摘要:
A mechanism is provided for automatically detecting and locating equipment within an intelligent equipment rack. The intelligent equipment rack comprises a rack controller that determines whether a signal has been received indicating that a rack space in a plurality of rack spaces in the intelligent equipment rack has been occupied by a piece of electronic equipment. Responsive to receiving the signal indicating that the rack space has been occupied by the piece of electronic equipment, the rack controller updates a rack information table in the memory with occupation information related to the rack space occupied by the piece of electronic equipment.
摘要:
A mechanism is provided for minimizing aggregate power from HVAC cooling and IT equipment in a data center. The mechanism selects a high HVAC set point for low-utilization and selects a low HVAC set point for high utilization. For each cooling zone in a data center, the mechanism monitors the average utilization of equipment in the cooling zone and selects the appropriate HVAC set point based on utilization. The mechanism may determine efficiency to determine whether to adjust universal HVAC set points or the HVAC set points for each given cooling zone. That is, the mechanism may dynamically adjust HVAC set points for optimal efficiency. Alternatively, the mechanism may go beyond binary control and compute actual data center efficiency metrics to decide on intermediate set points.
摘要:
Data center environmental sensing is provided by a measurement system that detects environmental events from inputs received from a plurality of movable sensors. The sensors are moved in response to detection of an event to a region of the data center associated with the event, providing increased spatial resolution of the measurement in the region of the event. Events such as leakage between hot and cold aisles of a data center can be detected by the system, which may use one or more movable devices that can be moved around, between and over equipment, to carry multiple sensors toward the source of the event, providing both diagnostic and detailed environmental information.
摘要:
A modular processing module allowing in-situ maintenance is provided. The modular processing module comprises a set of processing module sides. Each processing module side comprises a circuit board, a plurality of connectors, and a plurality of processing nodes. Each processing module side couples to another processing module side using at least one connector in the plurality of connectors such that, when all of the set of processing module sides are coupled together, the modular processing module is formed. The modular processing module comprises an exterior connection to a power source and a communication system and at least one heatsink that couples to at least a portion of the plurality of processing nodes on one of the processing module sides and is designed such that, when a set of heatsinks in the modular processing module are installed, an empty space is left in a center of the modular processing module.
摘要:
A communications system is provided for direct communications between powered elements. A controller hub injects a first message via a modulated communication signal onto a branch circuit using a hub-side power line communication (PLC) coupler. An element-side PLC coupler associated with a powered element in a set of powered elements detects the first message and sends an interrupt to a mini-controller in the powered element. The mini-controller receives the interrupt from the element-side PLC coupler, extracts the first message using the element-side PLC coupler; reads a destination identifier in the first message; compares the destination identifier in the first message to a mini-controller identifier in the mini-controller; sends an acknowledgement message back to the controller hub in response to the destination identifier in the first message matching the mini-controller identifier, and forwards the first message to the powered element. The powered element performs a command identified in the first message.
摘要:
A modular processing module allowing in-situ maintenance is provided. The modular processing module comprises a set of processing module sides. Each processing module side comprises a circuit board, a plurality of connectors, and a plurality of processing nodes. Each processing module side couples to another processing module side using at least one connector in the plurality of connectors such that, when all of the set of processing module sides are coupled together, the modular processing module is formed. The modular processing module comprises an exterior connection to a power source and a communication system and at least one heatsink that couples to at least a portion of the plurality of processing nodes on one of the processing module sides and is designed such that, when a set of heatsinks in the modular processing module are installed, an empty space is left in a center of the modular processing module.
摘要:
A wire manager including current sensing features provides input for power measurement and management systems. The wire manager may be a single wire or single bundle retaining device with a current sensor such as a hall effect sensor integrated therein, or may be a multi-wire management housing with multiple current sensing devices disposed inside for measuring the current through multiple wires. The wires may be multiple branch circuits in a power distribution panel or raceway, and the wire manager may be adapted for mounting in such a panel or raceway. Voltage sensing may also be incorporated within the sensors by providing an electrically conductive plate, wire or other element that capacitively couples to the corresponding wire.
摘要:
A modular processing module is provided. The modular processing module comprises a set of processing module sides. Each processing module side comprises a circuit board, a plurality of connectors coupled to the circuit board, and a plurality of processing nodes coupled to the circuit board. Each processing module side in the set of processing module sides couples to another processing module side using at least one connector in the plurality of connectors such that, when all of the set of processing module sides are coupled together, the modular processing module is formed. The modular processing module comprises an exterior connection to a power source and a communication system.
摘要:
A computing system is provided. In the computing system, a plurality of modules physically arranged in a three dimensional hexadron configuration. In the computing system, the at least one module is either a liquid-tight module filled with a non-conductive liquid coolant or a module cooled with a liquid coolant circulating through cold plates mounted on electronic components. In the computing system, the liquid coolant is circulated in a closed loop by at least one pump through a plurality of hoses through at least one of a plurality of heat exchangers. In the computing system, the plurality of heat exchangers is coupled to an exterior portion of the surface of the computing system. In the computing system, the plurality of heat exchangers cool the liquid coolant through finned tubes exposed to the surrounding air.
摘要:
A mechanism is provided for dynamically changing power caps for a set of powered elements. Current being consumed by the set of powered elements P on a branch circuit is measured and available current on the branch circuit is determined. A new total power cap for a current time period t is identified based on a current total power cap and the measured current. A difference in total power caps (ΔTPC) is determined and, for each powered element p in the set of powered elements P at the current time period, a new power cap PC (p,t) is determined based on the previous power cap PC(p,t−1) and the difference of the total power caps to the set of powered elements P. A power cap of each powered element p is then dynamically set to the new power cap PC (p,t).