公开(公告)号：US5213875A

公开(公告)日：1993-05-25

申请号：US241679

申请日：1988-09-07

申请人： Wei-Fang A. Su ,  Anthony P. Barrett

发明人： Wei-Fang A. Su ,  Anthony P. Barrett

IPC分类号： C08F2/50 ,  C08F290/14 ,  H05K3/28

CPC分类号： C08F290/14 ,  H05K3/287 ,  Y10S525/922 ,  Y10T428/24917

摘要： Resin compositions comprising 20 to 50% by weight, based on total composition weight, of a first resin which comprises an acrylate-epoxy oligomer having a molecular weight of from 2000 to 5000; from 2 to 10% of a second resin which comprises an acrylate-urethane oligomer; up to 50% of a third resin which comprises a second acrylate-epoxy oligomer, where from 1 to 5% of the epoxy is an epoxy novolac; from 10 to 40% of a liquid acrylate; from 2 to 20% of a liquid diacrylate having an ether linkage; from 5 to 25% of a liquid alkylene diacrylate; and from 1 to 5% of a UV photoinitiator. The compositions also preferably includes from 0.05 to 1% of a flow control agent. The compositions are applied to substrates such as printed wiring boards and cured with ultraviolet light to form a conformal coating on the substrate.

摘要翻译： 基于总组合物重量，包含20至50重量％的包含分子量为2000-5000的丙烯酸酯 - 环氧低聚物的第一树脂; 2至10％的包含丙烯酸酯 - 氨基甲酸酯低聚物的第二种树脂; 高达50％的第三种树脂，其包含第二丙烯酸酯 - 环氧低聚物，其中1至5％的环氧树脂为环氧酚醛清漆; 10至40％的液态丙烯酸酯; 2至20％的具有醚键的液体二丙烯酸酯; 5至25％的液体亚烷基二丙烯酸酯; 和1至5％的UV光引发剂。 组合物还优选包含0.05至1％的流动控制剂。 将组合物施加到诸如印刷线路板的基底上并用紫外光固化，以在基底上形成保形涂层。

公开(公告)号：US4999136A

公开(公告)日：1991-03-12

申请号：US235089

申请日：1988-08-23

申请人： Wei-Fang A. Su ,  Anthony P. Barrett ,  Luciano C. Scala ,  Karl F. Schoch, Jr.

发明人： Wei-Fang A. Su ,  Anthony P. Barrett ,  Luciano C. Scala ,  Karl F. Schoch, Jr.

IPC分类号： C08F299/02 ,  H01B1/22 ,  H05K1/18 ,  H05K3/30 ,  H05K3/32

CPC分类号： H01B1/22 ,  C08F299/028 ,  H05K3/305 ,  H05K3/321 ,  H05K1/181 ,  H05K2201/10636 ,  Y02P70/611 ,  Y02P70/613 ,  Y10S428/901

摘要： A UV curable electrically conductive adhesive has been developed with low resistivity, adequate lap shear strength, good thermal stability, and very stable conductivity at high temperatures of about 100.degree. C. and high humidity. The adhesive may be applied by silk screen printing and cured by UV in about 8 seconds. The adhesive may also be used as a replacement of solder in automated surface mount technology for electronic circuit fabrication. The adhesive is a mixture of (A) a blend of an acrylate epoxy and a urethane, a copolymer of an acrylate epoxy and a urethane, or mixtures thereof; (B) a polyfunctional acrylate monomer; (C) a photoinitiator, and (D) a conductive filler. Optionally, adhesion promoters and flow control agents may be used.

摘要翻译： 紫外线固化导电粘合剂已经开发出具有低电阻率，足够的搭接剪切强度，良好的热稳定性和在约100℃和高湿度的高温下非常稳定的导电性。 粘合剂可以通过丝网印刷施加，并通过UV固化约8秒。 粘合剂也可用作替代用于电子电路制造的自动表面贴装技术中的焊料。 粘合剂是（A）丙烯酸酯环氧树脂和氨基甲酸酯的共混物，丙烯酸酯环氧树脂和氨基甲酸酯的共聚物或其混合物的混合物; （B）多官能丙烯酸酯单体; （C）光引发剂，（D）导电填料。 任选地，可以使用粘合促进剂和流动控制剂。