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    Apparatus and system for roll-to-roll processing
    1.
    发明授权
    Apparatus and system for roll-to-roll processing 有权
    卷对卷加工的设备和系统

    公开(公告)号：US07926758B2

    公开(公告)日：2011-04-19

    申请号：US11461121

    申请日：2006-07-31

    申请人： Wan-Wen Chiu ,  Chao-Kai Cheng ,  Jie-Kai Chang ,  Cheng-Yi Wang

    发明人： Wan-Wen Chiu ,  Chao-Kai Cheng ,  Jie-Kai Chang ,  Cheng-Yi Wang

    IPC分类号： B65H23/32

    CPC分类号： B65H23/32 ,  B65H23/0216 ,  B65H2404/531

    摘要： An apparatus for roll-to-roll processing includes a first roller for converting the transmission of a roll of flexible material from a first direction to a second direction substantially orthogonal to the first direction, a second roller spaced apart from the first roller and extending transversely with respect to the first roller for converting the transmission of the roll of flexible material from the second direction to a third direction substantially orthogonal to the first direction and the second direction, and a third roller spaced apart from the second roller and extending perpendicularly with respect to the first roller for converting the transmission of the roll of flexible material from the third direction to a fourth direction, wherein the roll of flexible material includes a first side and a second side, and wherein the first roller, the second roller and the third roller contact the same one of the first side and the second side of the roll of flexible material.

    摘要翻译： 一种用于卷对卷处理的设备包括：第一辊，用于将柔性材料卷从第一方向传播到基本上垂直于第一方向的第二方向;第二辊，与第一辊间隔开并横向延伸 相对于用于将柔性材料卷从第二方向传输到基本上与第一方向和第二方向正交的第三方向的第一辊，以及与第二辊间隔开并且相对于第二辊垂直延伸的第三辊 用于将柔性材料卷的传送从第三方向传递到第四方向的第一辊，其中该柔性材料卷包括第一侧和第二侧，并且其中第一辊，第二辊和第三辊 辊接触柔性材料卷的第一侧和第二侧的相同的一个。

    SUPPLY SYSTEM AND INJECTION-HEAD STRUCTURE THEREOF
    2.
    发明申请
    SUPPLY SYSTEM AND INJECTION-HEAD STRUCTURE THEREOF 有权
    供应系统及其注射头结构

    公开(公告)号：US20090262165A1

    公开(公告)日：2009-10-22

    申请号：US12197160

    申请日：2008-08-22

    申请人： Cheng-Yi Wang ,  Wan-Wen Chiu ,  Kuo-Hua Wu ,  Chen-Chu Tsai ,  Chao-Kai Cheng

    发明人： Cheng-Yi Wang ,  Wan-Wen Chiu ,  Kuo-Hua Wu ,  Chen-Chu Tsai ,  Chao-Kai Cheng

    IPC分类号： B41J2/06

    CPC分类号： B41J2/145 ,  B41J2/175 ,  B41J2/19 ,  B41J2202/20

    摘要： A supply system capable of providing a working fluid is provided. The supply system includes an access device, a first energizer, a second energizer, a third energizer and an output device. The access device utilized to access the working fluid includes a connecting port. The first energizer provides a first energy to energize the working fluid, thereby expelling the bubbles from the working fluid. The second energizer provides a second energy to energize the working fluid received in the access device, thereby expelling the working fluid through the connecting port of the access device. The output device is connected to the access device, thereby receiving and outputting the working fluid. The third energizer provides a third energy to heat the working fluid passing through the access device and the output device.

    摘要翻译： 提供了能够提供工作流体的供应系统。 供电系统包括一个接入装置，一个第一激发器，一个第二激发器，一个第三激发器和一个输出装置。 用于接近工作流体的进入装置包括连接端口。 第一激发器提供第一能量来激励工作流体，从而从工作流体排出气泡。 第二激发器提供第二能量以激励接入设备中接收的工作流体，从而通过接入设备的连接端口排出工作流体。 输出装置与接入装置连接，从而接收并输出工作流体。 第三激发器提供第三能量来加热通过进入装置和输出装置的工作流体。

    Supply system and injection-head structure thereof
    3.
    发明授权
    Supply system and injection-head structure thereof 有权
    供应系统及其注射头结构

    公开(公告)号：US08172387B2

    公开(公告)日：2012-05-08

    申请号：US12197160

    申请日：2008-08-22

    申请人： Cheng-Yi Wang ,  Wan-Wen Chiu ,  Kuo-Hua Wu ,  Chen-Chu Tsai ,  Chao-Kai Cheng

    发明人： Cheng-Yi Wang ,  Wan-Wen Chiu ,  Kuo-Hua Wu ,  Chen-Chu Tsai ,  Chao-Kai Cheng

    IPC分类号： B41J2/19

    CPC分类号： B41J2/145 ,  B41J2/175 ,  B41J2/19 ,  B41J2202/20

    摘要： A supply system capable of providing a working fluid is provided. The supply system includes an access device, a first energizer, a second energizer, a third energizer and an output device. The access device utilized to access the working fluid includes a connecting port. The first energizer provides a first energy to energize the working fluid, thereby expelling the bubbles from the working fluid. The second energizer provides a second energy to energize the working fluid received in the access device, thereby expelling the working fluid through the connecting port of the access device. The output device is connected to the access device, thereby receiving and outputting the working fluid. The third energizer provides a third energy to heat the working fluid passing through the access device and the output device.

