公开(公告)号：US07737546B2

公开(公告)日：2010-06-15

申请号：US11850526

申请日：2007-09-05

申请人： Wai Hoong Moy ,  Chu Kun Tan ,  Keh Chin Seah ,  Paul Beng Hui Oh

发明人： Wai Hoong Moy ,  Chu Kun Tan ,  Keh Chin Seah ,  Paul Beng Hui Oh

IPC分类号： H01L23/48 ,  H01L21/50

CPC分类号： H05K3/3426 ,  H01L23/49861 ,  H01L33/486 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00013 ,  H01L2924/15747 ,  H05K2201/10106 ,  H05K2201/10651 ,  H05K2201/10848 ,  H05K2201/2081 ,  Y02P70/613 ,  H01L2924/00014 ,  H01L2224/29099 ,  H01L2924/00

摘要： A packaged circuit element such as an LED and a method for making the same are disclosed. The packaged circuit element includes a lead frame, a molded body, and a die containing the circuit element. The lead frame has first and second leads, each lead having first and second portions. The molded body surrounds the first portion of each lead, and the die is connected electrically to the first and second leads on the first portions of the first and second leads. The second portion of each of the first and second leads is substantially parallel to opposing side surfaces of the body and include a feature that inhibits molten solder from wetting a portion of the second section of each lead between the feature and the first portion of that lead while allowing the molten solder to wet the remaining surfaces of the second portions.

摘要翻译： 公开了诸如LED的封装电路元件及其制造方法。 封装电路元件包括引线框架，成型体和容纳电路元件的管芯。 引线框架具有第一和第二引线，每个引线具有第一和第二部分。 成形体围绕每个引线的第一部分，并且该裸片与第一和第二引线的第一部分上的第一引线和第二引线电连接。 第一和第二引线中的每一个的第二部分基本上平行于主体的相对的侧表面，并且包括阻止熔融焊料润湿部件与该引线的第一部分之间的每个引线的第二部分的一部分的特征 同时允许熔融焊料润湿第二部分的剩余表面。

公开(公告)号：US20090057850A1

公开(公告)日：2009-03-05

申请号：US11850526

申请日：2007-09-05

申请人： Wai Hoong Moy ,  Chu Kun Tan ,  Keh Chin Seah ,  Paul Beng Hui Oh

发明人： Wai Hoong Moy ,  Chu Kun Tan ,  Keh Chin Seah ,  Paul Beng Hui Oh

IPC分类号： H01L33/00 ,  H01L21/768 ,  H01L23/495

CPC分类号： H05K3/3426 ,  H01L23/49861 ,  H01L33/486 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00013 ,  H01L2924/15747 ,  H05K2201/10106 ,  H05K2201/10651 ,  H05K2201/10848 ,  H05K2201/2081 ,  Y02P70/613 ,  H01L2924/00014 ,  H01L2224/29099 ,  H01L2924/00

摘要： A packaged circuit element such as an LED and a method for making the same are disclosed. The packaged circuit element includes a lead frame, a molded body, and a die containing the circuit element. The lead frame has first and second leads, each lead having first and second portions. The molded body surrounds the first portion of each lead, and the die is connected electrically to the first and second leads on the first portions of the first and second leads. The second portion of each of the first and second leads is substantially parallel to opposing side surfaces of the body and include a feature that inhibits molten solder from wetting a portion of the second section of each lead between the feature and the first portion of that lead while allowing the molten solder to wet the remaining surfaces of the second portions.

摘要翻译： 公开了诸如LED的封装电路元件及其制造方法。 封装电路元件包括引线框架，成型体和容纳电路元件的管芯。 引线框架具有第一和第二引线，每个引线具有第一和第二部分。 成形体围绕每个引线的第一部分，并且该裸片与第一和第二引线的第一部分上的第一引线和第二引线电连接。 第一和第二引线中的每一个的第二部分基本上平行于主体的相对的侧表面，并且包括阻止熔融焊料润湿部件与该引线的第一部分之间的每个引线的第二部分的一部分的特征 同时允许熔融焊料润湿第二部分的剩余表面。