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公开(公告)号：US12013749B2
公开(公告)日：2024-06-18
申请号：US17853510
申请日：2022-06-29
发明人： Hedan Zhang , Chaolun Zheng , Ning Ye , Bret Dee Winkler , Yanjun Xia , Wei Wu
CPC分类号： G06F11/0793 , G06F11/073 , G06F11/076 , G06F11/3037 , G06F11/3058 , G06F2201/81
摘要： Methods and apparatus for detecting a failed temperature sensor within a data storage device and for mitigating the loss of the sensor are provided. One such data storage device includes a non-volatile memory (NVM), a set of temperature sensors, and a processor coupled to the NVM and the temperature sensors. The processor is configured to detect failure of one of the temperature sensors and obtain temperature data from the other temperature sensors. The processor is further configured to estimate, based on the obtained temperature data, the temperature at the failed sensor, and then control at least one function of the data storage device based on the estimated temperature, such as controlling entry into a Read Only mode. In some examples, the processor estimates the temperature at the failed sensor or at various virtual sensor locations using pre-determined formulas having offsets and coefficients determined during an initial machine learning calibration procedure.
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公开(公告)号：US12068041B2
公开(公告)日：2024-08-20
申请号：US17199534
申请日：2021-03-12
发明人： Shrikar Bhagath , Dean Jenkins , Hedan Zhang , Bret Winkler , Ning Ye
IPC分类号： G11C16/30 , G06F30/367 , G06F30/392 , G06F30/398 , G06F113/18 , G06F119/02 , G06F119/06 , G06F119/08 , H01L23/367
CPC分类号： G11C16/30 , G06F30/367 , G06F30/392 , G06F30/398 , H01L23/367 , G06F2113/18 , G06F2119/02 , G06F2119/06 , G06F2119/08
摘要： A data storage device including, in one implementation, a number of memory die packages disposed on a substrate within the data storage device. Each memory die package has a die density that includes one or more memory dies. The die density of each memory die package is configured to provide an even thermal distribution across the number of memory die packages. The respective die densities of two memory of the die packages are different from each other.
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公开(公告)号：US20240004749A1
公开(公告)日：2024-01-04
申请号：US17853510
申请日：2022-06-29
发明人： Hedan Zhang , Chaolun Zheng , Ning Ye , Bret Dee Winkler , Yanjun Xia , Wei Wu
IPC分类号： G06F11/07
CPC分类号： G06F11/0793 , G06F11/076 , G06F11/073
摘要： Methods and apparatus for detecting a failed temperature sensor within a data storage device and for mitigating the loss of the sensor are provided. One such data storage device includes a non-volatile memory (NVM), a set of temperature sensors, and a processor coupled to the NVM and the temperature sensors. The processor is configured to detect failure of one of the temperature sensors and obtain temperature data from the other temperature sensors. The processor is further configured to estimate, based on the obtained temperature data, the temperature at the failed sensor, and then control at least one function of the data storage device based on the estimated temperature, such as controlling entry into a Read Only mode. In some examples, the processor estimates the temperature at the failed sensor or at various virtual sensor locations using pre-determined formulas having offsets and coefficients determined during an initial machine learning calibration procedure.
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公开(公告)号：US20220293195A1
公开(公告)日：2022-09-15
申请号：US17199534
申请日：2021-03-12
发明人： Shrikar Bhagath , Dean Jenkins , Hedan Zhang , Bret Winkler , Ning Ye
IPC分类号： G11C16/30 , G06F30/367 , G06F30/392 , H01L23/367 , G06F30/398 , G06F119/08 , G06F119/02 , G06F119/06 , G06F113/18
摘要： A data storage device including, in one implementation, a number of memory die packages disposed on a substrate within the data storage device. Each memory die package has a die density that includes one or more memory dies. The die density of each memory die package is configured to provide an even thermal distribution across the number of memory die packages. The respective die densities of two memory of the die packages are different from each other.
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