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公开(公告)号：US4472259A
公开(公告)日：1984-09-18
申请号：US316433
申请日：1981-10-29
CPC分类号： H01J37/3405
摘要： A cathode assembly for use in a magnetron sputtering system, the system having a cathode assembly with parallel elongated target segments which are formed substantially of a material which is desired to be sputter-deposited onto a substrate. The elongated target segments are each provided with a material removal surface which is inclined toward the other segment with respect to the plane of the substrate. Such inclination permits the material which is removed from the target bars to be focused onto a relatively narrow area, thereby improving the efficiency of the sputtering operation and reducing machine down-time for cleaning and vacuum pumping. In other embodiments, end target segments are provided for improving the efficiency of film deposition near the ends of the elongated bars. The end target segments are provided with material removal surfaces which are also inclined, and connect with the elongated target segments to form a rectangular frame arrangement.
摘要翻译： 一种用于磁控溅射系统的阴极组件，该系统具有阴极组件，该阴极组件具有基本上由期望溅射沉积到衬底上的材料形成的平行细长靶区段。 细长的目标区段各自设置有相对于基板的平面朝向另一个段倾斜的材料去除表面。 这种倾斜允许将从目标棒移除的材料聚焦到相对较窄的区域上，从而提高溅射操作的效率并减少清洗和真空泵送的机器停机时间。 在其他实施例中，提供端部目标段用于提高细长杆端部附近的膜沉积的效率。 末端目标区段设置有也倾斜的材料去除表面，并且与细长目标区段连接以形成矩形框架布置。
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公开(公告)号：US4422896A
公开(公告)日：1983-12-27
申请号：US342976
申请日：1982-01-26
IPC分类号： H01L21/302 , C23F4/00 , H01J37/32 , H01J37/34 , H01L21/3065 , H01L21/306 , B44C1/22 , C03C15/00 , C03C25/06
CPC分类号： H01J37/32623 , C23F4/00 , H01J37/3266 , H01J37/3405
摘要： Method and apparatus are disclosed for plasma treating a substrate in a hermetic chamber with a magnetic field having lines of force which leave a support, extend across the surface of the substrate and re-enter the support to enclose the substrate exposed surface in a magnetic electron-trapping field. The voltage applied to the substrate support is adjusted to produce a dense glow discharge closely adjacent the substrate surface for reacting chemically therewith.
摘要翻译： 公开了用于等离子体处理密封室中的衬底的方法和装置，其中具有留下支撑件的力线的磁场延伸穿过衬底的表面并重新进入支撑件以将衬底暴露表面包围在磁性电子 捕捉字段。 调节施加到基板支撑件上的电压以产生与基板表面紧密相邻的致密辉光放电，以与其进行化学反应。
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公开(公告)号：US4525262A
公开(公告)日：1985-06-25
申请号：US555449
申请日：1983-11-28
CPC分类号： H01J37/3405
摘要： The film deposition rate of metallic compounds onto a substrate in a vacuum chamber by reactive sputtering or reactive ion plating is significantly increased by providing a substrate support with spaced apart magnetic poles to create a magnetic field having lines of force which leave the support, extend across a surface of the substrate exposed to a metallic coating source and re-enter the support to enclose the exposed surface in a localized magnetic electron-trapping field. A reactive gas is fed into the chamber, and a bias voltage is applied to the substrate support sufficient to create a dense glow discharge of ionized reactive gas closely adjacent to the substrate surface. The reactive gas ions react with metallic particles deposited on the exposed substrate surface from the coating source to form a film of the desired metallic compound. The localized magnetic plasma trap close to the substrate increases the chemical reaction rate at the substrate and reduces back sputtering, to result in a metallic compound coating having superior physical and chemical characteristics.
摘要翻译： 通过反应溅射或反应离子电镀在真空室中的金属化合物在基板上的成膜速率通过提供具有间隔开的磁极的基板支撑而产生具有离开载体的力线的磁场而显着增加 所述基板的表面暴露于金属涂层源并重新进入所述支撑件以将所述暴露表面包围在局部磁性电子捕获场中。 将反应性气体进料到室中，并且将偏置电压施加到衬底支撑件，足以产生与衬底表面紧密相邻的电离反应气体的致密辉光放电。 反应气体离子与沉积在暴露的基底表面上的金属颗粒与涂层源反应，形成所需金属化合物的膜。 靠近基板的局部磁等离子体阱增加了基板的化学反应速率，并减少了反溅射，从而导致具有优异的物理和化学特性的金属化合物涂层。
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公开(公告)号：US4581118A
公开(公告)日：1986-04-08
申请号：US461022
申请日：1983-01-26
申请人： Walter H. Class , Steven D. Hurwitt , Lin I
发明人： Walter H. Class , Steven D. Hurwitt , Lin I
IPC分类号： C23C14/36 , C23C14/06 , C23C14/34 , C23C14/35 , H01J37/34 , H01L21/203 , H01L21/31 , C23C14/50
CPC分类号： H01J37/3405 , C23C14/351
摘要： A substrate support electrode for use in plasma processing equipment has a book-shaped prismatic body containing a magnet core with flange-like pole pieces at each end to provide a longitudinal magnetic field wrapped around the electrode body. An auxiliary field-shaping magnet spaced from a substrate support face of the electrode body, with each of its poles adjacent to the pole piece electrode body with each of its poles adjacent to the of like polarity of the electrode, flattens the magnetic field adjacent to the electrode support surface to produce a thin plasma of substantially uniform thickness close to the electrode surface.
