公开(公告)号：US20210226401A1

公开(公告)日：2021-07-22

申请号：US17220392

申请日：2021-04-01

Applicant: Waymo LLC

Inventor： Bernard Fidric ,  Daniel Rosenfeld ,  Rahim Pardhan

IPC: H01S3/04 ,  G01S7/481 ,  H01S3/067 ,  G01S17/02 ,  G02B6/02 ,  G02B6/255 ,  H01S3/094 ,  H01S3/16

Abstract: The present disclosure relates to a fiber encapsulation mechanism for energy dissipation in a fiber amplifying system. One example embodiment includes an optical fiber amplifier. The optical fiber amplifier includes an optical fiber that includes a gain medium, as well as a polymer layer that at least partially surrounds the optical fiber. The polymer layer is optically transparent. In addition, the optical fiber amplifier includes a pump source. Optical pumping by the pump source amplifies optical signals in the optical fiber and generates excess heat and excess photons. The optical fiber amplifier additionally includes a heatsink layer disposed adjacent to the polymer layer. The heatsink layer conducts the excess heat away from the optical fiber. Further, the optical fiber amplifier includes an optically transparent layer disposed adjacent to the polymer layer. The optically transparent layer transmits the excess photons away from the optical fiber.

公开(公告)号：US09787048B1

公开(公告)日：2017-10-10

申请号：US15294886

申请日：2016-10-17

Applicant: Waymo LLC

Inventor： Bernard Fidric ,  Daniel Rosenfeld ,  Rahim Pardhan

IPC: H01S3/04 ,  H01S3/067 ,  G02B6/02 ,  G02B6/44 ,  G02B6/255 ,  H01S3/16 ,  G01S17/02 ,  H01S3/094

CPC classification number: H01S3/0405 ,  G01S7/4818 ,  G01S17/02 ,  G01S17/10 ,  G02B6/02395 ,  G02B6/2551 ,  G02B6/2558 ,  H01S3/005 ,  H01S3/0064 ,  H01S3/0078 ,  H01S3/042 ,  H01S3/06704 ,  H01S3/06754 ,  H01S3/06758 ,  H01S3/06783 ,  H01S3/0804 ,  H01S3/094003 ,  H01S3/094007 ,  H01S3/094069 ,  H01S3/09415 ,  H01S3/1603 ,  H01S3/1608 ,  H01S3/1618 ,  H01S2301/03

Abstract: The present disclosure relates to a fiber encapsulation mechanism for energy dissipation in a fiber amplifying system. One example embodiment includes an optical fiber amplifier. The optical fiber amplifier includes an optical fiber that includes a gain medium, as well as a polymer layer that at least partially surrounds the optical fiber. The polymer layer is optically transparent. In addition, the optical fiber amplifier includes a pump source. Optical pumping by the pump source amplifies optical signals in the optical fiber and generates excess heat and excess photons. The optical fiber amplifier additionally includes a heatsink layer disposed adjacent to the polymer layer. The heatsink layer conducts the excess heat away from the optical fiber. Further, the optical fiber amplifier includes an optically transparent layer disposed adjacent to the polymer layer. The optically transparent layer transmits the excess photons away from the optical fiber.

公开(公告)号：US11843217B2

公开(公告)日：2023-12-12

申请号：US17220392

申请日：2021-04-01

Applicant: Waymo LLC

Inventor： Bernard Fidric ,  Daniel Rosenfeld ,  Rahim Pardhan

IPC: H01S3/04 ,  G01S7/481 ,  H01S3/067 ,  G02B6/02 ,  G01S17/02 ,  G02B6/255 ,  H01S3/094 ,  H01S3/16 ,  H01S3/042 ,  H01S3/0804 ,  H01S3/00 ,  G01S17/10 ,  H01S3/0941

CPC classification number: H01S3/0405 ,  G01S7/4818 ,  G01S17/02 ,  G02B6/02395 ,  G02B6/2551 ,  G02B6/2558 ,  H01S3/06754 ,  H01S3/06758 ,  H01S3/06783 ,  H01S3/094003 ,  H01S3/1603 ,  G01S17/10 ,  H01S3/005 ,  H01S3/0064 ,  H01S3/0078 ,  H01S3/042 ,  H01S3/06704 ,  H01S3/0804 ,  H01S3/09415 ,  H01S3/094007 ,  H01S3/094069 ,  H01S3/1608 ,  H01S3/1618 ,  H01S2301/03

Abstract: The present disclosure relates to a fiber encapsulation mechanism for energy dissipation in a fiber amplifying system. One example embodiment includes an optical fiber amplifier. The optical fiber amplifier includes an optical fiber that includes a gain medium, as well as a polymer layer that at least partially surrounds the optical fiber. The polymer layer is optically transparent. In addition, the optical fiber amplifier includes a pump source. Optical pumping by the pump source amplifies optical signals in the optical fiber and generates excess heat and excess photons. The optical fiber amplifier additionally includes a heatsink layer disposed adjacent to the polymer layer. The heatsink layer conducts the excess heat away from the optical fiber. Further, the optical fiber amplifier includes an optically transparent layer disposed adjacent to the polymer layer. The optically transparent layer transmits the excess photons away from the optical fiber.