    摘要翻译： 提供了能够提供工作流体的供应系统。 供电系统包括一个接入装置，一个第一激发器，一个第二激发器，一个第三激发器和一个输出装置。 用于接近工作流体的进入装置包括连接端口。 第一激发器提供第一能量来激励工作流体，从而从工作流体排出气泡。 第二激发器提供第二能量以激励接入设备中接收的工作流体，从而通过接入设备的连接端口排出工作流体。 输出装置与接入装置连接，从而接收并输出工作流体。 第三激发器提供第三能量来加热通过进入装置和输出装置的工作流体。

    LAMPSHADE AND ILLUMINATION MODULE
    4.
    发明申请
    LAMPSHADE AND ILLUMINATION MODULE 审中-公开
    LAMPSHADE和照明模块

    公开(公告)号：US20140138559A1

    公开(公告)日：2014-05-22

    申请号：US13678559

    申请日：2012-11-16

    申请人： Tzyy-Jang Tseng ,  Cheng-Yi Wang

    发明人： Tzyy-Jang Tseng ,  Cheng-Yi Wang

    IPC分类号： F21V1/00 ,  G21K5/00

    CPC分类号： G21K5/00 ,  F21K9/64 ,  F21V3/02 ,  F21V3/049 ,  F21Y2115/10 ,  H01L33/507 ,  H01L33/58

    摘要： A lampshade including a plurality of plate structures is provided. The plurality of plate structures are connected to one another to form a hollow casing having an opening. An illumination module including a base plate, a light source, and a lampshade is further provided. The light source is disposed on the base plate. The lampshade is covered on the base plate, and the light source is sited between the base plate and the lampshade. The lampshade includes a plurality of plate structures, wherein the plurality of plate structures are connected to one another to form a hollow casing having an opening.

    摘要翻译： 提供了包括多个板结构的灯罩。 多个板结构彼此连接以形成具有开口的中空壳体。 还提供了包括基板，光源和灯罩的照明模块。 光源设置在基板上。 灯罩覆盖在底板上，光源位于底板和灯罩之间。 灯罩包括多个板结构，其中多个板结构彼此连接以形成具有开口的中空壳体。

    SINGLE CHIP SEMICONDUCTOR COATING STRUCTURE AND MANUFACTURING METHOD THEREOF
    5.
    发明申请
    SINGLE CHIP SEMICONDUCTOR COATING STRUCTURE AND MANUFACTURING METHOD THEREOF 有权
    单芯片半导体涂层结构及其制造方法

    公开(公告)号：US20110204516A1

    公开(公告)日：2011-08-25

    申请号：US12711712

    申请日：2010-02-24

    申请人： Liang-Chieh Wu ,  Cheng-Yi Wang

    发明人： Liang-Chieh Wu ,  Cheng-Yi Wang

    IPC分类号： H01L23/498 ,  H01L21/60

    CPC分类号： H01L21/568 ,  H01L24/27 ,  H01L24/29 ,  H01L24/30 ,  H01L24/33 ,  H01L2924/00011 ,  H01L2924/00013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01082 ,  H01L2224/29298 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/2929

    摘要： A manufacturing method of a single chip semiconductor coating structure includes following steps. Step 1 is providing a single chip semiconductor which has a plurality of surfaces, and two opposite surfaces selected from the plurality of surfaces are manufacturing surfaces and have a conductive area with a pad thereon, respectively. Step 2 is providing a tool to cover one of the conductive areas with the pad. Step 3 is providing a coating step to form an insulating layer on the single chip semiconductor. Step 4 is providing a removing step to remove the insulating layer for exposing the covered conductive area and the pad. Step 5 is forming two electrodes and each of the two electrodes covers the conductive area with the pad.

    摘要翻译： 单芯片半导体涂层结构的制造方法包括以下步骤。 步骤1是提供具有多个表面的单芯片半导体，并且从多个表面中选择的两个相对表面分别是制造表面，并且在其上具有衬垫的导电区域。 步骤2提供了用垫覆盖导电区域之一的工具。 步骤3提供了在单芯片半导体上形成绝缘层的涂覆步骤。 步骤4提供去除用于暴露被覆盖的导电区域和垫的绝缘层的去除步骤。 步骤5形成两个电极，并且两个电极中的每个电极用垫覆盖导电区域。

    Brushing device of a container of liquid cosmetics
    6.
    发明申请
    Brushing device of a container of liquid cosmetics 有权
    液体化妆品容器的刷洗装置

