Compact device housing and assembly techniques therefor
    3.
    发明授权
    Compact device housing and assembly techniques therefor 有权
    紧凑的设备外壳及其组装技术

    公开(公告)号:US08934261B2

    公开(公告)日:2015-01-13

    申请号:US12489429

    申请日:2009-06-23

    摘要: High density electronic device assemblies and techniques for forming high density electronic device assemblies are disclosed. These assemblies and techniques can be used to form compact electronic devices. In one embodiment, substrate arrangements that include a multiple-part substrate can be used to form a high density electronic device assembly. In another embodiment, one or more clips can be used in a high density electronic device assembly to provide mechanical and electrical interconnection between electrical structures that are to be removably coupled together as parts of the high density electronic device assembly. In still another embodiment, a removable cap (and a method for forming the removable cap) can be used for an electronic device housing.

    摘要翻译: 公开了用于形成高密度电子器件组件的高密度电子器件组件和技术。 这些组件和技术可用于形成紧凑的电子设备。 在一个实施例中,包括多部分衬底的衬底布置可用于形成高密度电子器件组件。 在另一个实施例中,一个或多个夹子可用于高密度电子器件组件中,以提供电气结构之间的机械和电气互连,电气结构可以作为高密度电子器件组件的部件可拆卸地耦合在一起。 在另一个实施例中,可拆卸盖(以及用于形成可拆卸盖的方法)可用于电子设备外壳。

    COMPACT DEVICE HOUSING AND ASSEMBLY TECHNIQUES THEREFOR
    8.
    发明申请
    COMPACT DEVICE HOUSING AND ASSEMBLY TECHNIQUES THEREFOR 审中-公开
    紧凑的设备外壳及其组装技术

    公开(公告)号:US20120155041A1

    公开(公告)日:2012-06-21

    申请号:US13407625

    申请日:2012-02-28

    IPC分类号: H05K5/00 H05K13/04

    摘要: High density electronic device assemblies and techniques for forming high density electronic device assemblies are disclosed. These assemblies and techniques can be used to form compact electronic devices, such as portable power adapters. In one embodiment, substrate arrangements that include a multiple-part substrate can be used to form a high density electronic device assembly. In another embodiment, one or more clips can be used in a high density electronic device assembly to provide mechanical and electrical interconnection between electrical structures that are to be removably coupled together as parts of the high density electronic device assembly. In still another embodiment, a removable cap (and a method for forming the removable cap) can be used for an electronic device housing.

    摘要翻译: 公开了用于形成高密度电子器件组件的高密度电子器件组件和技术。 这些组件和技术可用于形成诸如便携式电源适配器之类的紧凑型电子设备。 在一个实施例中,包括多部分衬底的衬底布置可用于形成高密度电子器件组件。 在另一个实施例中,一个或多个夹子可用于高密度电子器件组件中,以提供电气结构之间的机械和电气互连,电气结构可以作为高密度电子器件组件的部件可拆卸地耦合在一起。 在另一个实施例中,可拆卸盖(以及用于形成可拆卸盖的方法)可用于电子设备外壳。