摘要翻译： 用于等离子体处理设备的基板支撑电极具有书形棱柱体，其包含在每个端部具有凸缘状极片的磁芯，以提供缠绕在电极体上的纵向磁场。 与电极体的基板支撑面间隔开的辅助场成形磁体，其每个磁极与极片电极体相邻，其极点与电极的相似极性相邻，使与磁极相邻的磁场平坦化 电极支撑表面以产生接近电极表面的基本上均匀厚度的薄等离子体。
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公开(公告)号：US4428816A
公开(公告)日：1984-01-31
申请号：US497798
申请日：1983-05-25
CPC分类号： H01J37/3423 , H01J37/3408
摘要： A cathode assembly for use in a magnetron sputtering system, the system having a cathode assembly with parallel elongated target segments which are formed substantially of a material which is desired to be sputter-deposited onto a substrate. The elongated target segments are each provided with a material removal surface which is inclined toward the other segment with respect to the plane of the substrate. Such inclination permits the material which is removed from the target bars to be focused onto a relatively narrow area, thereby improving the efficiency of the sputtering operation and reducing machine down-time for cleaning and vacuum pumping. End target segments are provided for improving the efficiency of film deposition near the ends of the elongated bars. The end target segments are provided with material removal surfaces which are also inclined, and connect with the elongated target segments to form a rectangular frame arrangement. An elongated inner pole piece has outwardly extending portions near each end to improve uniformity of a trapping magnetic field between the inner pole piece and a rectangular annular outer pole piece.
摘要翻译： 一种用于磁控溅射系统的阴极组件，该系统具有阴极组件，该阴极组件具有基本上由期望溅射沉积到衬底上的材料形成的平行细长靶区段。 细长的目标区段各自设置有相对于基板的平面朝向另一个段倾斜的材料去除表面。 这种倾斜允许将从目标棒移除的材料聚焦到相对较窄的区域上，从而提高溅射操作的效率并减少清洗和真空泵送的机器停机时间。 提供末端靶区段以提高在细长杆的端部附近的膜沉积的效率。 末端目标区段设置有也倾斜的材料去除表面，并且与细长目标区段连接以形成矩形框架布置。 细长的内极片在每端附近具有向外延伸的部分，以提高内极片与矩形环形外极片之间的捕获磁场的均匀性。
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公开(公告)号：US4198283A
公开(公告)日：1980-04-15
申请号：US957698
申请日：1978-11-06
CPC分类号： H01J37/3423 , H01J37/3408 , H01J37/3435
摘要： A magnetron cathode assembly for use in a cathode sputtering apparatus includes a support means for a rectangular frame-like annular target and spaced apart inner and outer pole pieces fastened to the support member and providing a rectangular annular channel for mounting the target in electrically and thermally conductive contact with the support means. Preferably, the target is a set of four straight bars shaped at the ends to assemble together as a rectangular frame. Target bars having a symmetrical hourglass cross section with overhanging flanged side portions adjacent to front and rear faces are adapted to be reversibly clamped to the support means by the inner and outer poles for simple and rapid replacement in the field, said hourglass shape providing maximum utilization of target material.
摘要翻译： 用于阴极溅射装置的磁控管阴极组件包括用于矩形框状环状靶的支撑装置和紧固到支撑构件的间隔开的内极和外极片，并提供矩形环形通道，用于将电极和热安装 与支撑装置导电接触。 优选地，目标是在端部处成形为四个直杆的组合，以将其组装成矩形框架。 具有对称沙漏横截面的目标杆具有与前后表面相邻的凸出的凸缘侧部分，适于通过内外极杆可逆地夹紧到支撑装置上，以便在现场进行简单和快速的更换，所述沙漏形状提供最大的利用率 的目标材料。
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公开(公告)号：US4842703A
公开(公告)日：1989-06-27
申请号：US159318
申请日：1988-02-23
申请人： Walter H. Class , James F. Smith
发明人： Walter H. Class , James F. Smith
CPC分类号： H01J37/3405 , C23C14/3407
摘要： A magnetron sputter coating assembly. The assembly includes a concave consumable target spaced closely to a substrate coating position. Coating uniformity is maintained by controlling ion formation between the substrate and the target. This is accomplished with a plurality of ferromagnetic pole pieces and two individually energizable current carrying coils. The consumable target may be constructed in two segments. A first inner segment defines a generally planar target base parallel to the substrate surface to be coated. A second, outer target segment has a coating surface that forms an angle with respect to the substrate surface.
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