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公开(公告)号：US08179674B2
公开(公告)日：2012-05-15
申请号：US12789583
申请日：2010-05-28
申请人： John B. Carter , Wael R. El-Essawy , Elmootazbellah N. Elnozahy , Madhusudan K. Iyengar , Thomas W. Keller, Jr. , Jian Li , Karthick Rajamani , Juan C. Rubio , William E. Speight , Lixin Zhang
发明人： John B. Carter , Wael R. El-Essawy , Elmootazbellah N. Elnozahy , Madhusudan K. Iyengar , Thomas W. Keller, Jr. , Jian Li , Karthick Rajamani , Juan C. Rubio , William E. Speight , Lixin Zhang
CPC分类号： G06F1/20
摘要： A scalable space-optimized and energy-efficient computing system is provided. The computing system comprises a plurality of modular compartments in at least one level of a frame configured in a hexadron configuration. The computing system also comprises an air inlet, an air mixing plenum, and at least one fan. In the computing system the plurality of modular compartments are affixed above the air inlet, the air mixing plenum is affixed above the plurality of modular compartments, and the at least one fan is affixed above the air mixing plenum. When at least one module is inserted into one of the plurality of modular compartments, the module couples to a backplane within the frame.
摘要翻译： 提供了可扩展的空间优化和节能计算系统。 计算系统包括在六排配置中配置的框架的至少一个级别中的多个模块化隔间。 计算系统还包括空气入口，空气混合增压室和至少一个风扇。 在计算系统中，多个模块化隔间固定在空气入口上方，空气混合气室固定在多个模块化隔间上方，并且至少一个风扇固定在空气混合气室的上方。 当至少一个模块被插入多个模块化隔间中的一个时，模块耦合到框架内的背板。
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公开(公告)号：US20110292594A1
公开(公告)日：2011-12-01
申请号：US12789583
申请日：2010-05-28
申请人： John B. Carter , Wael R. El-Essawy , Elmootazbellah N. Elnozahy , Madhusudan K. Iyengar , Thomas W. Keller, JR. , Jian Li , Karthick Rajamani , Juan C. Rubio , William E. Speight , Lixin Zhang
发明人： John B. Carter , Wael R. El-Essawy , Elmootazbellah N. Elnozahy , Madhusudan K. Iyengar , Thomas W. Keller, JR. , Jian Li , Karthick Rajamani , Juan C. Rubio , William E. Speight , Lixin Zhang
CPC分类号： G06F1/20
摘要： A scalable space-optimized and energy-efficient computing system is provided. The computing system comprises a plurality of modular compartments in at least one level of a frame configured in a hexadron configuration. The computing system also comprises an air inlet, an air mixing plenum, and at least one fan. In the computing system the plurality of modular compartments are affixed above the air inlet, the air mixing plenum is affixed above the plurality of modular compartments, and the at least one fan is affixed above the air mixing plenum. When at least one module is inserted into one of the plurality of modular compartments, the module couples to a backplane within the frame.
摘要翻译： 提供了可扩展的空间优化和节能计算系统。 计算系统包括在六排配置中配置的框架的至少一个级别中的多个模块化隔间。 计算系统还包括空气入口，空气混合增压室和至少一个风扇。 在计算系统中，多个模块化隔间固定在空气入口上方，空气混合气室固定在多个模块化隔间上方，并且至少一个风扇固定在空气混合气室的上方。 当至少一个模块被插入多个模块化隔间中的一个时，模块耦合到框架内的背板。
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公开(公告)号：US08358503B2
公开(公告)日：2013-01-22
申请号：US12789617
申请日：2010-05-28
申请人： John B. Carter , Wael R. El-Essawy , Elmootazbellah N. Elnozahy , Wesley M. Felter , Madhusudan K. Iyengar , Thomas W. Keller, Jr. , Karthick Rajamani , Juan C. Rubio , William E. Speight , Lixin Zhang
发明人： John B. Carter , Wael R. El-Essawy , Elmootazbellah N. Elnozahy , Wesley M. Felter , Madhusudan K. Iyengar , Thomas W. Keller, Jr. , Karthick Rajamani , Juan C. Rubio , William E. Speight , Lixin Zhang
IPC分类号： H05K7/20
摘要： A modular processing module is provided. The modular processing module comprises a set of processing module sides. Each processing module side comprises a circuit board, a plurality of connectors coupled to the circuit board, and a plurality of processing nodes coupled to the circuit board. Each processing module side in the set of processing module sides couples to another processing module side using at least one connector in the plurality of connectors such that, when all of the set of processing module sides are coupled together, the modular processing module is formed. The modular processing module comprises an exterior connection to a power source and a communication system.