    公开(公告)号：US20080286034A1

    公开(公告)日：2008-11-20

    申请号：US11979646

    申请日：2007-11-07

    申请人： Ming-Chih Chu ,  Cheng-Yi Wang

    发明人： Ming-Chih Chu ,  Cheng-Yi Wang

    IPC分类号： A46B11/00

    CPC分类号： A45D34/04 ,  A45D34/042 ,  A46B11/0041 ,  A46B11/0079 ,  A46B2200/1046

    摘要： A liquid cosmetics container has a brushing device, which includes an applying component joined to a container body, and a clipping component around the applying component; the applying component is positioned over an opening of the container body, and has a passage therein for liquid cosmetics to flow through; the applying component has an applying portion at a tail, which is around a tail end of the passage; the clipping element has an opening end, and two gaps extending through the opening end, therefore the opening end is compressible; the clipping component has two opposing clipping portions on an inner side of the opening end; a cap is used to cover the opening of the container body; the cap has a squeezing portion on an inner side to compress the opening end of the clipping component so as to block the passage of the applying component.

    摘要翻译： 液体化妆品容器具有刷装置，其包括连接到容器主体的施加部件和围绕施加部件的夹持部件; 所述涂敷部件位于所述容器主体的开口部的上方，并具有用于使液体化妆品流过的通道; 所述施加部件具有位于所述通道的尾端附近的尾部的施加部分; 剪切元件具有开口端，并且延伸穿过开口端的两个间隙，因此开口端是可压缩的; 夹持部件在开口端的内侧具有两个相对的夹持部分; 盖用于覆盖容器主体的开口; 盖在内侧具有挤压部分，以压缩夹持部件的开口端，以阻止施加部件的通过。

    Single chip semiconductor coating structure and manufacturing method thereof
    8.
    发明授权
    Single chip semiconductor coating structure and manufacturing method thereof 有权
    单芯片半导体涂层结构及其制造方法

    公开(公告)号：US08278756B2

    公开(公告)日：2012-10-02

    申请号：US12711712

    申请日：2010-02-24

    申请人： Liang-Chieh Wu ,  Cheng-Yi Wang

    发明人： Liang-Chieh Wu ,  Cheng-Yi Wang

    IPC分类号： H01L23/52

    CPC分类号： H01L21/568 ,  H01L24/27 ,  H01L24/29 ,  H01L24/30 ,  H01L24/33 ,  H01L2924/00011 ,  H01L2924/00013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01082 ,  H01L2224/29298 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/2929

    摘要： A manufacturing method of a single chip semiconductor coating structure includes following steps. Step 1 is providing a single chip semiconductor which has a plurality of surfaces, and two opposite surfaces selected from the plurality of surfaces are manufacturing surfaces and have a conductive area with a pad thereon, respectively. Step 2 is providing a tool to cover one of the conductive areas with the pad. Step 3 is providing a coating step to form an insulating layer on the single chip semiconductor. Step 4 is providing a removing step to remove the insulating layer for exposing the covered conductive area and the pad. Step 5 is forming two electrodes and each of the two electrodes covers the conductive area with the pad.

    摘要翻译： 单芯片半导体涂层结构的制造方法包括以下步骤。 步骤1是提供具有多个表面的单芯片半导体，并且从多个表面中选择的两个相对表面分别是制造表面，并且在其上具有衬垫的导电区域。 步骤2提供了用垫覆盖导电区域之一的工具。 步骤3提供了在单芯片半导体上形成绝缘层的涂覆步骤。 步骤4提供去除用于暴露被覆盖的导电区域和垫的绝缘层的去除步骤。 步骤5形成两个电极，并且两个电极中的每个电极用垫覆盖导电区域。

    Structure of a make-up container
    9.
    发明申请
    Structure of a make-up container 审中-公开
    化妆品容器的结构

    公开(公告)号：US20080314405A1

    公开(公告)日：2008-12-25

    申请号：US11812539

    申请日：2007-06-20

    申请人： Ming-Chih Chu ,  Cheng-Yi Wang

    发明人： Ming-Chih Chu ,  Cheng-Yi Wang

    IPC分类号： A45D40/26

    CPC分类号： A45D34/04 ,  A45D2200/051 ,  A61H7/003 ,  A61H2201/105 ,  A61H2201/169

    摘要： A make-up container includes a containing body, a soft application device, a rigid reinforcement element for the soft application device, and a cap; the containing body has an opening, and the reinforcement element is positioned on the opening of the containing body; the application device surrounds and covers an annular portion of the reinforcement element at a base portion thereof therefore the base portion of the application device can't change shape easily even if it is subjected to pressure; the application device and the containing body are joined together so as to be inseparable; the application device has a through hole on one end thereof, which communicates with an inside of the containing body; the cap serves to cover the application device.

    摘要翻译： 一种化妆容器包括容纳体，软涂敷装置，用于软涂敷装置的刚性加强件和帽; 容纳体具有开口，并且加强元件位于容纳体的开口上; 应用装置在其基部围绕并覆盖加强元件的环形部分，因此施加装置的基部即使经受压力也不容易改变形状; 所述应用装置和所述容纳体是不可分离的， 所述应用装置的一端具有与所述容纳体的内部连通的通孔， 盖用于覆盖应用设备。