摘要:
A numerical engineering model system is installed in a computer server and remotely operated by a local device via a network, which includes a user interface showing an operating page and receiving the numerical parameters, an analyzing module having at least one engineering model presented as the numerical parameters and a corresponding picture, a database storing the inputted numerical parameters and the picture, an engineering software means processing the inputted numerical parameters, and building, simulating and analyzing a 2D/3D model, and then storing the 2D/3D model, a simulating result and an analyzing result in the database. It is convenient for the users to remotely operate the system via any computer with network function. It simplifies the design procedures and reduces the design cost and design time because the engineering model is presented as numerical parameters and the corresponding picture. Furthermore, it is easy to understand and operate by common users without engineering knowledge.
摘要:
Disclosed is a retro-reflective type optical signal processing device and method, particularly to a device includes a set of optical mirror planes with retro-reflective type layout and configuration, and a set of micro-shutters controlled by microelectromechanical actuators, whereas the optical signals in propagation can be blocked or partially blocked in terms of the position of said a set of micro-shutters corresponding to the optical signal transmission path, thereby the method of said approach to determine the range of attenuated optical signal is a variable optical attenuation function demonstrated by present invention. Such a retro-reflective type optical signal processing device and method further comprises a set of three reflective mirrors and micro-shutters with reflective mirrors. Thereby this device has the capability to switch 2 sets of retro-reflected optical light transmission paths, the method of said approach is a demonstration of 2×2 optical switching function.
摘要:
Disclosed is an optical switch using V-beam electrothermal actuators, buckle beam springs, and movement translation mechanism with its bi-directional movable latched function for optical communication applications. In the preferred embodiments, various layout combinations of the V-beam electrothermal actuators, the buckle beam springs, a reflective mirror shutter connected to a shutter beam, and spatial joint to enable various operation approaches to realize the bi-stable switching function without external electrical load and electrical power consumption of said optical switch regarding the input optical signals transmitting toward the output channels, or the input optical signals transmitting forward to the reflective mirror shutter and then being reflected toward the output channel. The forward moving displacement generated by electrothermal V-beam actuators will move the shutter beam and reflective mirror shutter from one stable position to another stable position of the bi-stable positions of latched optical switch. The buckle beam springs exert spring force due to its natural deflection onto the shutter beam against the force from actuators, environment vibrations, and shocks, etc.; thus the optical switch performs the latch function with any external electrical load and electrical power consumption.
摘要:
An apparatus for providing a file to a target device comprises a communication controller and a processor. The processor acquires download status indicating that a portion of the file has been successfully programmed in nonvolatile memory of the target device, determines a resuming point of the file according to the acquired download status, and transmits a portion of the file from the determined resuming point to the target device via the communication controller. The portion of file is programmed in the nonvolatile memory of the target device.
摘要:
A thin film transistor (TFT) array substrate includes a substrate, a plurality of scan lines, a plurality of data lines, a plurality of thin film transistors, a plurality of pixel electrodes, and a plurality of pairs of repair pads is provided. A plurality of pixel regions are defined by the scan lines and the data lines over the substrate. The thin film transistors are disposed in the pixel regions and driven by the scan lines and the data lines. Each pixel electrode is disposed in the region, and is electrically connected to the thin film transistor. The repair pads are disposed under the data line. In addition, the repairing process includes welding the defective data line with the quasi-welding repair pad, and then forming a repair line to reconnect the defective data line.
摘要:
Electrostatically operated micro-optical devices and method of manufacturing such devices is disclosed. In a preferred embodiment, the micro-optical devices using electrostatic comb drive actuators having new spring designs to overcome side instability and exhibit enlarged displacement, having new designs of comb finger electrode shapes to generate larger force output, and having new clip type latch mechanism to control the corresponding device at certain states in an analog manner without electrical power consumption. Based on the proposed optical path and device configurations, integration and assembly of a plurality of reflective micro-mirrors in conjunction with proposed new comb drive actuators is very promising way to provide micro-optical devices to get good optical performance and suitable for multi-channel applications. We also disclose several process techniques to manufacture the micro-optical devices with said electrostatic comb drive actuator in a mass production manner with higher yield.
摘要:
A system for document classification with multiple dimensions and multiple algorithms. The system includes a preference database, a generator, and a classification unit. The preference database stores at least one classification preference. The classification preference includes a plurality of categories, each of which has a corresponding algorithm. The generator transforms the classification preference into a classification code. The classification unit executes the classification code to classify the document, thus one or several detailed catalogues corresponding to each of the categories are acquired.
摘要:
A cutter for trimming tiles comprises generally a flat rectangular base, a first trapezoidal seat pivoted to one end of the base, a second trapezoidal seat sliding about an arcuate rail perpendicular to the other end of the base, a pair rail rods extended parallel to the axis of the base and secured at their two ends into the first and second trapezoidal seats respectively so that the rail rods can laterally swing about the arcuate therewithin. A cutting tool slides about the rail rod thereon having a cylinder shaft attached with a handle and a blade rotatably secured to the center of the cutting tool. So that cutter of the present invention can trim a straight line, a beveled straight line, a curve or a circle in a tile.
摘要:
A stacked-type piezoelectric device includes a stack of piezoelectric layers, plural conductive layers, a first contact hole, a second contact hole, and plural insulating portions. The piezoelectric layers are disposed between the conductive layers. The first and second contact holes penetrate the piezoelectric layers and the conductive layers, and each of first and second contact holes is filled with a conductive material. Every insulating portion is formed at one conductive layer. Two adjacent insulating portions are respectively formed at the outer rims of the first and second contact holes, to electrically isolate the conductive layer (in which the insulating portion is formed) from the conductive material in the contact hole.
摘要:
A flip chip device made using LCD-COG (liquid crystal display-chip on glass) technique. The flip chip device comprises a substrate, at least one chip having active area with a plurality of compliant bumps thereon. The compliant bumps are centrally disposed in the center of the chip for electrically connecting the chip and the substrate. An adhesive is daubed on a joint area of the substrate and the chips for jointing the substrate and the chips. By limiting the position of the compliant bumps so that they are centrally disposed on the chips, the thermal warpage of the substrate is reduced.