Compact device housing and assembly techniques therefor
    1.
    发明授权
    Compact device housing and assembly techniques therefor 有权
    紧凑的设备外壳及其组装技术

    公开(公告)号:US08934261B2

    公开(公告)日:2015-01-13

    申请号:US12489429

    申请日:2009-06-23

    摘要: High density electronic device assemblies and techniques for forming high density electronic device assemblies are disclosed. These assemblies and techniques can be used to form compact electronic devices. In one embodiment, substrate arrangements that include a multiple-part substrate can be used to form a high density electronic device assembly. In another embodiment, one or more clips can be used in a high density electronic device assembly to provide mechanical and electrical interconnection between electrical structures that are to be removably coupled together as parts of the high density electronic device assembly. In still another embodiment, a removable cap (and a method for forming the removable cap) can be used for an electronic device housing.

    摘要翻译: 公开了用于形成高密度电子器件组件的高密度电子器件组件和技术。 这些组件和技术可用于形成紧凑的电子设备。 在一个实施例中,包括多部分衬底的衬底布置可用于形成高密度电子器件组件。 在另一个实施例中,一个或多个夹子可用于高密度电子器件组件中,以提供电气结构之间的机械和电气互连,电气结构可以作为高密度电子器件组件的部件可拆卸地耦合在一起。 在另一个实施例中,可拆卸盖(以及用于形成可拆卸盖的方法)可用于电子设备外壳。

    Compact Device Housing and Assembly Techniques Therefor
    2.
    发明申请
    Compact Device Housing and Assembly Techniques Therefor 有权
    紧凑型设备外壳及其组装技术

    公开(公告)号:US20100159755A1

    公开(公告)日:2010-06-24

    申请号:US12489429

    申请日:2009-06-23

    摘要: High density electronic device assemblies and techniques for forming high density electronic device assemblies are disclosed. These assemblies and techniques can be used to form compact electronic devices. In one embodiment, substrate arrangements that include a multiple-part substrate can be used to form a high density electronic device assembly. In another embodiment, one or more clips can be used in a high density electronic device assembly to provide mechanical and electrical interconnection between electrical structures that are to be removably coupled together as parts of the high density electronic device assembly. In still another embodiment, a removable cap (and a method for forming the removable cap) can be used for an electronic device housing.

    摘要翻译: 公开了用于形成高密度电子器件组件的高密度电子器件组件和技术。 这些组件和技术可用于形成紧凑的电子设备。 在一个实施例中,包括多部分衬底的衬底布置可用于形成高密度电子器件组件。 在另一个实施例中,一个或多个夹子可用于高密度电子器件组件中,以提供电气结构之间的机械和电气互连,电气结构可以作为高密度电子器件组件的部件可拆卸地耦合在一起。 在另一个实施例中,可拆卸盖(以及用于形成可拆卸盖的方法)可用于电子设备外壳。

    COMPACT DEVICE HOUSING AND ASSEMBLY TECHNIQUES THEREFOR
    3.
    发明申请
    COMPACT DEVICE HOUSING AND ASSEMBLY TECHNIQUES THEREFOR 审中-公开
    紧凑的设备外壳及其组装技术

    公开(公告)号:US20120155041A1

    公开(公告)日:2012-06-21

    申请号:US13407625

    申请日:2012-02-28

    IPC分类号: H05K5/00 H05K13/04

    摘要: High density electronic device assemblies and techniques for forming high density electronic device assemblies are disclosed. These assemblies and techniques can be used to form compact electronic devices, such as portable power adapters. In one embodiment, substrate arrangements that include a multiple-part substrate can be used to form a high density electronic device assembly. In another embodiment, one or more clips can be used in a high density electronic device assembly to provide mechanical and electrical interconnection between electrical structures that are to be removably coupled together as parts of the high density electronic device assembly. In still another embodiment, a removable cap (and a method for forming the removable cap) can be used for an electronic device housing.

    摘要翻译: 公开了用于形成高密度电子器件组件的高密度电子器件组件和技术。 这些组件和技术可用于形成诸如便携式电源适配器之类的紧凑型电子设备。 在一个实施例中,包括多部分衬底的衬底布置可用于形成高密度电子器件组件。 在另一个实施例中,一个或多个夹子可用于高密度电子器件组件中,以提供电气结构之间的机械和电气互连,电气结构可以作为高密度电子器件组件的部件可拆卸地耦合在一起。 在另一个实施例中,可拆卸盖(以及用于形成可拆卸盖的方法)可用于电子设备外壳。

    1,3,8-Triazaspiro[4.5]decan-4-one derivatives useful for the treatment of ORL-1 receptor mediated disorders
    5.
    发明授权
    1,3,8-Triazaspiro[4.5]decan-4-one derivatives useful for the treatment of ORL-1 receptor mediated disorders 有权
    可用于治疗ORL-1受体介导的疾病的1,3,8-三氮杂螺[4.5]癸-4-酮衍生物

    公开(公告)号:US06777421B2

    公开(公告)日:2004-08-17

    申请号:US10117674

    申请日:2002-04-05

    IPC分类号: A61K314353

    CPC分类号: C07D471/10

    摘要: The present invention is directed to novel 1,3,8-triazaspiro[4.5]decan-4-one derivatives of the general formula wherein all variables are as defined herein, useful in the treatment of disorders and conditions mediated by the ORL-1 G-protein coupled receptor. More particularly, the compounds of the present invention are useful in the treatment of disorders and conditions such as anxiety, depression, substance abuse, neuropathic pain, acute pain, migraine, asthma, cough and for improved cognition.

    摘要翻译: 本发明涉及一般形式的新的1,3,8-三氮杂螺[4.5]癸-4-酮衍生物,所有变量如本文所定义,可用于治疗由ORL-1 G- 蛋白偶联受体。 更具体地,本发明的化合物可用于治疗诸如焦虑,抑郁,药物滥用,神经性疼痛,急性疼痛,偏头痛,哮喘,咳嗽和改善认知的病症和病症。