摘要翻译： 提供模块化处理模块。 模块化处理模块包括一组处理模块侧面。 每个处理模块侧包括电路板，耦合到电路板的多个连接器以及耦合到电路板的多个处理节点。 处理模块组中的每个处理模块侧均使用多个连接器中的至少一个连接器耦合到另一个处理模块侧，使得当所有这组处理模块侧面耦合在一起时，形成模块化处理模块。 模块化处理模块包括到电源和通信系统的外部连接。
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公开(公告)号：US20110292597A1
公开(公告)日：2011-12-01
申请号：US12789617
申请日：2010-05-28
申请人： John B. Carter , Wael R. El-Essawy , Elmootazbellah N. Elnozahy , Wesley M. Felter , Madhusudan K. Iyengar , Thomas W. Keller, JR. , Karthick Rajamani , Juan C. Rubio , William E. Speight , Lixin Zhang
发明人： John B. Carter , Wael R. El-Essawy , Elmootazbellah N. Elnozahy , Wesley M. Felter , Madhusudan K. Iyengar , Thomas W. Keller, JR. , Karthick Rajamani , Juan C. Rubio , William E. Speight , Lixin Zhang
摘要： A modular processing module is provided. The modular processing module comprises a set of processing module sides. Each processing module side comprises a circuit board, a plurality of connectors coupled to the circuit board, and a plurality of processing nodes coupled to the circuit board. Each processing module side in the set of processing module sides couples to another processing module side using at least one connector in the plurality of connectors such that, when all of the set of processing module sides are coupled together, the modular processing module is formed. The modular processing module comprises an exterior connection to a power source and a communication system.
摘要翻译： 提供模块化处理模块。 模块化处理模块包括一组处理模块侧面。 每个处理模块侧包括电路板，耦合到电路板的多个连接器以及耦合到电路板的多个处理节点。 处理模块组中的每个处理模块侧均使用多个连接器中的至少一个连接器耦合到另一个处理模块侧，使得当所有这组处理模块侧面耦合在一起时，形成模块化处理模块。 模块化处理模块包括到电源和通信系统的外部连接。
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公开(公告)号：US08279597B2
公开(公告)日：2012-10-02
申请号：US12788925
申请日：2010-05-27
申请人： Wael R. El-Essawy , Elmootazbellah N. Elnozahy , Madhusudan K. Iyengar , Thomas W. Keller, Jr. , Juan C. Rubio
发明人： Wael R. El-Essawy , Elmootazbellah N. Elnozahy , Madhusudan K. Iyengar , Thomas W. Keller, Jr. , Juan C. Rubio
摘要： A modular processing module allowing in-situ maintenance is provided. The modular processing module comprises a set of processing module sides. Each processing module side comprises a circuit board, a plurality of connectors, and a plurality of processing nodes. Each processing module side couples to another processing module side using at least one connector in the plurality of connectors such that, when all of the set of processing module sides are coupled together, the modular processing module is formed. The modular processing module comprises an exterior connection to a power source and a communication system and at least one heatsink that couples to at least a portion of the plurality of processing nodes on one of the processing module sides and is designed such that, when a set of heatsinks in the modular processing module are installed, an empty space is left in a center of the modular processing module.
