodes on one of the processing module sides and is designed such that, when a set of heatsinks in the modular processing module are installed, an empty space is left in a center of the modular processing module.
摘要翻译： 提供允许现场维护的模块化处理模块。 模块化处理模块包括一组处理模块侧面。 每个处理模块侧包括电路板，多个连接器和多个处理节点。 每个处理模块侧使用多个连接器中的至少一个连接器耦合到另一个处理模块侧，使得当所述一组处理模块侧面都耦合在一起时，形成模块化处理模块。 模块化处理模块包括到电源和通信系统的外部连接以及耦合到处理模块侧之一上的多个处理节点的至少一部分的至少一个散热器，并被设计成使得当一组 在模块化处理模块中安装散热器，在模块化处理模块的中心留有空的空间。
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公开(公告)号：US20120320524A1
公开(公告)日：2012-12-20
申请号：US13596828
申请日：2012-08-28
申请人： Wael R. El-Essawy , Elmootazbellah N. Elnozahy , Madhusudan K. Iyengar , Thomas W. Keller, JR. , Juan C. Rubio
发明人： Wael R. El-Essawy , Elmootazbellah N. Elnozahy , Madhusudan K. Iyengar , Thomas W. Keller, JR. , Juan C. Rubio
IPC分类号： G06F1/20
摘要： A modular processing module allowing in-situ maintenance is provided. The modular processing module comprises a set of processing module sides. Each processing module side comprises a circuit board, a plurality of connectors, and a plurality of processing nodes. Each processing module side couples to another processing module side using at least one connector in the plurality of connectors such that, when all of the set of processing module sides are coupled together, the modular processing module is formed. The modular processing module comprises an exterior connection to a power source and a communication system and at least one heatsink that couples to at least a portion of the plurality of processing nodes on one of the processing module sides and is designed such that, when a set of heatsinks in the modular processing module are installed, an empty space is left in a center of the modular processing module.
摘要翻译： 提供允许现场维护的模块化处理模块。 模块化处理模块包括一组处理模块侧面。 每个处理模块侧包括电路板，多个连接器和多个处理节点。 每个处理模块侧使用多个连接器中的至少一个连接器耦合到另一个处理模块侧，使得当所述一组处理模块侧面都耦合在一起时，形成模块化处理模块。 模块化处理模块包括到电源和通信系统的外部连接以及耦合到处理模块侧之一上的多个处理节点的至少一部分的至少一个散热器，并被设计成使得当一组 在模块化处理模块中安装散热器，在模块化处理模块的中心留有空的空间。
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公开(公告)号：US08688394B2
公开(公告)日：2014-04-01
申请号：US12878063
申请日：2010-09-09
IPC分类号： G01R21/133
CPC分类号： G05F1/66 , G06F1/26 , H04L67/12 , H05K7/1492 , H05K7/1498
摘要： A data center energy management (DCEM) server configures a power supply in the data center. The DCEM server sums input alternating current (AC) power of the power supply to a total AC power of the data center, wherein the total AC power of the data center is a sum of AC power of a plurality of power supplies. The DCEM server sums output direct current (DC) power of the power supply to a total DC power of the data center and reports a ratio of total AC power to total DC power as data center power conversion efficiency. The DCEM server sets a preset power supply efficiency threshold. The DCEM server determines that a real-time power efficiency level is below the power supply efficiency threshold. The DCEM server, responsive to a determination that real-time power efficiency level is below the power supply efficiency threshold, may remedy the power supply.
摘要翻译： 数据中心能量管理（DCEM）服务器配置数据中心的电源。 DCEM服务器将电源的输入交流电（AC）功率与数据中心的总AC电力相加，其中数据中心的总AC功率是多个电源的AC功率之和。 DCEM服务器将电源的直流输出直流功率与数据中心的总直流功率相加，并将总的交流电与总的直流功率之比报告为数据中心的电源转换效率。 DCEM服务器设置预设的电源效率阈值。 DCEM服务器确定实时功率效率水平低于电源效率阈值。 响应于确定实时功率效率水平低于电源效率阈值的DCEM服务器可以补救电源。
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公开(公告)号：US20120066519A1
公开(公告)日：2012-03-15
申请号：US12878063
申请日：2010-09-09
IPC分类号： G06F1/26
CPC分类号： G05F1/66 , G06F1/26 , H04L67/12 , H05K7/1492 , H05K7/1498
摘要： A data center energy management (DCEM) server configures a power supply in the data center. The DCEM server sums input alternating current (AC) power of the power supply to a total AC power of the data center, wherein the total AC power of the data center is a sum of AC power of a plurality of power supplies. The DCEM server sums output direct current (DC) power of the power supply to a total DC power of the data center and reports a ratio of total AC power to total DC power as data center power conversion efficiency. The DCEM server sets a preset power supply efficiency threshold. The DCEM server determines that a real-time power efficiency level is below the power supply efficiency threshold. The DCEM server, responsive to a determination that real-time power efficiency level is below the power supply efficiency threshold, may remedy the power supply.
摘要翻译： 数据中心能量管理（DCEM）服务器配置数据中心的电源。 DCEM服务器将电源的输入交流电（AC）功率与数据中心的总AC电力相加，其中数据中心的总AC功率是多个电源的AC功率之和。 DCEM服务器将电源的直流输出直流功率与数据中心的总直流功率相加，并将总的交流电与总的直流功率之比报告为数据中心的电源转换效率。 DCEM服务器设置预设的电源效率阈值。 DCEM服务器确定实时功率效率水平低于电源效率阈值。 响应于确定实时功率效率水平低于电源效率阈值的DCEM服务器可以补救电源。
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