公开(公告)号：US20180109062A1

公开(公告)日：2018-04-19

申请号：US15691917

申请日：2017-08-31

Applicant: Waymo LLC

Inventor： Bernard Fidric ,  Daniel Rosenfeld ,  Rahim Pardhan

IPC: H01S3/04 ,  H01S3/094 ,  G01S17/02 ,  G02B6/255 ,  H01S3/067 ,  G02B6/02 ,  H01S3/16

Abstract: The present disclosure relates to a fiber encapsulation mechanism for energy dissipation in a fiber amplifying system. One example embodiment includes an optical fiber amplifier. The optical fiber amplifier includes an optical fiber that includes a gain medium, as well as a polymer layer that at least partially surrounds the optical fiber. The polymer layer is optically transparent. In addition, the optical fiber amplifier includes a pump source. Optical pumping by the pump source amplifies optical signals in the optical fiber and generates excess heat and excess photons. The optical fiber amplifier additionally includes a heatsink layer disposed adjacent to the polymer layer. The heatsink layer conducts the excess heat away from the optical fiber. Further, the optical fiber amplifier includes an optically transparent layer disposed adjacent to the polymer layer. The optically transparent layer transmits the excess photons away from the optical fiber.

公开(公告)号：US10992096B2

公开(公告)日：2021-04-27

申请号：US15972680

申请日：2018-05-07

Applicant: Waymo LLC

Inventor： Bernard Fidric ,  Daniel Rosenfeld ,  Rahim Pardhan

IPC: H01S3/04 ,  G01S7/481 ,  H01S3/067 ,  G02B6/02 ,  G02B6/255 ,  H01S3/16 ,  G01S17/02 ,  H01S3/094 ,  H01S3/042 ,  H01S3/08 ,  H01S3/00 ,  G01S17/10 ,  H01S3/0941

Abstract: The present disclosure relates to a fiber encapsulation mechanism for energy dissipation in a fiber amplifying system. One example embodiment includes an optical fiber amplifier. The optical fiber amplifier includes an optical fiber that includes a gain medium, as well as a polymer layer that at least partially surrounds the optical fiber. The polymer layer is optically transparent. In addition, the optical fiber amplifier includes a pump source. Optical pumping by the pump source amplifies optical signals in the optical fiber and generates excess heat and excess photons. The optical fiber amplifier additionally includes a heatsink layer disposed adjacent to the polymer layer. The heatsink layer conducts the excess heat away from the optical fiber. Further, the optical fiber amplifier includes an optically transparent layer disposed adjacent to the polymer layer. The optically transparent layer transmits the excess photons away from the optical fiber.

公开(公告)号：US10693272B2

公开(公告)日：2020-06-23

申请号：US15691917

申请日：2017-08-31

Applicant: Waymo LLC

Inventor： Bernard Fidric ,  Daniel Rosenfeld ,  Rahim Pardhan

IPC: H01S3/04 ,  G01S7/481 ,  H01S3/067 ,  G01S17/02 ,  G02B6/02 ,  G02B6/255 ,  H01S3/094 ,  H01S3/16 ,  H01S3/042 ,  H01S3/08 ,  G01S17/10 ,  H01S3/0941 ,  H01S3/00

Abstract: The present disclosure relates to a fiber encapsulation mechanism for energy dissipation in a fiber amplifying system. One example embodiment includes an optical fiber amplifier. The optical fiber amplifier includes an optical fiber that includes a gain medium, as well as a polymer layer that at least partially surrounds the optical fiber. The polymer layer is optically transparent. In addition, the optical fiber amplifier includes a pump source. Optical pumping by the pump source amplifies optical signals in the optical fiber and generates excess heat and excess photons. The optical fiber amplifier additionally includes a heatsink layer disposed adjacent to the polymer layer. The heatsink layer conducts the excess heat away from the optical fiber. Further, the optical fiber amplifier includes an optically transparent layer disposed adjacent to the polymer layer. The optically transparent layer transmits the excess photons away from the optical fiber.

公开(公告)号：US20180254594A1

公开(公告)日：2018-09-06

申请号：US15972680

申请日：2018-05-07

Applicant: Waymo LLC

Inventor： Bernard Fidric ,  Daniel Rosenfeld ,  Rahim Pardhan

IPC: H01S3/04 ,  H01S3/16 ,  G02B6/255 ,  G02B6/02 ,  H01S3/067 ,  H01S3/094 ,  G01S17/02

CPC classification number: H01S3/0405 ,  G01S7/4818 ,  G01S17/02 ,  G01S17/10 ,  G02B6/02395 ,  G02B6/2551 ,  G02B6/2558 ,  H01S3/005 ,  H01S3/0064 ,  H01S3/0078 ,  H01S3/042 ,  H01S3/06704 ,  H01S3/06754 ,  H01S3/06758 ,  H01S3/06783 ,  H01S3/0804 ,  H01S3/094003 ,  H01S3/094007 ,  H01S3/094069 ,  H01S3/09415 ,  H01S3/1603 ,  H01S3/1608 ,  H01S3/1618 ,  H01S2301/03

Abstract: The present disclosure relates to a fiber encapsulation mechanism for energy dissipation in a fiber amplifying system. One example embodiment includes an optical fiber amplifier. The optical fiber amplifier includes an optical fiber that includes a gain medium, as well as a polymer layer that at least partially surrounds the optical fiber. The polymer layer is optically transparent. In addition, the optical fiber amplifier includes a pump source. Optical pumping by the pump source amplifies optical signals in the optical fiber and generates excess heat and excess photons. The optical fiber amplifier additionally includes a heatsink layer disposed adjacent to the polymer layer. The heatsink layer conducts the excess heat away from the optical fiber. Further, the optical fiber amplifier includes an optically transparent layer disposed adjacent to the polymer layer. The optically transparent layer transmits the excess photons away from the optical fiber.