摘要翻译： 提供允许现场维护的模块化处理模块。 模块化处理模块包括一组处理模块侧面。 每个处理模块侧包括电路板，多个连接器和多个处理节点。 每个处理模块侧使用多个连接器中的至少一个连接器耦合到另一个处理模块侧，使得当所述一组处理模块侧面都耦合在一起时，形成模块化处理模块。 模块化处理模块包括到电源和通信系统的外部连接以及耦合到处理模块侧之一上的多个处理节点的至少一部分的至少一个散热器，并被设计成使得当一组 在模块化处理模块中安装散热器，在模块化处理模块的中心留有空的空间。
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公开(公告)号：US20110292596A1
公开(公告)日：2011-12-01
申请号：US12788925
申请日：2010-05-27
申请人： Wael R. El-Essawy , Elmootazbellah N. Elnozahy , Madhusudan K. Iyengar , Thomas W. Keller, JR. , Juan C. Rubio
发明人： Wael R. El-Essawy , Elmootazbellah N. Elnozahy , Madhusudan K. Iyengar , Thomas W. Keller, JR. , Juan C. Rubio
IPC分类号： G06F1/20
摘要： A modular processing module allowing in-situ maintenance is provided. The modular processing module comprises a set of processing module sides. Each processing module side comprises a circuit board, a plurality of connectors, and a plurality of processing nodes. Each processing module side couples to another processing module side using at least one connector in the plurality of connectors such that, when all of the set of processing module sides are coupled together, the modular processing module is formed. The modular processing module comprises an exterior connection to a power source and a communication system and at least one heatsink that couples to at least a portion of the plurality of processing nodes on one of the processing module sides and is designed such that, when a set of heatsinks in the modular processing module are installed, an empty space is left in a center of the modular processing module.
摘要翻译： 提供允许现场维护的模块化处理模块。 模块化处理模块包括一组处理模块侧面。 每个处理模块侧包括电路板，多个连接器和多个处理节点。 每个处理模块侧使用多个连接器中的至少一个连接器耦合到另一个处理模块侧，使得当所述一组处理模块侧面都耦合在一起时，形成模块化处理模块。 模块化处理模块包括到电源和通信系统的外部连接以及耦合到处理模块侧之一上的多个处理节点的至少一部分的至少一个散热器，并被设计成使得当一组 在模块化处理模块中安装散热器，在模块化处理模块的中心留有空的空间。
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公开(公告)号：US08547692B2
公开(公告)日：2013-10-01
申请号：US13596828
申请日：2012-08-28
申请人： Wael R. El-Essawy , Elmootazbellah N. Elnozahy , Madhusudan K. Iyengar , Thomas W. Keller, Jr. , Juan C. Rubio
发明人： Wael R. El-Essawy , Elmootazbellah N. Elnozahy , Madhusudan K. Iyengar , Thomas W. Keller, Jr. , Juan C. Rubio
摘要： A modular processing module allowing in-situ maintenance is provided. The modular processing module comprises a set of processing module sides. Each processing module side comprises a circuit board, a plurality of connectors, and a plurality of processing nodes. Each processing module side couples to another processing module side using at least one connector in the plurality of connectors such that, when all of the set of processing module sides are coupled together, the modular processing module is formed. The modular processing module comprises an exterior connection to a power source and a communication system and at least one heatsink that couples to at least a portion of the plurality of processing nodes on one of the processing module sides and is designed such that, when a set of heatsinks in the modular processing module are installed, an empty space is left in a center of the modular processing module.
