公开(公告)号：US09252019B2

公开(公告)日：2016-02-02

申请号：US13222502

申请日：2011-08-31

申请人： Wen-Chi Tsai ,  Chia-Han Lai ,  Yung-Chung Chen ,  Mei-Yun Wang ,  Chii-Ming Wu ,  Fang-Cheng Chen ,  Huang-Ming Chen ,  Ming-Ta Lei

发明人： Wen-Chi Tsai ,  Chia-Han Lai ,  Yung-Chung Chen ,  Mei-Yun Wang ,  Chii-Ming Wu ,  Fang-Cheng Chen ,  Huang-Ming Chen ,  Ming-Ta Lei

IPC分类号： H01L21/768 ,  H01L21/285 ,  H01L29/417 ,  H01L21/02 ,  H01L29/66

CPC分类号： H01L29/78 ,  H01L21/02063 ,  H01L21/28512 ,  H01L21/28518 ,  H01L21/76802 ,  H01L21/76805 ,  H01L21/76814 ,  H01L21/76825 ,  H01L21/76831 ,  H01L21/76844 ,  H01L21/76855 ,  H01L23/485 ,  H01L23/535 ,  H01L29/41775 ,  H01L29/45 ,  H01L29/6659 ,  H01L2924/0002 ,  H01L2924/00

摘要： A system and method for forming and using a liner is provided. An embodiment comprises forming an opening in an inter-layer dielectric over a substrate and forming the liner along the sidewalls of the opening. A portion of the liner is removed from a bottom of the opening, and a cleaning process may be performed through the liner. By using the liner, damage to the sidewalls of the opening from the cleaning process may be reduced or eliminated. Additionally, the liner may be used to help implantation of ions within the substrate.

摘要翻译： 提供了一种用于形成和使用衬套的系统和方法。 一个实施例包括在衬底之上的层间电介质中形成开口，并沿着开口的侧壁形成衬垫。 衬套的一部分从开口的底部移除，并且可以通过衬套执行清洁过程。 通过使用衬垫，可以减少或消除从清洁过程对开口侧壁的损坏。 另外，衬垫可用于帮助衬底内的离子注入。

公开(公告)号：US20130049219A1

公开(公告)日：2013-02-28

申请号：US13222502

申请日：2011-08-31

申请人： Wen-Chi Tsai ,  Chia-Han Lai ,  Yung-Chung Chen ,  Mei-Yun Wang ,  Chii-Ming Wu ,  Fang-Cheng Chen ,  Huang-Ming Chen ,  Ming-ta Lei

发明人： Wen-Chi Tsai ,  Chia-Han Lai ,  Yung-Chung Chen ,  Mei-Yun Wang ,  Chii-Ming Wu ,  Fang-Cheng Chen ,  Huang-Ming Chen ,  Ming-ta Lei

IPC分类号： H01L21/768 ,  H01L23/48

CPC分类号： H01L29/78 ,  H01L21/02063 ,  H01L21/28512 ,  H01L21/28518 ,  H01L21/76802 ,  H01L21/76805 ,  H01L21/76814 ,  H01L21/76825 ,  H01L21/76831 ,  H01L21/76844 ,  H01L21/76855 ,  H01L23/485 ,  H01L23/535 ,  H01L29/41775 ,  H01L29/45 ,  H01L29/6659 ,  H01L2924/0002 ,  H01L2924/00

摘要： A system and method for forming and using a liner is provided. An embodiment comprises forming an opening in an inter-layer dielectric over a substrate and forming the liner along the sidewalls of the opening. A portion of the liner is removed from a bottom of the opening, and a cleaning process may be performed through the liner. By using the liner, damage to the sidewalls of the opening from the cleaning process may be reduced or eliminated. Additionally, the liner may be used to help implantation of ions within the substrate.

摘要翻译： 提供了一种用于形成和使用衬套的系统和方法。 一个实施例包括在衬底之上的层间电介质中形成开口，并沿着开口的侧壁形成衬垫。 衬套的一部分从开口的底部移除，并且可以通过衬套执行清洁过程。 通过使用衬垫，可以减少或消除从清洁过程对开口侧壁的损坏。 另外，衬垫可用于帮助衬底内的离子注入。

公开(公告)号：US08304319B2

公开(公告)日：2012-11-06

申请号：US12836026

申请日：2010-07-14

申请人： Chun-Wen Nieh ,  Hung-Chang Hsu ,  Wen-Chi Tsai ,  Mei-Yun Wang ,  Chii-Ming Wu ,  Wei-Jung Lin ,  Chih-Wei Chang

发明人： Chun-Wen Nieh ,  Hung-Chang Hsu ,  Wen-Chi Tsai ,  Mei-Yun Wang ,  Chii-Ming Wu ,  Wei-Jung Lin ,  Chih-Wei Chang

IPC分类号： H01L21/4763 ,  H01L21/8222

CPC分类号： H01L29/665 ,  H01L29/66575 ,  H01L29/7833

摘要： Methods for fabricating a semiconductor device are disclosed. A metal-rich silicide and/or a mono-silicide is formed on source/drain (S/D) regions. A millisecond anneal is provided to the metal-rich silicide and/or the mono-silicide to form a di-silicide with limited spikes at the interface between the silicide and substrate. The di-silicide has an additive which can lower the electron Schottky barrier height.

摘要翻译： 公开了制造半导体器件的方法。 在源极/漏极（S / D）区域上形成富金属硅化物和/或单硅化物。 向富金属硅化物和/或单硅化物提供毫秒退火以在硅化物和衬底之间的界面处形成具有有限尖峰的二硅化物。 二硅化物具有可以降低电子肖特基势垒高度的添加剂。

公开(公告)号：US20100155424A1

公开(公告)日：2010-06-24

申请号：US12588893

申请日：2009-11-02

申请人： Wen-Chi Tsai

发明人： Wen-Chi Tsai

IPC分类号： B67D7/78

CPC分类号： B65D81/325 ,  B05C17/00513 ,  B05C17/00559 ,  B05C17/012

摘要： A double component container is revealed. The double component container includes a main material tube and a subsidiary material tube. A discharge pipe part is formed on a front end of the main material tube and a plurality of positioning ribs is disposed projectingly around an inner wall of the discharge pipe part while those positioning ribs form a ring hole that is inserted by a discharge pipe part of the subsidiary material tube. The subsidiary material tube includes a plurality of sleeves sleeved with one another and connected with the discharge pipe part. Thereby in use, the main material tube and the subsidiary material tube respectively are filled with an adhesive and a hardener and then are pressed by a push out rod of an adhesive dispenser so as to push out the adhesive mixed with the hardener. Thus fast curing of the adhesive is achieved.

摘要翻译： 揭示双组分容器。 双组分容器包括主材料管和辅助材料管。 排出管部分形成在主材料管的前端，并且多个定位肋突出地设置在排出管部分的内壁周围，而这些定位肋形成环形孔，该环孔由排出管部分的排出管部分插入 辅料管。 辅料管包括彼此套管并与排出管部分连接的多个套筒。 因此，在使用中，主材料管和辅料管分别填充有粘合剂和硬化剂，然后被粘合剂分配器的推出杆按压以推出与固化剂混合的粘合剂。 因此实现了粘合剂的快速固化。