摘要翻译： 提供允许现场维护的模块化处理模块。 模块化处理模块包括一组处理模块侧面。 每个处理模块侧包括电路板，多个连接器和多个处理节点。 每个处理模块侧使用多个连接器中的至少一个连接器耦合到另一个处理模块侧，使得当所述一组处理模块侧面都耦合在一起时，形成模块化处理模块。 模块化处理模块包括到电源和通信系统的外部连接以及耦合到处理模块侧之一上的多个处理节点的至少一部分的至少一个散热器，并被设计成使得当一组 在模块化处理模块中安装散热器，在模块化处理模块的中心留有空的空间。
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公开(公告)号：US20120320524A1
公开(公告)日：2012-12-20
申请号：US13596828
申请日：2012-08-28
申请人： Wael R. El-Essawy , Elmootazbellah N. Elnozahy , Madhusudan K. Iyengar , Thomas W. Keller, JR. , Juan C. Rubio
发明人： Wael R. El-Essawy , Elmootazbellah N. Elnozahy , Madhusudan K. Iyengar , Thomas W. Keller, JR. , Juan C. Rubio
IPC分类号： G06F1/20
摘要： A modular processing module allowing in-situ maintenance is provided. The modular processing module comprises a set of processing module sides. Each processing module side comprises a circuit board, a plurality of connectors, and a plurality of processing nodes. Each processing module side couples to another processing module side using at least one connector in the plurality of connectors such that, when all of the set of processing module sides are coupled together, the modular processing module is formed. The modular processing module comprises an exterior connection to a power source and a communication system and at least one heatsink that couples to at least a portion of the plurality of processing nodes on one of the processing module sides and is designed such that, when a set of heatsinks in the modular processing module are installed, an empty space is left in a center of the modular processing module.
摘要翻译： 提供允许现场维护的模块化处理模块。 模块化处理模块包括一组处理模块侧面。 每个处理模块侧包括电路板，多个连接器和多个处理节点。 每个处理模块侧使用多个连接器中的至少一个连接器耦合到另一个处理模块侧，使得当所述一组处理模块侧面都耦合在一起时，形成模块化处理模块。 模块化处理模块包括到电源和通信系统的外部连接以及耦合到处理模块侧之一上的多个处理节点的至少一部分的至少一个散热器，并被设计成使得当一组 在模块化处理模块中安装散热器，在模块化处理模块的中心留有空的空间。
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公开(公告)号：US09445529B2
公开(公告)日：2016-09-13
申请号：US13479265
申请日：2012-05-23
CPC分类号： H05K7/2079 , H05K7/20836
摘要： Input data, specifying aspects of a thermal design of a liquid cooled data center, is obtained. The input data includes data indicative of ambient outdoor temperature for a location of the data center; and/or data representing workload power dissipation for the data center. The input data is evaluated to obtain performance of the data center thermal design. The performance includes cooling energy usage; and/or one pertinent temperature associated with the data center. The performance of the data center thermal design is output.
摘要翻译： 获得了指定液冷数据中心的热设计方面的输入数据。 输入数据包括指示数据中心位置的环境室外温度的数据; 和/或表示数据中心的工作负载功耗的数据。 评估输入数据以获得数据中心热设计的性能。 性能包括冷却能量的使用; 和/或与数据中心相关联的一个相关温度。 输出数据中心散热设计的性能。
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10.发明授权Coolant and ambient temperature control for chillerless liquid cooled data centers 有权冷却液和环境温度控制无冷却液体冷却数据中心公开(公告)号：US09250636B2
公开(公告)日：2016-02-02
申请号：US13439471
申请日：2012-04-04
申请人： Timothy J. Chainer , Milnes P. David , Madhusudan K. Iyengar , Pritish R. Parida , Robert E. Simons
发明人： Timothy J. Chainer , Milnes P. David , Madhusudan K. Iyengar , Pritish R. Parida , Robert E. Simons
CPC分类号： H05K7/20836 , F28F27/02 , G05D23/1932 , G06F1/206 , G06F2200/201 , Y02D10/16
摘要： Cooling control methods include measuring a temperature of air provided to a plurality of nodes by an air-to-liquid heat exchanger, measuring a temperature of at least one component of the plurality of nodes and finding a maximum component temperature across all such nodes, comparing the maximum component temperature to a first and second component threshold and comparing the air temperature to a first and second air threshold, and controlling a proportion of coolant flow and a coolant flow rate to the air-to-liquid heat exchanger and the plurality of nodes based on the comparisons.
摘要翻译： 冷却控制方法包括通过空气 - 液体热交换器测量提供给多个节点的空气的温度，测量多个节点中的至少一个部件的温度并且在所有这些节点之间找到最大分量温度，比较 将最大部件温度提高到第一和第二部件阈值，并将空气温度与第一和第二空气阈值进行比较，并且控制冷却剂流量和冷却剂流量的比例到空气到液体热交换器和多个节点 基于比较。
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